Findchips: Parametric Search Results for /pc741

Parametric results for: /pc741 under Microprocessors

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		PC7410MGH450LE Teledyne e2v
		PC7410VG500LE Atmel Corporation
		PC7410M16VG450L Atmel Corporation
		PC7410VGSU450NE Teledyne e2v
		PC7410VGH400LE Teledyne e2v
		PC7410MGSU400LE Teledyne e2v
		PC7410VGS450NE Atmel Corporation
		PC7410VGHU400LE Atmel Corporation
		PC7410MGH500NE Teledyne e2v
		PC7410MGS400LE Atmel Corporation

			Most Relevant	Compliance	Operating Conditions		Physical			Other
Composite Price	Rohs Code	Part Life Cycle Code	Surface Mount	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Style	Terminal Finish	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Address Bus Width	Bit Size	Boundary Scan	Clock Frequency-Max	External Data Bus Width	Format	Integrated Cache	JESD-30 Code	Low Power Mode	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Qualification Status	Speed	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Technology	Temperature Grade	Terminal Form	Terminal Pitch	Terminal Position	uPs/uCs/Peripheral ICs Type	Length	Seated Height-Max	Width

$477.9445

Obsolete

YES

125 °C

-55 °C

360

GRID ARRAY

TELEDYNE E2V (UK) LTD

BGA

25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360

360

compliant

3A991.A.2

8542.31.00.01

YES

133 MHz

FLOATING POINT

YES

S-CBGA-B360

YES

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

Not Qualified

450 MHz

1.9 V

1.7 V

1.8 V

CMOS

MILITARY

BALL

1.27 mm

BOTTOM

MICROPROCESSOR, RISC

Check for Price

Transferred

YES

360

GRID ARRAY

ATMEL CORP

BGA

BGA, BGA360,19X19,50

360

unknown

3A991.A.2

8542.31.00.01

YES

133 MHz

FLOATING POINT

YES

S-CBGA-B360

YES

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

Not Qualified

500 MHz

1.9 V

1.7 V

1.8 V

CMOS

BALL

1.27 mm

BOTTOM

MICROPROCESSOR, RISC

25 mm

3.2 mm

25 mm

Check for Price

Obsolete

ATMEL CORP

unknown

8542.31.00.01

Check for Price

Obsolete

YES

360

GRID ARRAY

E2V TECHNOLOGIES PLC

BGA

BGA, CGA360,19X19,50

360

unknown

3A991.A.2

8542.31.00.01

YES

133 MHz

FLOATING POINT

YES

S-CBGA-B360

YES

CERAMIC, METAL-SEALED COFIRED

BGA

CGA360,19X19,50

SQUARE

Not Qualified

450 MHz

1.55 V

1.45 V

1.5 V

CMOS

BALL

1.27 mm

BOTTOM

MICROPROCESSOR, RISC

25 mm

4.2 mm

25 mm

Check for Price

Obsolete

YES

360

GRID ARRAY

TELEDYNE E2V (UK) LTD

BGA

25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360

360

compliant

3A991.A.2

8542.31.00.01

YES

133 MHz

FLOATING POINT

YES

S-CBGA-B360

YES

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

Not Qualified

400 MHz

1.9 V

1.7 V

1.8 V

CMOS

BALL

1.27 mm

BOTTOM

MICROPROCESSOR, RISC

Check for Price

Obsolete

YES

125 °C

-55 °C

360

GRID ARRAY

E2V TECHNOLOGIES PLC

BGA

BGA, CGA360,19X19,50

360

unknown

3A991.A.2

8542.31.00.01

YES

133 MHz

FLOATING POINT

YES

S-CBGA-B360

YES

CERAMIC, METAL-SEALED COFIRED

BGA

CGA360,19X19,50

SQUARE

Not Qualified

400 MHz

1.9 V

1.7 V

1.8 V

CMOS

MILITARY

BALL

1.27 mm

BOTTOM

MICROPROCESSOR, RISC

25 mm

4.2 mm

25 mm

Check for Price

Transferred

YES

360

GRID ARRAY

ATMEL CORP

BGA

BGA,

360

unknown

3A991.A.2

8542.31.00.01

YES

133 MHz

FLOATING POINT

YES

S-CBGA-B360

YES

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

Not Qualified

450 MHz

1.55 V

1.45 V

1.5 V

CMOS

BALL

1.27 mm

BOTTOM

MICROPROCESSOR, RISC

25 mm

4.2 mm

25 mm

Check for Price

Transferred

YES

360

GRID ARRAY

Tin/Lead (Sn/Pb)

