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1-FTG0900-708GGHS
Advanced Interconnections Corp
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Check for Price | Yes | Active | 900 | BE-CU | IC SOCKET | BGA900 | WITH HEAT SINK | e4 | 260 °C | -60 °C | AU ON NI | Gold (Au) - with Nickel (Ni) barrier | RND PIN-SKT | GLASS FILLED THERMOPLASTIC | 0.05 inch | STRAIGHT | RECTANGULAR | SOLDER | 1.575 inch | 1.575 inch | ADVANCED INTERCONNECTIONS CORP | compliant | EAR99 | 8536.69.40.40 |