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Parametric results for: Telecom Signaling Circuits

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MT8888CP1
 Microsemi Corporation 		$5.3065 Yes Yes Transferred 5 V CMOS DTMF SIGNALING CIRCUIT 1 INDUSTRIAL S-PQCC-J28 e3 Not Qualified 85 °C -40 °C 28 PLASTIC/EPOXY QCCJ SQUARE CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 11.505 mm 11.505 mm 4.57 mm MICROSEMI CORP QLCC LEAD FREE, PLASTIC, LCC-28 28 compliant 8542.39.00.01 Microsemi Corporation
MT8880CP1
 Microsemi Corporation 		$5.3065 Yes Yes Transferred 5 V CMOS DTMF SIGNALING CIRCUIT 1 INDUSTRIAL S-PQCC-J28 e3 Not Qualified 85 °C -40 °C 28 PLASTIC/EPOXY QCCJ SQUARE CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 11.505 mm 11.505 mm 4.57 mm MICROSEMI CORP LCC LEAD FREE, PLASTIC, MS-018AB, LCC-28 28 compliant 8542.39.00.01 Microsemi Corporation
MT8880CN1
 Microsemi Corporation 		$5.3065 Yes No Transferred 5 V CMOS DTMF SIGNALING CIRCUIT 1 11 mA INDUSTRIAL R-PDSO-G24 e3 Not Qualified 85 °C -40 °C 24 PLASTIC/EPOXY SSOP SSOP24,.3 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 5.3 mm 8.2 mm 2 mm MICROSEMI CORP SSOP 5.30 MM, LEAD FREE, MO-150AG, SSOP-24 24 unknown 8542.39.00.01 Microsemi Corporation
MT8889CS1
 Microsemi Corporation 		$5.6782 Yes Yes Transferred 5 V CMOS DTMF SIGNALING CIRCUIT 1 10 mA INDUSTRIAL R-PDSO-G20 e3 Not Qualified 85 °C -40 °C 20 PLASTIC/EPOXY SOP SOP20,.4 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 7.5 mm 12.8 mm 2.65 mm MICROSEMI CORP SOIC 0.300 INCH, LEAD FREE, MS-013AC, SOIC-20 20 unknown 8542.39.00.01 Microsemi Corporation
MT8889CN1
 Microsemi Corporation 		$5.9605 Yes Yes Transferred 5 V CMOS DTMF SIGNALING CIRCUIT 1 11 mA INDUSTRIAL R-PDSO-G24 e3 Not Qualified 85 °C -40 °C 24 PLASTIC/EPOXY SSOP SSOP24,.3 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 5.3 mm 8.2 mm 2 mm MICROSEMI CORP SSOP 5.30 MM, LEAD FREE, MO-150AG, SSOP-24 24 compliant 8542.39.00.01 Microsemi Corporation
MT8870BC
 Zarlink Semiconductor Inc 		Check for Price No Transferred 5 V CMOS DTMF SIGNALING CIRCUIT 9 mA INDUSTRIAL R-XDIP-T18 e0 Not Qualified 85 °C -40 °C 260 18 CERAMIC DIP DIP18,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL ZARLINK SEMICONDUCTOR INC DIP-18 unknown 8542.39.00.01
MC145436AP
 Motorola Mobility LLC 		Check for Price No Obsolete 5 V CMOS DTMF SIGNALING CIRCUIT 1 8 mA INDUSTRIAL R-PDIP-T14 e0 Not Qualified 85 °C -40 °C 14 PLASTIC/EPOXY DIP DIP14,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 7.62 mm 18.86 mm 4.69 mm MOTOROLA INC DIP DIP, DIP14,.3 14 unknown 8542.39.00.01
SE567T
 Signetics 		Check for Price No Obsolete 5 V TONE DECODER CIRCUIT 1 13 mA MILITARY O-MBCY-W8 e0 Not Qualified 125 °C -55 °C 8 METAL ROUND CYLINDRICAL NO TIN LEAD WIRE BOTTOM SIGNETICS CORP , unknown 8542.39.00.01
MV8870-1DG
 Microsemi Corporation 		Check for Price No Obsolete 5 V CMOS DTMF SIGNALING CIRCUIT 1 7 mA OTHER R-XDIP-T18 Not Qualified 80 °C -40 °C 18 CERAMIC DIP DIP18,.3 RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL MICROSEMI CORP unknown 8542.39.00.01
MT8880CC-1
 Zarlink Semiconductor Inc 		Check for Price No Transferred 5 V CMOS DTMF SIGNALING CIRCUIT 1 10 µA INDUSTRIAL R-GDIP-T20 e0 Not Qualified 85 °C -40 °C 260 20 CERAMIC, GLASS-SEALED DIP DIP20,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 7.62 mm 5.08 mm ZARLINK SEMICONDUCTOR INC DIP, DIP20,.3 unknown 8542.39.00.01
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