ATMEL CORP

BGA

BGA, BGA360,19X19,50

360

unknown

3A991.A.2

8542.31.00.01

YES

133 MHz

FLOATING POINT

YES

S-CBGA-B360

YES

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

Not Qualified

400 MHz

1.9 V

1.7 V

1.8 V

CMOS

BALL

1.27 mm

BOTTOM

MICROPROCESSOR, RISC

25 mm

3.2 mm

25 mm

Check for Price

Obsolete

YES

125 °C

-55 °C

360

GRID ARRAY

E2V TECHNOLOGIES PLC

BGA

BGA, BGA360,19X19,50

360

compliant

3A991.A.2

8542.31.00.01

YES

133 MHz

FLOATING POINT

YES

S-CBGA-B360

YES

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

Not Qualified

500 MHz

1.55 V

1.45 V

1.5 V

CMOS

MILITARY

BALL

1.27 mm

BOTTOM

MICROPROCESSOR, RISC

Check for Price

Transferred

YES

125 °C

-55 °C

360

GRID ARRAY

ATMEL CORP

BGA

BGA, BGA360,19X19,50

360

unknown

3A991.A.2

8542.31.00.01

YES

133 MHz

FLOATING POINT

YES

S-CBGA-B360

YES

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

Not Qualified

400 MHz

1.9 V

1.7 V

1.8 V

CMOS

MILITARY

BALL

1.27 mm

BOTTOM

MICROPROCESSOR, RISC

25 mm

4.2 mm

25 mm

1 2 3 4 5 Next

Compare

PC7410MGH450LE

Teledyne e2v

$477.9445

Obsolete

YES

125 °C

-55 °C

360

GRID ARRAY

TELEDYNE E2V (UK) LTD

BGA

25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360

360

compliant

3A991.A.2

8542.31.00.01

YES

133 MHz

FLOATING POINT

YES

S-CBGA-B360

YES

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

Not Qualified

450 MHz

1.9 V

1.7 V

1.8 V

CMOS

MILITARY

BALL

1.27 mm

BOTTOM

MICROPROCESSOR, RISC

PC7410VG500LE

Atmel Corporation

Check for Price

Transferred

YES

360

GRID ARRAY

ATMEL CORP

BGA

BGA, BGA360,19X19,50

360

unknown

3A991.A.2

8542.31.00.01

YES

133 MHz

FLOATING POINT

YES

S-CBGA-B360

YES

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

Not Qualified

500 MHz

1.9 V

1.7 V

1.8 V

CMOS

BALL

1.27 mm

BOTTOM

MICROPROCESSOR, RISC

25 mm

3.2 mm

25 mm

PC7410M16VG450L

Atmel Corporation

Check for Price

Obsolete

ATMEL CORP

unknown

8542.31.00.01

PC7410VGSU450NE

Teledyne e2v

Check for Price

Obsolete

YES

360

GRID ARRAY

E2V TECHNOLOGIES PLC

BGA

BGA, CGA360,19X19,50

360

unknown

3A991.A.2

8542.31.00.01

YES

133 MHz

FLOATING POINT

YES

S-CBGA-B360

YES

CERAMIC, METAL-SEALED COFIRED

BGA

CGA360,19X19,50

SQUARE

Not Qualified

450 MHz

1.55 V

1.45 V

1.5 V

CMOS

BALL

1.27 mm

BOTTOM

MICROPROCESSOR, RISC

25 mm

4.2 mm

25 mm

PC7410VGH400LE

Teledyne e2v

Check for Price

Obsolete

YES

360

GRID ARRAY

TELEDYNE E2V (UK) LTD

BGA

25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360

360

compliant

3A991.A.2

8542.31.00.01

YES

133 MHz

FLOATING POINT

YES

S-CBGA-B360

YES

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

Not Qualified

400 MHz

1.9 V

1.7 V

1.8 V

CMOS

BALL

1.27 mm

BOTTOM

MICROPROCESSOR, RISC

PC7410MGSU400LE

Teledyne e2v

Check for Price

Obsolete

YES

125 °C

-55 °C

360

GRID ARRAY

E2V TECHNOLOGIES PLC

BGA

BGA, CGA360,19X19,50

360

unknown

3A991.A.2

8542.31.00.01

YES

133 MHz

FLOATING POINT

YES

S-CBGA-B360

YES

CERAMIC, METAL-SEALED COFIRED

BGA

CGA360,19X19,50

SQUARE

Not Qualified

400 MHz

1.9 V

1.7 V

1.8 V

CMOS

MILITARY

BALL

1.27 mm

BOTTOM

MICROPROCESSOR, RISC

25 mm

4.2 mm

25 mm

PC7410VGS450NE

Atmel Corporation

Check for Price

Transferred

YES

360

GRID ARRAY

ATMEL CORP

BGA

BGA,

360

unknown

3A991.A.2

8542.31.00.01

YES

133 MHz

FLOATING POINT

YES

S-CBGA-B360

YES

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

Not Qualified

450 MHz

1.55 V

1.45 V

1.5 V

CMOS

BALL

1.27 mm

BOTTOM

MICROPROCESSOR, RISC

25 mm

4.2 mm

25 mm

PC7410VGHU400LE

Atmel Corporation

Check for Price

Transferred

YES

360

GRID ARRAY

Tin/Lead (Sn/Pb)

ATMEL CORP

BGA

BGA, BGA360,19X19,50

360

unknown

3A991.A.2

8542.31.00.01

YES

133 MHz

FLOATING POINT

YES

S-CBGA-B360

YES

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

Not Qualified

400 MHz

1.9 V

1.7 V

1.8 V

CMOS

BALL

1.27 mm

BOTTOM

MICROPROCESSOR, RISC

25 mm

3.2 mm

25 mm

PC7410MGH500NE

Teledyne e2v

Check for Price

Obsolete

YES

125 °C

-55 °C

360

GRID ARRAY

E2V TECHNOLOGIES PLC

BGA

BGA, BGA360,19X19,50

360

compliant

3A991.A.2

8542.31.00.01

YES

133 MHz

FLOATING POINT

YES

S-CBGA-B360

YES

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

Not Qualified

500 MHz

1.55 V

1.45 V

1.5 V

CMOS

MILITARY

BALL

1.27 mm

BOTTOM

MICROPROCESSOR, RISC

PC7410MGS400LE

Atmel Corporation

Check for Price

Transferred

YES

125 °C

-55 °C

360

GRID ARRAY

ATMEL CORP

BGA

BGA, BGA360,19X19,50

360

unknown

3A991.A.2

8542.31.00.01

YES

133 MHz

FLOATING POINT

YES

S-CBGA-B360

YES

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

Not Qualified

400 MHz

1.9 V

1.7 V

1.8 V

CMOS

MILITARY

BALL

1.27 mm

BOTTOM

MICROPROCESSOR, RISC

25 mm

4.2 mm

25 mm

1 2 3 4 5 Next