Parametric results for: 11fs2 under Sockets and Chip Carriers

All Filters Additional Feature Body Breadth Body Depth Body Length Contact Configuration Contact Finish Mating Contact Finish Termination Contact Material Contact Style Current Rating Device Socket Type Device Type Used On Dielectric Withstanding Voltage Housing Material Insulation Resistance JESD-609 Code Manufacturer Mating Contact Pitch Mounting Style Number of Contacts Operating Temperature-Max Operating Temperature-Min PCB Contact Pattern PCB Contact Row Spacing Part Life Cycle Code Rohs Code Terminal Pitch Termination Type

2.5 OZ. AVG. INSERTION FORCE 45

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1.3 inch 15 1.5 inch 15 1.9 inch 15

Min (inch) - Max (inch)

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0.095 inch 9 0.12 inch 9 0.13 inch 9 0.165 inch 18 0.2 inch 80

Min (inch) - Max (inch)

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1.2 inch 15 1.4 inch 15 1.9 inch 15

Min (inch) - Max (inch)

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11X11 120 19X19 15

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AU 96 AU ON NI 30 SN 24 SN-PB ON NI 15

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GOLD 120 Gold (Au) - with Nickel (Ni) barrier 15 Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier 30

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Contact Material (1)

BE-CU 165

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RND PIN-SKT 165

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Current Rating (1)

3 A 120

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IC SOCKET 167

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PGA100 15 PGA144 15 PGA72 120 PGA84 15

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1900VAC V 120

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GLASS FILLED EPOXY 90 GLASS FILLED POLYESTER 15 GLASS FILLED THERMOPLASTIC 15 KAPTON 15 MYLAR 15 POLYTRIX 15

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2 GΩ 120

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e0 30 e4 15

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Manufacturer (5)

Advanced Interconnections Corp 45 Cirrus Logic 2 Cooper Industries 40 Eaton Corporation 40 WPI Garry Electronics 40

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0.1 inch 165

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STRAIGHT 165

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Number of Contacts (4)

72 120 84 15 100 15 144 15

Min - Max

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125.0 °C 105 140.0 °C 45 400.0 °C 15

Min (°C) - Max (°C)

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-269.0 °C 15 -55.0 °C 105

Min (°C) - Max (°C)

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RECTANGULAR 165

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100 µm 165

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Active 10 Obsolete 117 Transferred 40

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No 30 Yes 17

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Terminal Pitch (1)

2.54 mm 165

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SOLDER 45 SURFACE MOUNT 115

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