Parametric results for: 1N3041 under Zener Diodes
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1N3041B-1
Microsemi Corporation
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$7.2261 | No | No | Transferred | 3.3 mA | 1 W | 75 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 175 Ω | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-41 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-41 | HERMETIC SEALED, GLASS PACKAGE-1 | 1 | unknown | EAR99 | 8541.10.00.50 | |||||
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1N3041B-1
Microchip Technology Inc
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$8.4387 | No | Active | 3.3 mA | 1 W | 75 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 175 Ω | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-41 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-1 | compliant | ||||||||||
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1N3041B-1E3
Microchip Technology Inc
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$8.6443 | Yes | Active | 3.3 mA | 1 W | 75 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 175 Ω | 5 % | O-LALF-W2 | DO-41 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Pure Matte Tin (Sn) | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-1 | compliant | ||||||||||||
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JAN1N3041B-1
Microsemi Corporation
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$9.2334 | No | No | Transferred | 3.3 mA | 1 W | 75 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-XALF-W2 | e0 | MIL-19500/115K | DO-41 | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-41, 2 PIN | not_compliant | EAR99 | 8541.10.00.50 | ||||||||
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JAN1N3041B-1
Microchip Technology Inc
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$9.5528 | No | Active | 3.3 mA | 1 W | 75 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-XALF-W2 | e0 | MIL-19500/115K | DO-41 | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-41, 2 PIN | compliant | |||||||||||
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1N3041BUR-1
Microsemi Corporation
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$9.5676 | No | Transferred | 3.3 mA | 1 W | 75 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 175 Ω | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AB | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | HERMETIC SEALED, GLASS, LL41, MELF-2 | unknown | ||||||||||
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JANTX1N3041B-1
Microchip Technology Inc
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$10.3704 | No | Active | 3.3 mA | 1 W | 75 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-XALF-W2 | e0 | MIL-19500/115K | DO-41 | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-41, 2 PIN | compliant | |||||||||||
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JANTX1N3041B-1
Microsemi Corporation
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$10.7525 | No | No | Transferred | 3.3 mA | 1 W | 75 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-XALF-W2 | e0 | MIL-19500/115K | DO-41 | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-41, 2 PIN | unknown | EAR99 | 8541.10.00.50 | Microsemi Corporation | |||||||
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JANTXV1N3041B-1
Microchip Technology Inc
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$12.2558 | No | Active | 3.3 mA | 1 W | 75 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-XALF-W2 | e0 | MIL-19500/115K | DO-41 | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-41, 2 PIN | compliant | |||||||||||
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JAN1N3041BUR-1
Microchip Technology Inc
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$13.1164 | No | Active | 3.3 mA | 1 W | 75 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/115K | DO-213AB | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | DO-213AB, 2 PIN | compliant |