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1N4385GP-E3/54
Vishay Semiconductors
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$0.1871 | Yes | Not Recommended | 1 A | 1 V | 2 µs | SILICON | RECTIFIER DIODE | SINGLE | NO | 600 V | 1 | FREE WHEELING DIODE, HIGH RELIABILITY | 50 A | 1 | Not Qualified | O-PALF-W2 | e3 | DO-204AC | 175 °C | -65 °C | ISOLATED | 2 | PLASTIC/EPOXY | ROUND | LONG FORM | MATTE TIN | WIRE | AXIAL | VISHAY SEMICONDUCTORS | DO-15 | O-PALF-W2 | 2 | unknown | EAR99 | 8541.10.00.80 | Vishay | |||||||||||
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1N4384GP-E3/54
Vishay Intertechnologies
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$0.2913 | Yes | Not Recommended | 1 A | 1 V | 2 µs | SILICON | RECTIFIER DIODE | SINGLE | NO | 400 V | 1 | FREE WHEELING DIODE, HIGH RELIABILITY | 50 A | 1 | Not Qualified | O-PALF-W2 | e3 | DO-204AC | 175 °C | -65 °C | ISOLATED | 2 | PLASTIC/EPOXY | ROUND | LONG FORM | MATTE TIN | WIRE | AXIAL | VISHAY INTERTECHNOLOGY INC | compliant | Vishay | ||||||||||||||||
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1N4370
Microsemi Corporation
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$2.2339 | No | Transferred | 20 mA | 500 mW | 2.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 30 Ω | 10 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | 1 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | Microsemi Corporation | ||||||||||||||
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1N4370A
Microsemi Corporation
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$2.4711 | No | Transferred | 20 mA | 500 mW | 2.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 30 Ω | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | 1 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-7 | HERMETIC SEALED, GLASS PACKAGE-2 | 2 | compliant | EAR99 | 8541.10.00.50 | Microsemi Corporation | |||||||||
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1N4370A-1
Microchip Technology Inc
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$2.5703 | No | Active | 20 mA | 500 mW | 2.4 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||||||||||||
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1N4371A
Microsemi Corporation
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$2.7195 | No | Transferred | 20 mA | 500 mW | 2.7 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 30 Ω | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | 1 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-7 | HERMETIC SEALED, GLASS PACKAGE-2 | 2 | unknown | EAR99 | 8541.10.00.50 | Microsemi Corporation | ||||||||||
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1N4371A-1
Microchip Technology Inc
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$2.7217 | No | Active | 20 mA | 500 mW | 2.7 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | Microchip | |||||||||||||||
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1N4372A
Microsemi Corporation
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$2.7778 | No | Transferred | 20 mA | 500 mW | 3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 29 Ω | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | 1 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-7 | HERMETIC SEALED, GLASS PACKAGE-2 | 2 | unknown | EAR99 | 8541.10.00.50 | Microsemi Corporation | ||||||||||
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1N4372
Microchip Technology Inc
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$3.1903 | No | Active | 20 mA | 500 mW | 3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 29 Ω | 10 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | 1 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | Microchip | ||||||||||||||
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1N4371
Microsemi Corporation
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$5.0153 | No | Transferred | 20 mA | 500 mW | 2.7 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 30 Ω | 10 % | Not Qualified | O-LALF-W2 | e0 | DO-35 | 1 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | Microsemi Corporation |