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1 - 10 of 28 results
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1N5614US
Microsemi Corporation
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$5.6512 | No | No | Transferred | 1 A | 2 µs | SILICON | RECTIFIER DIODE | SINGLE | YES | 200 V | 1 | AVALANCHE | HIGH RELIABILITY | 1 | Not Qualified | O-LELF-R2 | e0 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS, D-5A, 2 PIN | 2 | not_compliant | EAR99 | 8541.10.00.80 | Microsemi Corporation | |||||
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1N5614US
Microchip Technology Inc
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$5.9932 | No | Active | 1 A | 2 µs | SILICON | RECTIFIER DIODE | SINGLE | YES | 200 V | 1 | AVALANCHE | HIGH RELIABILITY | 1 | Not Qualified | O-LELF-R2 | e0 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, D-5A, 2 PIN | compliant | Microchip | |||||||||
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JAN1N5614US
Microchip Technology Inc
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$8.7643 | No | Active | 1 A | 1.3 V | 2 µs | SILICON | RECTIFIER DIODE | SINGLE | YES | 200 V | 1 | METALLURGICALLY BONDED | 1 | Qualified | O-LELF-R2 | e0 | MIL-19500/427K | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||||
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JAN1N5614US
Microsemi Corporation
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$9.6459 | No | No | Transferred | 1 A | 1.3 V | 2 µs | SILICON | RECTIFIER DIODE | SINGLE | YES | 200 V | 1 | METALLURGICALLY BONDED | 1 | Not Qualified | O-LELF-R2 | e0 | MIL-19500/427K | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | 2 | unknown | EAR99 | 8541.10.00.80 | Microsemi Corporation | |||
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JANTX1N5614US
Microchip Technology Inc
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$9.6855 | No | Active | 1 A | 2 µs | SILICON | RECTIFIER DIODE | SINGLE | YES | 1 | METALLURGICALLY BONDED | 1 | Qualified | O-LELF-R2 | e0 | MIL-19500/427K | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | |||||||||||
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JANTX1N5614US/TR
Microchip Technology Inc
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$9.7555 | Active | 1 A | 2 µs | SILICON | RECTIFIER DIODE | SINGLE | YES | 1 | METALLURGICALLY BONDED | 1 | Qualified | O-LELF-R2 | e0 | MIL-19500/427K | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.80 | |||||||||||
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JANTX1N5614US
Microsemi Corporation
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$10.2323 | No | No | Transferred | 1 A | 2 µs | SILICON | RECTIFIER DIODE | SINGLE | YES | 1 | METALLURGICALLY BONDED | 1 | Not Qualified | O-LELF-R2 | e0 | MIL-19500/427K | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | 2 | unknown | EAR99 | 8541.10.00.80 | Microsemi Corporation | ||||||
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JANTXV1N5614US
Microchip Technology Inc
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$10.4654 | No | Active | 1 A | 2 µs | SILICON | RECTIFIER DIODE | SINGLE | YES | 1 | METALLURGICALLY BONDED | 1 | Qualified | O-LELF-R2 | e0 | MIL-19500/427K | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | Microchip | ||||||||||
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JANTXV1N5614US
Microsemi Corporation
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$11.2526 | No | No | Transferred | 1 A | 2 µs | SILICON | RECTIFIER DIODE | SINGLE | YES | 1 | METALLURGICALLY BONDED | 1 | Not Qualified | O-LELF-R2 | e0 | MIL-19500/427K | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | 2 | unknown | EAR99 | 8541.10.00.80 | Microsemi Corporation | ||||||
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JANS1N5614US
Microchip Technology Inc
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$44.0277 | No | Active | 1 A | 2 µs | SILICON | RECTIFIER DIODE | SINGLE | YES | 1 | METALLURGICALLY BONDED | 1 | Qualified | O-LELF-R2 | e0 | MIL-19500/427K | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant |