Parametric results for: 1N5544C under Zener Diodes
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JAN1N5544C-1
Microchip Technology Inc
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$11.3760 | No | Active | 1 mA | 500 mW | 28 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 2 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | |||||||||||
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JAN1N5544C-1
Microsemi Corporation
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$13.8414 | No | No | Transferred | 1 mA | 500 mW | 28 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 2 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS, DO-35, 2 PIN | unknown | DO-7 | 2 | EAR99 | 8541.10.00.50 | ||||||
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JANTX1N5544C-1
Microsemi Corporation
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$19.1199 | No | No | Transferred | 1 mA | 500 mW | 28 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 2 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS, DO-35, 2 PIN | unknown | DO-7 | 2 | EAR99 | 8541.10.00.50 | ||||||
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JANTX1N5544C-1
Microchip Technology Inc
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$20.1253 | No | Active | 1 mA | 500 mW | 28 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 2 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | |||||||||||
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JANTX1N5544C-1/TR
Microchip Technology Inc
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$20.2766 | No | Active | 1 mA | 10 nA | 500 mW | 28 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICAL BONDED | 100 Ω | 25.2 V | 2 % | O-LALF-W2 | e0 | MIL-PRF-19500; MIL-STD-750 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | unknown | |||||||||
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JANTXV1N5544C-1
Microsemi Corporation
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$21.2589 | No | No | Transferred | 1 mA | 500 mW | 28 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 2 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS, DO-35, 2 PIN | unknown | DO-7 | 2 | EAR99 | 8541.10.00.50 | ||||||
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JANTXV1N5544C-1
Microchip Technology Inc
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$24.0768 | No | Active | 1 mA | 500 mW | 28 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 2 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | |||||||||||
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JAN1N5544CUR-1
Microchip Technology Inc
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$29.7894 | No | Active | 1 mA | 500 mW | 28 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | AVALANCHE | METALLURGICALLY BONDED | 100 Ω | 2 % | Qualified | R-LELF-R2 | e0 | MIL-19500 | DO-213AA | 200 °C | -65 °C | ISOLATED | 2 | GLASS | RECTANGULAR | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, MLL34, MELF-2 | compliant | ||||||||||
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JAN1N5544CUR-1
Microsemi Corporation
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$31.2887 | No | No | Transferred | 1 mA | 500 mW | 28 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | AVALANCHE | METALLURGICALLY BONDED | 100 Ω | 2 % | Not Qualified | R-LELF-R2 | e0 | MIL-19500 | DO-213AA | 200 °C | -65 °C | ISOLATED | 2 | GLASS | RECTANGULAR | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS, MLL34, MELF-2 | unknown | DO-213AA | 2 | EAR99 | 8541.10.00.50 | |||||
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JANTX1N5544CUR-1
Microsemi Corporation
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$34.3776 | No | No | Transferred | 1 mA | 500 mW | 28 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 2 % | Not Qualified | O-LELF-R2 | e0 | MIL-19500 | DO-213AA | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS, MLL34, MELF-2 | unknown | DO-213AA | 2 | EAR99 | 8541.10.00.50 |