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1N3016B-1
Microsemi Corporation
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$7.2261 | No | No | Transferred | 37 mA | 1 W | 6.8 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 3.5 Ω | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-41 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-41 | HERMETIC SEALED, GLASS PACKAGE-1 | 1 | unknown | EAR99 | 8541.10.00.50 | ||||
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1N3016B-1E3
Microsemi Corporation
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$7.4204 | Yes | Transferred | 37 mA | 1 W | 6.8 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 3.5 Ω | 5 % | O-LALF-W2 | DO-41 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | PURE MATTE TIN | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-1 | compliant | EAR99 | 8541.10.00.50 | |||||||||
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1N3016B-1
Microchip Technology Inc
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$8.4387 | No | Active | 37 mA | 1 W | 6.8 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 3.5 Ω | 5 % | Not Qualified | O-LALF-W2 | e0 | DO-41 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-1 | compliant | |||||||||
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1N3016B-1E3
Microchip Technology Inc
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$8.6443 | Yes | Active | 37 mA | 1 W | 6.8 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 3.5 Ω | 5 % | O-LALF-W2 | DO-41 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Pure Matte Tin (Sn) | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-1 | compliant | |||||||||||
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1N3016BUR-1
Microsemi Corporation
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$8.6829 | No | No | Transferred | 37 mA | 1 W | 6.8 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 3.5 Ω | 5 % | Not Qualified | O-LELF-R2 | e0 | DO-213AB | 1 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | DO-213AB | HERMETIC SEALED, GLASS, LL41, MELF-2 | 2 | not_compliant | EAR99 | 8541.10.00.50 | |||
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JAN1N3016B-1
Microsemi Corporation
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$9.2334 | No | No | Transferred | 37 mA | 1 W | 6.8 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-XALF-W2 | e0 | MIL-19500/115K | DO-41 | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-41 | DO-41, 2 PIN | 2 | not_compliant | EAR99 | 8541.10.00.50 | |||||
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JAN1N3016B-1
Microchip Technology Inc
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$9.5528 | No | Active | 37 mA | 1 W | 6.8 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-XALF-W2 | e0 | MIL-19500/115K | DO-41 | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-41, 2 PIN | compliant | ||||||||||
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JAN1N3016B-1/TR
Microchip Technology Inc
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$9.7042 | Active | 37 mA | 1 W | 6.8 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-XALF-W2 | e0 | MIL-19500/115K | DO-41 | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.50 | ||||||||||
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JANTX1N3016B-1
Microchip Technology Inc
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$10.2848 | No | Active | 37 mA | 1 W | 6.8 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-XALF-W2 | e0 | MIL-19500/115K | DO-41 | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-41, 2 PIN | compliant | ||||||||||
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JANTX1N3016B-1
Microsemi Corporation
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$10.7525 | No | No | Transferred | 37 mA | 1 W | 6.8 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Not Qualified | O-XALF-W2 | e0 | MIL-19500/115K | DO-41 | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | DO-41, 2 PIN | unknown | EAR99 | 8541.10.00.50 |