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11AA160-I/MS
Microchip Technology Inc
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$0.3999 | Yes | Yes | Active | 16.384 kbit | 8 | 2KX8 | 5 V | 1 MHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1 | 1 | 2000 | 2.048 k | SYNCHRONOUS | TOTEM POLE | SERIAL | NO | NO | 1-WIRE | 5 µA | 5 µA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | NO | 10 ms | SOFTWARE | S-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | TS 16949 | 40 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 1.1 mm | 3 mm | 3 mm | MICROCHIP TECHNOLOGY INC | MSOP | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | |||
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11AA160-I/MN
Microchip Technology Inc
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Check for Price | Yes | Yes | Active | 16.384 kbit | 8 | 2KX8 | 2.5 V | 1 MHz | EEPROM | 1 | 2000 | 2.048 k | SYNCHRONOUS | SERIAL | 1-WIRE | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | 10 ms | R-PDSO-N8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | DUAL | 800 µm | 3 mm | 2 mm | MICROCHIP TECHNOLOGY INC | DFN | 8 | compliant | EAR99 | 8542.32.00.51 | 2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8 | |||||||||||||||
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11AA160-I/MNY
Microchip Technology Inc
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Check for Price | Yes | Yes | Active | 16.384 kbit | 8 | 2KX8 | 5 V | 1 MHz | EEPROM | 1 | 2000 | 2.048 k | SYNCHRONOUS | SERIAL | 1-WIRE | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | 10 ms | R-PDSO-N8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | DUAL | 800 µm | 3 mm | 2 mm | MICROCHIP TECHNOLOGY INC | DFN | 8 | compliant | EAR99 | 8542.32.00.51 | 2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8 |