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MAX4761ETX+
Maxim Integrated Products
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$8.0378 | Yes | Yes | Transferred | 3 V | YES | 3.5 Ω | 200 mΩ | 140 ns | 50 ns | DPDT | CMOS | 2 | 4 | 100 dB | SEPARATE OUTPUT | 5.5 V | 1.8 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-XQCC-N36 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 36 | UNSPECIFIED | HVQCCN | LCC36,.25SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 6 mm | 800 µm | 6 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 6 X 6 MM, 0.80 MM HEIGHT, MO-220WJJD-1, TQFN-36 | 36 | compliant | EAR99 | 8542.39.00.01 | ||
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MAX4761EWX+T
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | 3 V | YES | 3.5 Ω | 200 mΩ | 140 ns | 50 ns | DPDT | CMOS | 2 | 4 | 100 dB | 5.5 V | 1.8 V | INDUSTRIAL | S-PBGA-B36 | Not Qualified | e1 | 1 | 85 °C | -40 °C | 260 | 30 | 36 | PLASTIC/EPOXY | VFBGA | BGA36,6X6,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 3.06 mm | 670 µm | 3.06 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | VFBGA, | 36 | compliant | 8542.39.00.01 | |||||
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MAX4761EBX+T
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | 3 V | YES | 3.5 Ω | 200 mΩ | 150 ns | 60 ns | DPDT | CMOS | 2 | 4 | 80 dB | SEPARATE OUTPUT | 5.5 V | 1.8 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-PBGA-B32 | Not Qualified | e1 | 1 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | VFBGA | BGA36,6X6,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 3.06 mm | 670 µm | 3.06 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | VFBGA, BGA36,6X6,20 | 36 | compliant | 8542.39.00.01 | |||
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MAX4761EBX
Rochester Electronics LLC
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Check for Price | No | No | Active | 3 V | YES | 3.5 Ω | 200 mΩ | 140 ns | 50 ns | DPDT | CMOS | 2 | 4 | 100 dB | 5.5 V | 1.8 V | INDUSTRIAL | S-PBGA-B32 | 1 | 85 °C | -40 °C | 240 | 20 | 32 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | NOT SPECIFIED | BALL | BOTTOM | ROCHESTER ELECTRONICS LLC | BGA | UCSP-32 | 32 | unknown | |||||||||||||
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MAX4761ETX-T
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 3 V | YES | 3.5 Ω | 200 mΩ | 140 ns | 50 ns | DPDT | CMOS | 2 | 4 | 100 dB | SEPARATE OUTPUT | 5.5 V | 1.8 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-XQCC-N36 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 36 | UNSPECIFIED | HVQCCN | LCC36,.25SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 6 mm | 800 µm | 6 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 6 X 6 MM, 0.80 MM HEIGHT, MO-220WJJD-1, TQFN-36 | 36 | not_compliant | 8542.39.00.01 | |||||
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MAX4761EBX
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 3 V | YES | 3.5 Ω | 200 mΩ | 140 ns | 50 ns | DPDT | CMOS | 1 | 4 | 100 dB | SEPARATE OUTPUT | 5.5 V | 1.8 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-PBGA-B32 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 245 | 32 | PLASTIC/EPOXY | BGA | BGA36,6X6,20 | SQUARE | GRID ARRAY | TIN LEAD | BALL | 500 µm | BOTTOM | MAXIM INTEGRATED PRODUCTS INC | BGA | BGA, BGA36,6X6,20 | 32 | not_compliant | 8542.39.00.01 | |||||||
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MAX4761ETX+T
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | 3 V | YES | 3.5 Ω | 200 mΩ | 150 ns | 60 ns | DPDT | CMOS | 2 | 4 | 80 dB | SEPARATE OUTPUT | 5.5 V | 1.8 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-XQCC-N36 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 36 | UNSPECIFIED | HVQCCN | LCC36,.25SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 6 mm | 800 µm | 6 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 6 X 6 MM, ROHS COMPLIANT, TQFN-36 | 36 | compliant | EAR99 | 8542.39.00.01 | ||
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MAX4761ETX
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 3 V | YES | 3.5 Ω | 200 mΩ | 140 ns | 50 ns | DPDT | CMOS | 2 | 4 | 100 dB | SEPARATE OUTPUT | 5.5 V | 1.8 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-XQCC-N36 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 245 | 36 | UNSPECIFIED | HVQCCN | LCC36,.25SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 6 mm | 800 µm | 6 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 6 X 6 MM, 0.80 MM HEIGHT, MO-220WJJD-1, TQFN-36 | 36 | not_compliant | EAR99 | 8542.39.00.01 | |||
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MAX4761EBX-T
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 3 V | YES | 3.5 Ω | 200 mΩ | 140 ns | 50 ns | DPDT | CMOS | 1 | 4 | 100 dB | SEPARATE OUTPUT | 5.5 V | 1.8 V | BREAK-BEFORE-MAKE | INDUSTRIAL | S-PBGA-B32 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 245 | 32 | PLASTIC/EPOXY | BGA | BGA36,6X6,20 | SQUARE | GRID ARRAY | TIN LEAD | BALL | 500 µm | BOTTOM | 3.06 mm | 670 µm | 3.06 mm | MAXIM INTEGRATED PRODUCTS INC | BGA | UCSP-32 | 32 | not_compliant | EAR99 | 8542.39.00.01 | |||
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MAX4761EWX+
Maxim Integrated Products
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Check for Price | Yes | Transferred | DPDT | e1 | 1 | 260 | 30 | TIN SILVER COPPER | MAXIM INTEGRATED PRODUCTS INC | compliant | 8542.39.00.01 |