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LTE3401HX
NXP Semiconductors
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$0.5732 | Yes | End Of Life | 1.8 V | RF AND BASEBAND CIRCUIT | 1 | INDUSTRIAL | R-PBCC-B6 | 1 | 85 °C | -40 °C | 260 | 6 | PLASTIC/EPOXY | BCC | RECTANGULAR | CHIP CARRIER | YES | BUTT | 400 µm | BOTTOM | 700 µm | 1.1 mm | 400 µm | NXP SEMICONDUCTORS | BCC, | compliant | 8542.33.00.01 | 2018-10-26 | NXP | |||||||||||||
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LMV225UR/NOPB
Texas Instruments
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$0.6157 | Yes | Yes | Active | 5 V | 1 | RF AND BASEBAND CIRCUIT | 1 | 8 mA | S-XBGA-B4 | e1 | 1 | 260 | 30 | 4 | UNSPECIFIED | VFBGA | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | BOTTOM | TEXAS INSTRUMENTS INC | compliant | 8542.39.00.01 | Texas Instruments | EAR99 | |||||||||||||||
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LMV225TL/NOPB
Texas Instruments
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$0.6157 | Yes | Yes | Active | 2.7 V | 1 | RF AND BASEBAND CIRCUIT | 1 | 8 mA | INDUSTRIAL | S-PBGA-B4 | e1 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 4 | PLASTIC/EPOXY | VFBGA | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 500 µm | BOTTOM | 1.014 mm | 1.014 mm | 675 µm | TEXAS INSTRUMENTS INC | SMD-4 | compliant | 8542.39.00.01 | Texas Instruments | EAR99 | DSBGA | 4 | ||||
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LMV228TLX/NOPB
Texas Instruments
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$0.6271 | Yes | Yes | Active | 5 V | 1 | RF AND BASEBAND CIRCUIT | 1 | 8 mA | INDUSTRIAL | R-XBGA-B4 | e1 | 1 | 85 °C | -40 °C | 260 | 30 | 4 | UNSPECIFIED | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | BOTTOM | TEXAS INSTRUMENTS INC | compliant | 8542.39.00.01 | Texas Instruments | EAR99 | ||||||||||||
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BGSX22G2A10E6327XTSA1
Infineon Technologies AG
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$0.6367 | Yes | Obsolete | CMOS | RF AND BASEBAND CIRCUIT | 1 | R-XBCC-B10 | 1 | 10 | UNSPECIFIED | BCC | RECTANGULAR | CHIP CARRIER | YES | BUTT | BOTTOM | INFINEON TECHNOLOGIES AG | ATSLP-10 | compliant | 8542.39.00.01 | Infineon | ||||||||||||||||||||||
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LMV225SD/NOPB
Texas Instruments
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$0.6399 | Yes | Yes | Active | 2.7 V | 1 | RF AND BASEBAND CIRCUIT | 1 | 8 mA | INDUSTRIAL | R-XDSO-N6 | e3 | Not Qualified | 1 | 85 °C | -40 °C | 260 | 30 | 6 | UNSPECIFIED | VSON | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 650 µm | DUAL | 2.2 mm | 2.5 mm | 800 µm | TEXAS INSTRUMENTS INC | LLP-6 | compliant | 8542.39.00.01 | Texas Instruments | EAR99 | SOIC | 6 | ||||
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LMV228SD/NOPB
Texas Instruments
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$0.6581 | Yes | Yes | Active | 5 V | 1 | RF AND BASEBAND CIRCUIT | 1 | 8 mA | R-PDSO-N6 | e3 | 1 | 260 | 30 | 6 | PLASTIC/EPOXY | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | DUAL | TEXAS INSTRUMENTS INC | compliant | 8542.39.00.01 | Texas Instruments | EAR99 | |||||||||||||||
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LMV226TLX/NOPB
Texas Instruments
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$0.6780 | Yes | Yes | Active | 5 V | 1 | RF AND BASEBAND CIRCUIT | 1 | 8 mA | INDUSTRIAL | R-XBGA-B4 | e1 | 1 | 85 °C | -40 °C | 260 | 30 | 4 | UNSPECIFIED | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | BOTTOM | TEXAS INSTRUMENTS INC | compliant | 8542.39.00.01 | Texas Instruments | EAR99 | ||||||||||||
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LMV228TL/NOPB
Texas Instruments
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$0.6935 | Yes | Yes | Active | 5 V | 1 | RF AND BASEBAND CIRCUIT | 1 | 8 mA | INDUSTRIAL | R-XBGA-B4 | e1 | 1 | 85 °C | -40 °C | 260 | 30 | 4 | UNSPECIFIED | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | BOTTOM | TEXAS INSTRUMENTS INC | VFBGA, | compliant | 8542.39.00.01 | Texas Instruments | EAR99 | |||||||||||
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LMV226TL/NOPB
Texas Instruments
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$0.7569 | Yes | Yes | Active | 5 V | 1 | RF AND BASEBAND CIRCUIT | 1 | 8 mA | INDUSTRIAL | R-XBGA-B4 | e1 | 1 | 85 °C | -40 °C | 260 | 30 | 4 | UNSPECIFIED | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | BOTTOM | TEXAS INSTRUMENTS INC | compliant | 8542.39.00.01 | Texas Instruments | EAR99 |