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JAN1N5534D-1
Microchip Technology Inc
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$18.2025 | No | Active | 1 mA | 500 mW | 14 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | |||||||||||
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JAN1N5534D-1/TR
Microchip Technology Inc
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$18.3728 | No | Active | 1 mA | 10 nA | 500 mW | 14 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICAL BONDED | 100 Ω | 12.6 V | 1 % | O-LALF-W2 | e0 | MIL-PRF-19500; MIL-STD-750 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | unknown | ||||||||||
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JANTX1N5534D-1
Microchip Technology Inc
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$24.5350 | No | Active | 1 mA | 500 mW | 14 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | ||||||||||||
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JANTX1N5534D-1/TR
Microchip Technology Inc
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$24.6951 | No | Active | 1 mA | 10 nA | 500 mW | 14 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICAL BONDED | 100 Ω | 12.6 V | 1 % | O-LALF-W2 | e0 | MIL-PRF-19500; MIL-STD-750 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | unknown | ||||||||||
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JANTXV1N5534D-1
Microchip Technology Inc
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$30.0978 | No | Active | 1 mA | 500 mW | 14 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | ||||||||||||
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JAN1N5534D-1
Cobham PLC
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Check for Price | Transferred | 1 µA | 500 mW | 14 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 1 % | Not Qualified | O-PALF-W2 | e0 | MIL-19500/437 | DO-35 | ISOLATED | 2 | PLASTIC/EPOXY | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | COBHAM PLC | HERMETIC SEALED PACKAGE-2 | unknown | EAR99 | 8541.10.00.50 | ||||||||||||||
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JAN1N5534D-1
Microsemi Corporation
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Check for Price | No | Transferred | 1 mA | 500 mW | 14 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-204AH | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS, DO-35, 2 PIN | unknown | |||||||||||
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JANTX1N5534D-1
Cobham Semiconductor Solutions
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Check for Price | Transferred | 1 µA | 500 mW | 14 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 1 % | Not Qualified | O-PALF-W2 | e0 | MIL-19500/437 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | PLASTIC/EPOXY | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | AEROFLEX/METELICS INC | HERMETIC SEALED PACKAGE-2 | unknown | EAR99 | 8541.10.00.50 | DO-35 | 2 | ||||||||||
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JAN1N5534D-1
Compensated Devices Inc
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Check for Price | Obsolete | 1 mA | 500 mW | 14 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1 % | Not Qualified | O-XALF-W2 | MIL-19500/437E | DO-35 | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | WIRE | AXIAL | COMPENSATED DEVICES INC | DO-7, 2 PIN | unknown | |||||||||||||||||
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JAN1N5534D-1
VPT Components
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Check for Price | No | Active | 1 mA | 500 mW | 14 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1 % | Qualified | O-LALF-W2 | MIL-19500 | DO-35 | 175 °C | -65 °C | NOT SPECIFIED | NOT SPECIFIED | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | VPT COMPONENTS | compliant | EAR99 | 8541.10.00.50 |