Filter Your Search
1 - 10 of 24 results
Select Parts | Part Number |
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1N4996US
Microchip Technology Inc
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JANTX1N4996US
Bkc Semiconductors Inc
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JAN1N4996US
Microchip Technology Inc
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1N4996US
Sensitron Semiconductors
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JANS1N4996US
Microchip Technology Inc
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JAN1N4996US
Microsemi Corporation
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JANS1N4996US
Defense Logistics Agency
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JANS1N4996US
Bkc Semiconductors Inc
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JANTX1N4996US
Microsemi Corporation
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JANTX1N4996US
Microchip Technology Inc
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Most Relevant | Technical | Compliance | Operating Conditions | Physical | Other | |||||||||||||||||||||||||||||||||||
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Composite Price
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Pbfree Code
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Rohs Code
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Part Life Cycle Code
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Working Test Current
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Power Dissipation-Max
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Reference Voltage-Nom
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Diode Element Material
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Diode Type | Polarity | Configuration |
Surface Mount
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Number of Elements | Technology |
Additional Feature
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Dynamic Impedance-Max
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Voltage Tol-Max
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Qualification Status
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JESD-30 Code
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JESD-609 Code
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Reference Standard
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Operating Temperature-Max
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Peak Reflow Temperature (Cel)
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Time@Peak Reflow Temperature-Max (s)
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Case Connection
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Number of Terminals
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Package Body Material
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Package Shape
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Package Style
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Terminal Finish
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Terminal Form
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Terminal Position
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Ihs Manufacturer
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Reach Compliance Code
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Samacsys Manufacturer
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Part Package Code
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Package Description
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Pin Count
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ECCN Code
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HTS Code
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No | Active | 3 mA | 5 W | 390 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | HIGH RELIABILITY | 5 % | Not Qualified | O-LELF-R2 | e0 | ISOLATED | 2 | GLASS | RECTANGULAR | FLANGE MOUNT | TIN LEAD | SOLDER LUG | UPPER | MICROCHIP TECHNOLOGY INC | compliant | Microchip | ||||||||||||
Transferred | 3 mA | 5 W | 390 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Not Qualified | O-LELF-R2 | MIL-19500/356 | ISOLATED | 2 | METAL | ROUND | LONG FORM | WRAP AROUND | END | BKC SEMICONDUCTORS INC | unknown | ||||||||||||||||
No | Active | 3 mA | 5 W | 390 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/356H | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | |||||||||||||
No | No | Active | 3 mA | 5 W | 390 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 1.8 kΩ | Not Qualified | O-LELF-R2 | e0 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | SENSITRON SEMICONDUCTOR | compliant | MELF | HREMETIC SEALED, GLASS, MELF-2 | 2 | EAR99 | 8541.10.00.50 | |||||||
No | Active | 3 mA | 5 W | 390 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/356 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | ||||||||||||
No | Transferred | 3 mA | 5 W | 390 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Not Qualified | O-LELF-R2 | e0 | MIL-19500/356H | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WRAP AROUND | END | MICROSEMI CORP | not_compliant | HERMETIC SEALED, GLASS PACKAGE-2 | 2 | EAR99 | 8541.10.00.50 | |||||||||
Active | 3 mA | 5 W | 390 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/356 | NOT SPECIFIED | NOT SPECIFIED | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | DEFENSE LOGISTICS AGENCY | unknown | HERMETIC SEALED, GLASS, D-5B, 2 PIN | ||||||||||
Transferred | 3 mA | 5 W | 390 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Not Qualified | O-LELF-R2 | MIL-19500/356 | ISOLATED | 2 | METAL | ROUND | LONG FORM | WRAP AROUND | END | BKC SEMICONDUCTORS INC | unknown | ||||||||||||||||
No | Transferred | 3 mA | 5 W | 390 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Not Qualified | O-LELF-R2 | e0 | MIL-19500/356H | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WRAP AROUND | END | MICROSEMI CORP | not_compliant | Microsemi Corporation | HERMETIC SEALED, GLASS PACKAGE-2 | 2 | EAR99 | 8541.10.00.50 | ||||||||
No | Active | 3 mA | 5 W | 390 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/356H | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant |
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1N4996US
Microchip Technology Inc
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$60.2345 Buy | No | Active | 3 mA | 5 W | 390 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | HIGH RELIABILITY | 5 % | Not Qualified | O-LELF-R2 | e0 | ISOLATED | 2 | GLASS | RECTANGULAR | FLANGE MOUNT | TIN LEAD | SOLDER LUG | UPPER | MICROCHIP TECHNOLOGY INC | compliant | Microchip | |||||||||||||
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JANTX1N4996US
Bkc Semiconductors Inc
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Check for Price Buy | Transferred | 3 mA | 5 W | 390 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Not Qualified | O-LELF-R2 | MIL-19500/356 | ISOLATED | 2 | METAL | ROUND | LONG FORM | WRAP AROUND | END | BKC SEMICONDUCTORS INC | unknown | |||||||||||||||||
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JAN1N4996US
Microchip Technology Inc
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Check for Price Buy | No | Active | 3 mA | 5 W | 390 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/356H | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | ||||||||||||||
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1N4996US
Sensitron Semiconductors
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Check for Price Buy | No | No | Active | 3 mA | 5 W | 390 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 1.8 kΩ | Not Qualified | O-LELF-R2 | e0 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | SENSITRON SEMICONDUCTOR | compliant | MELF | HREMETIC SEALED, GLASS, MELF-2 | 2 | EAR99 | 8541.10.00.50 | ||||||||
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JANS1N4996US
Microchip Technology Inc
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Check for Price Buy | No | Active | 3 mA | 5 W | 390 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/356 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | |||||||||||||
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JAN1N4996US
Microsemi Corporation
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Check for Price Buy | No | Transferred | 3 mA | 5 W | 390 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Not Qualified | O-LELF-R2 | e0 | MIL-19500/356H | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WRAP AROUND | END | MICROSEMI CORP | not_compliant | HERMETIC SEALED, GLASS PACKAGE-2 | 2 | EAR99 | 8541.10.00.50 | ||||||||||
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JANS1N4996US
Defense Logistics Agency
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Check for Price Buy | Active | 3 mA | 5 W | 390 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/356 | NOT SPECIFIED | NOT SPECIFIED | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | DEFENSE LOGISTICS AGENCY | unknown | HERMETIC SEALED, GLASS, D-5B, 2 PIN | |||||||||||
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JANS1N4996US
Bkc Semiconductors Inc
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Check for Price Buy | Transferred | 3 mA | 5 W | 390 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Not Qualified | O-LELF-R2 | MIL-19500/356 | ISOLATED | 2 | METAL | ROUND | LONG FORM | WRAP AROUND | END | BKC SEMICONDUCTORS INC | unknown | |||||||||||||||||
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JANTX1N4996US
Microsemi Corporation
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Check for Price Buy | No | Transferred | 3 mA | 5 W | 390 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Not Qualified | O-LELF-R2 | e0 | MIL-19500/356H | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WRAP AROUND | END | MICROSEMI CORP | not_compliant | Microsemi Corporation | HERMETIC SEALED, GLASS PACKAGE-2 | 2 | EAR99 | 8541.10.00.50 | |||||||||
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JANTX1N4996US
Microchip Technology Inc
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Check for Price Buy | No | Active | 3 mA | 5 W | 390 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/356H | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant |