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BGA123L4E6327XTSA1
Infineon Technologies AG
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$0.3985 | Yes | Active | 1.8 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XBCC-N4 | 1 | 85 °C | -40 °C | 4 | UNSPECIFIED | VQCCN | SQUARE | CHIP CARRIER, VERY THIN PROFILE | YES | NO LEAD | 400 µm | BOTTOM | 700 µm | 700 µm | 320 µm | INFINEON TECHNOLOGIES AG | VQCCN, | compliant | 8542.39.00.01 | Infineon | ||||||||||||||||||
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BGA5M1BN6E6327XTSA1
Infineon Technologies AG
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$0.4072 | Yes | Obsolete | 1.8 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XBCC-B6 | 1 | 85 °C | -40 °C | 6 | UNSPECIFIED | BCC | RECTANGULAR | CHIP CARRIER | YES | BUTT | 400 µm | BOTTOM | 700 µm | 1.1 mm | 400 µm | INFINEON TECHNOLOGIES AG | BCC, | compliant | 8542.39.00.01 | Infineon | 2018-04-13 | |||||||||||||||||
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AP2280-1WG-7
Diodes Incorporated
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$0.4389 | Yes | Yes | Active | 1.8 V | 1 | POWER SUPPLY SUPPORT CIRCUIT | 1 | R-PDSO-G5 | 3 | 85 °C | -40 °C | 260 | 30 | 5 | PLASTIC/EPOXY | LSSOP | TSOP5/6,.11,37 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 950 µm | DUAL | 1.6 mm | 3 mm | 1.45 mm | DIODES INC | SOT-25, 5 PIN | compliant | 8542.39.00.01 | Diodes Incorporated | SOT | 5 | EAR99 | NO | 6 V | 1.5 V | |||||||
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ATA5577M3330C-DDB
Microchip Technology Inc
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$0.4390 | Active | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XUUC-N2 | 85 °C | -40 °C | 2 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | YES | UNSPECIFIED | 524 µm | UPPER | 1 mm | 1.35 mm | 162 µm | MICROCHIP TECHNOLOGY INC | WAFER | compliant | 8523.59.00.00 | Microchip | 5A991.G | |||||||||||||||||||
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ATA5577M3330C-DBB
Microchip Technology Inc
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$0.4390 | Yes | Active | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XUUC-N2 | 85 °C | -40 °C | 2 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | YES | UNSPECIFIED | 524 µm | UPPER | 1 mm | 1.35 mm | 192 µm | MICROCHIP TECHNOLOGY INC | WAFER | compliant | 8523.59.00.00 | Microchip | 5A991.G | ||||||||||||||||||
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ATA5577M233AC-DBB
Microchip Technology Inc
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$0.4390 | Yes | Active | 3.6 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XUUC-N2 | 85 °C | -40 °C | 2 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | NO | NO LEAD | UPPER | MICROCHIP TECHNOLOGY INC | compliant | 8523.59.00.00 | 5A991.G | |||||||||||||||||||||||
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ATA5577M233SC-DBB
Microchip Technology Inc
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$0.4390 | Yes | Active | 3.6 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XUUC-N2 | 85 °C | -40 °C | 2 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | NO | NO LEAD | UPPER | MICROCHIP TECHNOLOGY INC | compliant | 8523.59.00.00 | Microchip | 5A991.G | ||||||||||||||||||||||
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ATA5577M2330C-DBB
Microchip Technology Inc
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$0.4390 | Yes | Active | 3.6 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XUUC-N2 | Not Qualified | 85 °C | -40 °C | 2 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | NO | NO LEAD | UPPER | MICROCHIP TECHNOLOGY INC | compliant | 8523.59.00.00 | Microchip | 5A991.G | |||||||||||||||||||||
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ATA5577M3331C-DBB
Microchip Technology Inc
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$0.4390 | Active | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XUUC-N2 | 85 °C | -40 °C | 2 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | YES | UNSPECIFIED | 524 µm | UPPER | 1 mm | 1.35 mm | 192 µm | MICROCHIP TECHNOLOGY INC | WAFER | compliant | 8523.59.00.00 | Microchip | 5A991.G | |||||||||||||||||||
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AP2280-1FMG-7
Diodes Incorporated
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$0.4412 | Yes | Yes | Active | 1.8 V | 1 | POWER SUPPLY SUPPORT CIRCUIT | 1 | R-PDSO-N6 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | HVSON | SOLCC6,.07,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | DUAL | 1.8125 mm | 2.0125 mm | 605 µm | DIODES INC | HVSON, | compliant | 8542.39.00.01 | Diodes Incorporated | DFN | 6 | EAR99 | NO | 6 V | 1.5 V |