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1N4101-1
Microchip Technology Inc
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$2.7217 | No | Active | 250 µA | 480 mW | 8.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/435F | DO-204AH | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, DO-35, 2 PIN | compliant | ||||||||||
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JAN1N4101-1
Microchip Technology Inc
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$4.2379 | No | Active | 250 µA | 500 mW | 8.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-XALF-W2 | e0 | MIL-19500/435F | DO-35 | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-7, 2 PIN | compliant | |||||||||||
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JAN1N4101-1
Microsemi Corporation
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$5.3279 | No | No | Transferred | 250 µA | 500 mW | 8.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-XALF-W2 | e0 | MIL-19500/435F | DO-35 | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-7, 2 PIN | unknown | DO-7 | 2 | EAR99 | 8541.10.00.50 | Microsemi Corporation | |||||
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JANTX1N4101-1
Cobham Semiconductor Solutions
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$5.6563 | Transferred | 250 µA | 500 mW | 8.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | LOW NOISE | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500/435 | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | AEROFLEX/METELICS INC | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | DO-35 | 2 | EAR99 | 8541.10.00.50 | ||||||||
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JANTX1N4101-1
MACOM
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$5.7031 | Transferred | 250 µA | 500 mW | 8.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | LOW NOISE, METALLURGICALLY BONDED | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | M/A-COM TECHNOLOGY SOLUTIONS INC | compliant | EAR99 | 8541.10.00.50 | MACOM | ||||||||
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JANTX1N4101-1
Microsemi Corporation
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$7.2335 | No | No | Transferred | 250 µA | 500 mW | 8.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-XALF-W2 | e0 | MIL-19500/435F | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-7, 2 PIN | unknown | DO-7 | 2 | EAR99 | 8541.10.00.50 | Microsemi Corporation | |||
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JANTXV1N4101-1
MACOM
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$9.4801 | Transferred | 250 µA | 500 mW | 8.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | LOW NOISE, METALLURGICALLY BONDED | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | M/A-COM TECHNOLOGY SOLUTIONS INC | compliant | EAR99 | 8541.10.00.50 | |||||||||
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JANTX1N4101-1
Microchip Technology Inc
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$9.5092 | No | Active | 250 µA | 500 mW | 8.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-XALF-W2 | e0 | MIL-19500/435F | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-7, 2 PIN | compliant | |||||||||
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JANTXV1N4101-1
Microsemi Corporation
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$10.8910 | No | No | Transferred | 250 µA | 500 mW | 8.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-XALF-W2 | e0 | MIL-19500/435F | DO-35 | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-7, 2 PIN | unknown | DO-7 | 2 | EAR99 | 8541.10.00.50 | Microsemi Corporation | |||||
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JANTXV1N4101-1
Microchip Technology Inc
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$11.5560 | No | Active | 250 µA | 500 mW | 8.2 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-XALF-W2 | e0 | MIL-19500/435F | DO-35 | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-7, 2 PIN | compliant |