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51 - 60 of 44,989 results
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TCP-4112UB-DT
onsemi
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$0.4967 | Yes | Yes | Obsolete | TELECOM CIRCUIT | 1 | OTHER | R-PBGA-B4 | e4 | 1 | 85 °C | -30 °C | 260 | 4 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | NICKEL GOLD | BALL | 420 µm | BOTTOM | 609 µm | 626 µm | 345 µm | ONSEMI | 0.626 X 0.609 MM, 0.310 MM HEIGHT, ROHS COMPLIANT, WLCSP-4 | 567LN | compliant | 8542.39.00.01 | onsemi | ||||||||||||
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BA4116FV-E2
ROHM Semiconductor
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$0.5032 | Yes | Yes | Active | 5 V | TELECOM CIRCUIT | 1 | OTHER | R-PDSO-G16 | e3/e2 | Not Qualified | 85 °C | -30 °C | 260 | 10 | 16 | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | TIN/TIN COPPER | GULL WING | 650 µm | DUAL | 4.4 mm | 5 mm | 1.2 mm | ROHM CO LTD | 0.65 MM PITCH, SSOP-16 | compliant | 8542.39.00.01 | ROHM Semiconductor | SOIC | 16 | |||||||||
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ATA5577M2330C-DBQ
Microchip Technology Inc
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$0.5035 | Yes | Active | 3.6 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XUUC-N2 | Not Qualified | 85 °C | -40 °C | 2 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | NO | NO LEAD | UPPER | MICROCHIP TECHNOLOGY INC | DIE | compliant | 8523.59.00.00 | Microchip | 5A991.G | ||||||||||||||||||
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ATA5577M3330C-DBQ
Microchip Technology Inc
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$0.5035 | Active | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XUUC-N2 | 85 °C | -40 °C | 2 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | YES | UNSPECIFIED | 524 µm | UPPER | 1 mm | 1.35 mm | 312 µm | MICROCHIP TECHNOLOGY INC | DIE | compliant | 8523.59.00.00 | Microchip | 5A991.G | |||||||||||||||||
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ATA5577M233SC-DBQ
Microchip Technology Inc
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$0.5035 | Yes | Active | 3.6 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XUUC-N2 | 85 °C | -40 °C | 2 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | NO | NO LEAD | UPPER | MICROCHIP TECHNOLOGY INC | , DIE OR CHIP | compliant | 8523.59.00.00 | Microchip | 5A991.G | 2020-02-13 | ||||||||||||||||||
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BGA5H1BN6E6327XTSA1
Infineon Technologies AG
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$0.5075 | Yes | Active | 1.8 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XBCC-B6 | 1 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 6 | UNSPECIFIED | BCC | RECTANGULAR | CHIP CARRIER | YES | BUTT | 400 µm | BOTTOM | 700 µm | 1.1 mm | 400 µm | INFINEON TECHNOLOGIES AG | BCC, | compliant | 8542.39.00.01 | Infineon | 2018-04-13 | |||||||||||||
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BGA8V1BN6E6327XTSA1
Infineon Technologies AG
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$0.5623 | Yes | Active | 2.8 V | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-PDSO-N6 | 1 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 6 | PLASTIC/EPOXY | VSON | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | YES | NO LEAD | 400 µm | DUAL | 700 µm | 1.1 mm | 400 µm | INFINEON TECHNOLOGIES AG | TSNP-6 | compliant | 8542.39.00.01 | Infineon | ||||||||||||||
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BGS14PN10E6327XTSA1
Infineon Technologies AG
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$0.5712 | Yes | Yes | Active | 2.85 V | CMOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | R-XQCC-N10 | 1 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 10 | UNSPECIFIED | VQCCN | RECTANGULAR | CHIP CARRIER, VERY THIN PROFILE | YES | NO LEAD | 400 µm | QUAD | 1.1 mm | 1.5 mm | 400 µm | INFINEON TECHNOLOGIES AG | VQCCN, | compliant | 8542.39.00.01 | Infineon | ||||||||||||
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MAX7036GTP+
Maxim Integrated Products
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$0.5835 | Yes | Yes | Transferred | 3.3 V | CMOS | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-XQCC-N20 | e3 | 1 | 105 °C | -40 °C | 260 | 30 | 20 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 650 µm | QUAD | 5 mm | 5 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | compliant | 8542.39.00.01 | EAR99 | |||||||||||
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TRF37A73IDSGR
Texas Instruments
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$0.5873 | Yes | Yes | Active | 3.3 V | 1 | TELECOM CIRCUIT | 1 | INDUSTRIAL | S-PDSO-N8 | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | HVSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | DUAL | 2 mm | 2 mm | 800 µm | TEXAS INSTRUMENTS INC | WSON-8 | compliant | 8542.33.00.01 | Texas Instruments | EAR99 |