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Parametric » Telecommunication Circuits » Cordless Telephone ICs

Parametric results for: burst under Cordless Telephone ICs

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UPC8002GR-E1
 NEC Electronics Group 		Check for Price No Obsolete 3 V BIPOLAR CORDLESS TELEPHONE SUPPORT CIRCUIT 1 2.2 mA OTHER R-PDSO-G20 e0 Not Qualified 85 °C -30 °C 20 PLASTIC/EPOXY LSSOP RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 650 µm DUAL 4.4 mm 1.45 mm NEC ELECTRONICS CORP SSOP LSSOP, 20 compliant 8542.39.00.01
TB31262F
 Toshiba America Electronic Components 		Check for Price No No Active 3.6 V BICMOS CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 84 mA COMMERCIAL S-PQFP-G52 Not Qualified 70 °C -20 °C NOT SPECIFIED NOT SPECIFIED 52 PLASTIC/EPOXY QFP SQUARE FLATPACK YES GULL WING 650 µm QUAD 10 mm 10 mm 2.45 mm TOSHIBA CORP QFP QFP, 52 unknown 8542.39.00.01
UBA1706TS
 NXP Semiconductors 		Check for Price Obsolete 3.3 V BICMOS CORDLESS TELEPHONE SUPPORT CIRCUIT 1 3.2 µA COMMERCIAL EXTENDED R-PDSO-G24 e4 Not Qualified 75 °C -25 °C 24 PLASTIC/EPOXY SSOP SSOP24,.3 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES NICKEL PALLADIUM GOLD GULL WING 650 µm DUAL 5.3 mm 8.2 mm 2 mm NXP SEMICONDUCTORS SSOP SSOP, SSOP24,.3 24 compliant 8542.39.00.01
Z87L0116ASG
 Zilog Inc 		Check for Price Yes Transferred 3.3 V CMOS CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 55 mA COMMERCIAL S-PQFP-G144 Not Qualified 70 °C -20 °C NOT SPECIFIED NOT SPECIFIED 144 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES GULL WING 500 µm QUAD 20 mm 20 mm 1.6 mm ZILOG INC QFP LFQFP, 144 unknown 8542.39.00.01 Cordless Telephone Support Circuit
UPC8139GR-7JH
 NEC Electronics Group 		Check for Price No Obsolete 3 V BIPOLAR CORDLESS TELEPHONE SUPPORT CIRCUIT 1 49 mA COMMERCIAL EXTENDED R-PDSO-G30 e0 Not Qualified 80 °C -30 °C 30 PLASTIC/EPOXY TSSOP RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 500 µm DUAL 4.4 mm 7.8 mm 1.2 mm NEC ELECTRONICS CORP TSSOP TSSOP, 30 compliant 8542.39.00.01
U3600BM-MFN
 Atmel Corporation 		Check for Price Obsolete 3.6 V BIPOLAR CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 29 mA COMMERCIAL EXTENDED R-PDSO-G44 Not Qualified 75 °C -25 °C 44 PLASTIC/EPOXY SSOP RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES GULL WING 800 µm DUAL 7.4 mm 17.925 mm ATMEL CORP SOIC SSOP, 44 unknown 8542.39.00.01
ML5800SK-03
 RF Micro Devices Inc 		Check for Price Obsolete 3.3 V CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 90 mA COMMERCIAL S-PQCC-N32 e3 Not Qualified 60 °C -10 °C 32 PLASTIC/EPOXY HVQCCN SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE YES MATTE TIN NO LEAD 500 µm QUAD 5 mm 5 mm 1 mm RF MICRO DEVICES INC QFN HVQCCN, 32 unknown 8542.39.00.01
KS8803BD
 Samsung Semiconductor 		Check for Price No Obsolete 5 V CMOS CORDLESS TELEPHONE SUPPORT CIRCUIT 1 7 µA COMMERCIAL EXTENDED R-PDSO-G16 e0 Not Qualified 75 °C -30 °C 16 PLASTIC/EPOXY SOP SOP16,.25 RECTANGULAR SMALL OUTLINE YES TIN LEAD GULL WING 1.27 mm DUAL 3.95 mm 9.9 mm 1.95 mm SAMSUNG SEMICONDUCTOR INC SOIC SOP, SOP16,.25 16 compliant 8542.39.00.01
PCD5041H
 Philips Semiconductors 		Check for Price No Transferred CMOS 12 mA OTHER R-PQFP-G64 e0 Not Qualified 70 °C -25 °C 64 PLASTIC/EPOXY QFP QFP64,.7X.95,40 RECTANGULAR FLATPACK YES Tin/Lead (Sn/Pb) GULL WING 1 mm QUAD PHILIPS SEMICONDUCTORS QFP, QFP64,.7X.95,40 unknown 8542.39.00.01
TK10665QCMG
 TOKO Inc 		Check for Price Obsolete 2.6 V CORDLESS TELEPHONE SCRAMBLER/DESCRAMBLER 1 COMMERCIAL EXTENDED S-PQFP-G48 Not Qualified 75 °C -10 °C 48 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES GULL WING 500 µm QUAD 7 mm 7 mm 1.7 mm TOKO INC LFQFP, unknown 8542.39.00.01
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