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41 - 50 of 45,004 results
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ATA5577M2330C-DBB
Microchip Technology Inc
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$0.4390 | Yes | Active | 3.6 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XUUC-N2 | Not Qualified | 85 °C | -40 °C | 2 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | NO | NO LEAD | UPPER | MICROCHIP TECHNOLOGY INC | compliant | 5A991.G | 8523.59.00.00 | Microchip | |||||||||||||||||
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ATA5577M3331C-DBB
Microchip Technology Inc
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$0.4390 | Active | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XUUC-N2 | 85 °C | -40 °C | 2 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | YES | UNSPECIFIED | 524 µm | UPPER | 1 mm | 1.35 mm | 192 µm | MICROCHIP TECHNOLOGY INC | compliant | 5A991.G | 8523.59.00.00 | Microchip | WAFER | |||||||||||||||
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BGA5L1BN6E6327XTSA1
Infineon Technologies AG
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$0.4640 | Yes | Obsolete | 1.8 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XBCC-B6 | 1 | 85 °C | -40 °C | 6 | UNSPECIFIED | BCC | RECTANGULAR | CHIP CARRIER | YES | BUTT | 400 µm | BOTTOM | 700 µm | 1.1 mm | 400 µm | INFINEON TECHNOLOGIES AG | compliant | 8542.39.00.01 | Infineon | TSNP-6 | 2018-04-13 | |||||||||||||
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BA4116FV-E2
ROHM Semiconductor
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$0.4653 | Yes | Yes | Active | 5 V | TELECOM CIRCUIT | 1 | OTHER | R-PDSO-G16 | e3/e2 | Not Qualified | 85 °C | -30 °C | 260 | 10 | 16 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 650 µm | DUAL | 4.4 mm | 5 mm | 1.2 mm | ROHM CO LTD | compliant | 8542.39.00.01 | ROHM Semiconductor | 0.65 MM PITCH, SSOP-16 | SOIC | 16 | |||||||
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BGS16MN14E6327XTSA1
Infineon Technologies AG
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$0.4702 | Yes | Obsolete | 3.5 V | CMOS | TELECOM CIRCUIT | 1 | OTHER | S-PQCC-N14 | e3 | 1 | 85 °C | -30 °C | NOT SPECIFIED | NOT SPECIFIED | 14 | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Tin (Sn) | NO LEAD | 500 µm | QUAD | 2 mm | 2 mm | 770 µm | INFINEON TECHNOLOGIES AG | compliant | 8542.39.00.01 | Infineon | 2 X 2 MM, GREEN, PLASTIC, TSNP-14 | |||||||||
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BGS12PN10E6327XTSA1
Infineon Technologies AG
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$0.4736 | Yes | Yes | Active | 2.85 V | CMOS | TELECOM CIRCUIT | 1 | OTHER | R-PBCC-N10 | 1 | 85 °C | -30 °C | NOT SPECIFIED | NOT SPECIFIED | 10 | PLASTIC/EPOXY | VQCCN | RECTANGULAR | CHIP CARRIER, VERY THIN PROFILE | YES | NO LEAD | 400 µm | BOTTOM | 1.1 mm | 1.5 mm | 400 µm | INFINEON TECHNOLOGIES AG | compliant | 8542.39.00.01 | Infineon | VQCCN, | ||||||||||
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BGA524N6E6327XTSA1
Infineon Technologies AG
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$0.4744 | Yes | Active | 1.8 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-N6 | e3 | 1 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 6 | PLASTIC/EPOXY | VSON | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | YES | Tin (Sn) | NO LEAD | 400 µm | DUAL | 700 µm | 1.1 mm | 400 µm | INFINEON TECHNOLOGIES AG | compliant | 8542.39.00.01 | Infineon | VSON, | ||||||||||
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BGSA12GN10E6327XTSA1
Infineon Technologies AG
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$0.4746 | Yes | Yes | Active | 2.85 V | TELECOM CIRCUIT | 1 | OTHER | R-XBCC-B10 | 1 | 85 °C | -30 °C | NOT SPECIFIED | NOT SPECIFIED | 10 | UNSPECIFIED | BCC | RECTANGULAR | CHIP CARRIER | YES | BUTT | 400 µm | BOTTOM | 1.1 mm | 1.5 mm | 400 µm | INFINEON TECHNOLOGIES AG | compliant | 8542.39.00.01 | Infineon | BCC, | |||||||||||
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BGSA14GN10E6327XTSA1
Infineon Technologies AG
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$0.4992 | Yes | Yes | Active | 2.85 V | TELECOM CIRCUIT | 1 | OTHER | R-XBCC-B10 | 1 | 85 °C | -30 °C | NOT SPECIFIED | NOT SPECIFIED | 10 | UNSPECIFIED | BCC | RECTANGULAR | CHIP CARRIER | YES | BUTT | 400 µm | BOTTOM | 1.1 mm | 1.5 mm | 400 µm | INFINEON TECHNOLOGIES AG | compliant | 8542.39.00.01 | Infineon | BCC, | |||||||||||
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ATA5577M3330C-DBQ
Microchip Technology Inc
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$0.5035 | Active | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XUUC-N2 | 85 °C | -40 °C | 2 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | YES | UNSPECIFIED | 524 µm | UPPER | 1 mm | 1.35 mm | 312 µm | MICROCHIP TECHNOLOGY INC | compliant | 5A991.G | 8523.59.00.00 | Microchip | DIE |