Parametric results for: 11AA160-I/MC under EEPROMs

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Manufacturer Part Number: 11aa160im
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11AA160-I/MS
Microchip Technology Inc
$0.3999 Yes Yes Active 16.384 kbit 8 2KX8 5 V 1 MHz EEPROM 200 1000000 Write/Erase Cycles 1 1 2000 2.048 k SYNCHRONOUS TOTEM POLE SERIAL NO NO 1-WIRE 5 µA 5 µA 5.5 V 1.8 V CMOS INDUSTRIAL NO 10 ms SOFTWARE S-PDSO-G8 Not Qualified e3 1 85 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY TSSOP TSSOP8,.19 SQUARE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES Matte Tin (Sn) GULL WING 650 µm DUAL 1.1 mm 3 mm 3 mm MICROCHIP TECHNOLOGY INC MSOP 8 compliant EAR99 8542.32.00.51 Microchip
11AA160-I/MN
Microchip Technology Inc
Check for Price Yes Yes Active 16.384 kbit 8 2KX8 2.5 V 1 MHz EEPROM 1 2000 2.048 k SYNCHRONOUS SERIAL 1-WIRE 5.5 V 1.8 V CMOS INDUSTRIAL 10 ms R-PDSO-N8 Not Qualified e4 1 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 8 PLASTIC/EPOXY HVSON RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES Nickel/Palladium/Gold (Ni/Pd/Au) NO LEAD 500 µm DUAL 800 µm 3 mm 2 mm MICROCHIP TECHNOLOGY INC DFN 8 compliant EAR99 8542.32.00.51 2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8
11AA160-I/MNY
Microchip Technology Inc
Check for Price Yes Yes Active 16.384 kbit 8 2KX8 5 V 1 MHz EEPROM 1 2000 2.048 k SYNCHRONOUS SERIAL 1-WIRE 5.5 V 1.8 V CMOS INDUSTRIAL 10 ms R-PDSO-N8 Not Qualified e4 1 85 °C -40 °C 260 40 8 PLASTIC/EPOXY HVSON RECTANGULAR SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE YES Nickel/Palladium/Gold (Ni/Pd/Au) NO LEAD 500 µm DUAL 800 µm 3 mm 2 mm MICROCHIP TECHNOLOGY INC DFN 8 compliant EAR99 8542.32.00.51 2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8