Parametric results for: 1N3019B under Zener Diodes
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JAN1N3019B-1
Microchip Technology Inc
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$7.8802 | No | Active | 28 mA | 1 W | 9.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-XALF-W2 | e0 | MIL-19500/115K | DO-41 | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-41, 2 PIN | compliant | ||||||||||
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1N3019B-1
Microchip Technology Inc
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$8.4387 | No | Active | 28 mA | 1 W | 9.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 Ω | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-41 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-1 | compliant | |||||||||
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JANTX1N3019B-1
Microchip Technology Inc
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$10.2848 | No | Active | 28 mA | 1 W | 9.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-XALF-W2 | e0 | MIL-19500/115K | DO-41 | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-41, 2 PIN | compliant | ||||||||||
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JANTXV1N3019B-1
Microchip Technology Inc
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$12.2558 | No | Active | 28 mA | 1 W | 9.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-XALF-W2 | e0 | MIL-19500/115K | DO-41 | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-41, 2 PIN | compliant | ||||||||||
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JAN1N3019BUR-1
Microchip Technology Inc
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$13.1164 | No | Active | 28 mA | 1 W | 9.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/115K | DO-213AB | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | DO-213AB, 2 PIN | compliant | |||||||||
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JANTX1N3019BUR-1
Microchip Technology Inc
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$15.0346 | No | Active | 28 mA | 1 W | 9.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/115K | DO-213AB | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | DO-213AB, 2 PIN | compliant | |||||||||
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1N3019BUR-1
Microchip Technology Inc
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$15.1675 | No | Active | 28 mA | 1 W | 9.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 Ω | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AB | 1 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, LL41, MELF-2 | compliant | ||||||||
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JANTXV1N3019BUR-1
Microchip Technology Inc
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$18.5698 | No | Active | 28 mA | 1 W | 9.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500/115K | DO-213AB | 1 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | DO-213AB, 2 PIN | compliant | |||||||||
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JANHC1N3019B
Microsemi Corporation
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Check for Price | Obsolete | 28 mA | 1 W | 9.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Not Qualified | S-XUUC-N1 | e0 | MIL-19500/115 | 1 | UNSPECIFIED | SQUARE | UNCASED CHIP | TIN LEAD | NO LEAD | UPPER | MICROSEMI CORP | S-XUUC-N1 | compliant | DIE | 1 | EAR99 | 8541.10.00.50 | ||||||||||
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MV1N3019BUR-1E3
Microsemi Corporation
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Check for Price | Yes | Obsolete | 28 mA | 1.25 W | 9.1 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED, HIGH RELIABILITY | 5 % | Not Qualified | O-LELF-R2 | e3 | DO-213AB | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | MATTE TIN | WRAP AROUND | END | MICROSEMI CORP | O-LELF-R2 | unknown | DO-213AB | 2 | EAR99 | 8541.10.00.50 |