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41 - 50 of 1,142 results
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SJA1110CEL/0Y
NXP Semiconductors
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$11.7450 | Yes | Active | 1.8 V | ETHERNET SWITCH | ALSO OPERATES WITH 2.5V AND 3.3V NOMINAL SUPPLY | 1 | S-PBGA-B256 | 3 | 260 | AEC-Q100; ISO 26262 | NOT SPECIFIED | 256 | PLASTIC/EPOXY | LFBGA | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 14 mm | 14 mm | 1.5 mm | NXP SEMICONDUCTORS | LFBGA-256 | compliant | |||||||||||||||||
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MT89L85APR1
Microsemi Corporation
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$11.9064 | Yes | Yes | Transferred | 3.3 V | DIGITAL TIME SWITCH | 1 | INDUSTRIAL | S-PQCC-J44 | e3 | Not Qualified | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 16.585 mm | 16.585 mm | 4.57 mm | MICROSEMI CORP | LEAD FREE, PLASTIC, MS-018AC, LCC-44 | compliant | LPCC | 44 | 8542.39.00.01 | |||||||||||||
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72V70800TFG
Integrated Device Technology Inc
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$12.2655 | Yes | Yes | Transferred | 3.3 V | DIGITAL TIME SWITCH | 1 | INDUSTRIAL | S-PQFP-G64 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 64 | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | TIN | GULL WING | 500 µm | QUAD | 10 mm | 10 mm | 1.6 mm | INTEGRATED DEVICE TECHNOLOGY INC | STQFP-64 | compliant | TQFP | 64 | 8542.39.00.01 | PPG64 | EAR99 | |||||||||
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72V70200PF
Integrated Device Technology Inc
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$12.2656 | No | No | Transferred | 3.3 V | DIGITAL TIME SWITCH | 1 | 10 µA | INDUSTRIAL | S-PQFP-G100 | e0 | Not Qualified | 3 | 85 °C | -40 °C | 240 | 20 | 100 | PLASTIC/EPOXY | LFQFP | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | Tin/Lead (Sn85Pb15) | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 1.6 mm | INTEGRATED DEVICE TECHNOLOGY INC | 14 X 14 MM, 0.50 MM PITCH, TQFP-100 | not_compliant | QFP | 100 | 8542.39.00.01 | ||||||||
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72V70800PFG
Integrated Device Technology Inc
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$12.2656 | Yes | Yes | Transferred | 3.3 V | DIGITAL TIME SWITCH | 1 | INDUSTRIAL | S-PQFP-G64 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 64 | PLASTIC/EPOXY | LQFP | SQUARE | FLATPACK, LOW PROFILE | YES | TIN | GULL WING | 800 µm | QUAD | 14 mm | 14 mm | 1.6 mm | INTEGRATED DEVICE TECHNOLOGY INC | TQFP-64 | compliant | TQFP | 64 | 8542.39.00.01 | PNG64 | EAR99 | |||||||||
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72V70200PFG
Integrated Device Technology Inc
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$12.2656 | Yes | Yes | Transferred | 3.3 V | CMOS | DIGITAL TIME SWITCH | 1 | 10 µA | INDUSTRIAL | S-PQFP-G100 | e3 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 30 | 100 | PLASTIC/EPOXY | LFQFP | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | YES | MATTE TIN | GULL WING | 500 µm | QUAD | 14 mm | 14 mm | 1.6 mm | INTEGRATED DEVICE TECHNOLOGY INC | TQFP-100 | compliant | TQFP | 100 | 8542.39.00.01 | PNG100 | EAR99 | |||||
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72V70800PF
Integrated Device Technology Inc
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$12.2656 | No | No | Transferred | 3.3 V | DIGITAL TIME SWITCH | 1 | 45 µA | INDUSTRIAL | S-PQFP-G64 | e0 | Not Qualified | 3 | 85 °C | -40 °C | 240 | 30 | 64 | PLASTIC/EPOXY | LQFP | QFP64,.6SQ,32 | SQUARE | FLATPACK, LOW PROFILE | YES | TIN LEAD | GULL WING | 800 µm | QUAD | 14 mm | 14 mm | 1.6 mm | INTEGRATED DEVICE TECHNOLOGY INC | PLASTIC, TQFP-64 | not_compliant | QFP | 64 | 8542.39.00.01 | ||||||||
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MT8980DE1
Microsemi Corporation
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$13.0421 | Yes | Yes | Transferred | 5 V | CMOS | DIGITAL TIME SWITCH | 1 | 10 mA | INDUSTRIAL | R-PDIP-T40 | e3 | Not Qualified | 85 °C | -40 °C | 40 | PLASTIC/EPOXY | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 15.24 mm | 51.75 mm | 6.35 mm | MICROSEMI CORP | LEAD FREE, PLASTIC, MS-011AC, DIP-40 | compliant | DIP | 40 | 8542.39.00.01 | Microsemi Corporation | |||||||||
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MT8985APR1
Microsemi Corporation
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$13.0780 | Yes | Yes | Transferred | 5 V | CMOS | DIGITAL TIME SWITCH | 1 | 15 mA | INDUSTRIAL | S-PQCC-J44 | e3 | Not Qualified | 85 °C | -40 °C | 44 | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 16.585 mm | 16.585 mm | 4.57 mm | MICROSEMI CORP | LEAD FREE, PLASTIC, MS-018AC, LCC-44 | compliant | LPCC | 44 | 8542.39.00.01 | ||||||||||
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BCM53154MB1ILFBG
Broadcom Limited
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$13.3926 | Active | ETHERNET SWITCH | 1 | S-XXSS-X | e1 | 3 | 85 °C | -40 °C | 260 | UNSPECIFIED | XSS | SQUARE | NO | TIN SILVER COPPER | UNSPECIFIED | UNSPECIFIED | BROADCOM INC | Package | unknown | 8542.39.00.01 | Avago Technologies |