Parametric results for: FT4232H under Serial IO/Communication Controllers

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Select parts from the table below to compare.
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Select Parts Part Number
MCP2515T-E/ST
Microchip Technology Inc
NT2H1311F0DTLH
NXP Semiconductors
MC68360AI25L
NXP Semiconductors
SC16C554BIB64,157
NXP Semiconductors
MCP2515T-E/SO
Microchip Technology Inc
MCP2515-E/P
Microchip Technology Inc
USB3280-AEZG
Microchip Technology Inc
SC16IS750IBS,128
NXP Semiconductors
LAN8700C-AEZG
Microchip Technology Inc
SC16IS740IPW,128
NXP Semiconductors
Most Relevant Technical Compliance Operating Conditions Physical Dimensions Other
Composite Price
Pbfree Code
Rohs Code
Part Life Cycle Code
RAM (words) Bus Compatibility External Data Bus Width
Address Bus Width Data Transfer Rate-Max
Clock Frequency-Max
Number of I/O Lines Surface Mount
Supply Voltage-Nom uPs/uCs/Peripheral ICs Type
Technology Additional Feature
Boundary Scan
Communication Protocol Data Encoding/Decoding Method
Low Power Mode
Number of DMA Channels Number of Serial I/Os On Chip Data RAM Width
Supply Current-Max
Supply Voltage-Max
Supply Voltage-Min
Temperature Grade
JESD-30 Code
Qualification Status
JESD-609 Code
Moisture Sensitivity Level
Operating Temperature-Max
Operating Temperature-Min
Peak Reflow Temperature (Cel)
Screening Level
Time@Peak Reflow Temperature-Max (s)
Number of Terminals
Package Body Material
Package Code
Package Equivalence Code
Package Shape
Package Style
Terminal Finish
Terminal Form
Terminal Pitch
Terminal Position
Seated Height-Max
Width
Length
Ihs Manufacturer
Part Package Code
Package Description
Pin Count
Reach Compliance Code
ECCN Code
HTS Code
Samacsys Manufacturer
Manufacturer Package Code
Yes Yes Active CAN, SPI 0.125 MBps 40 MHz YES 5 V SERIAL IO/COMMUNICATION CONTROLLER, SERIAL CMOS NO SYNC; BIT ;BYTE NRZ YES 1 5.5 V 4.5 V AUTOMOTIVE R-PDSO-G20 Not Qualified e3 1 125 °C -40 °C 20 PLASTIC/EPOXY TSSOP TSSOP20,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Matte Tin (Sn) GULL WING 650 µm DUAL 1.2 mm 4.4 mm 6.5 mm MICROCHIP TECHNOLOGY INC TSSOP 4.40 MM, LEAD FREE, PLASTIC, TSSOP-20 20 compliant EAR99 8542.39.00.01 Microchip
Yes Active YES 5 V SERIAL IO/COMMUNICATION CONTROLLER, SERIAL NO ASYNC, BIT 1 5.25 V 4.75 V OTHER Not Qualified e4 1 70 °C -25 °C 260 30 4 PLASTIC/EPOXY VFBGA SOLCC4,.08,20 Nickel/Palladium/Gold (Ni/Pd/Au) NXP SEMICONDUCTORS SON 4 compliant NXP SOT1312-1
Yes Obsolete 2560 68000 32 32 10 MBps 25 MHz 46 YES 3 V SERIAL IO/COMMUNICATION CONTROLLER, LAN CMOS ALSO OPERATES AT 5 V SUPPLY YES ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM... more YES 2 4 8 250 mA 3.3 V 2.7 V INDUSTRIAL S-PQFP-G240 e3 3 85 °C -40 °C 260 40 240 PLASTIC/EPOXY QFP QFP240,1.3SQ,20 SQUARE FLATPACK Tin (Sn) GULL WING 500 µm QUAD 4.1 mm 32 mm 32 mm NXP SEMICONDUCTORS QFP-240 compliant 3A991.A.2 8542.31.00.01 NXP
Yes Obsolete 8 3 0.625 MBps 80 MHz YES 3.3 V SERIAL IO/COMMUNICATION CONTROLLER, SERIAL CMOS ALSO OPERATES AT 2.5V AND 5V SUPPLY NO ASYNC, BIT NO 4 3.63 V 2.97 V INDUSTRIAL S-PQFP-G64 Not Qualified e3 1 85 °C -40 °C 260 30 64 PLASTIC/EPOXY LFQFP QFP64,.47SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH Tin (Sn) GULL WING 500 µm QUAD 1.6 mm 10 mm 10 mm NXP SEMICONDUCTORS QFP 10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-314-2, LQFP-64 64 compliant 8542.31.00.01 NXP SOT314-2
Yes Yes Active CAN, SPI 0.125 MBps 40 MHz YES 5 V SERIAL IO/COMMUNICATION CONTROLLER, SERIAL CMOS NO SYNC; BIT ;BYTE NRZ YES 1 5.5 V 4.5 V AUTOMOTIVE R-PDSO-G18 Not Qualified e3 1 125 °C -40 °C 260 18 PLASTIC/EPOXY SOP SOP18,.4 RECTANGULAR SMALL OUTLINE Matte Tin (Sn) GULL WING 1.27 mm DUAL 2.65 mm 7.5 mm 11.55 mm MICROCHIP TECHNOLOGY INC SOIC 7.50 MM, LEAD FREE, PLASTIC, SOIC-18 18 compliant EAR99 8542.39.00.01 Microchip
Yes Yes Active 14 SPI 0.125 MBps 40 MHz NO 5 V SERIAL IO/COMMUNICATION CONTROLLER, CAN CMOS NO SYNC; BIT ;BYTE NRZ YES 1 8 10 mA 5.5 V 4.5 V AUTOMOTIVE R-PDIP-T18 e3 125 °C -40 °C 18 PLASTIC/EPOXY DIP DIP18,.3 RECTANGULAR IN-LINE Matte Tin (Sn) THROUGH-HOLE 2.54 mm DUAL 5.334 mm 7.62 mm 22.86 mm MICROCHIP TECHNOLOGY INC DIP DIP-18 18 compliant EAR99 8542.39.00.01 Microchip
Yes Active USB 8 60 MBps 24 MHz YES 3.3 V SERIAL IO/COMMUNICATION CONTROLLER, SERIAL CMOS 24 MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE NO ASYNC, BIT; SYNC, BYTE NRZI YES 2 3.6 V 3 V INDUSTRIAL S-PQCC-N36 e3 3 85 °C -40 °C 260 TS 16949 36 PLASTIC/EPOXY HVQCCN LCC36,.24SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Matte Tin (Sn) NO LEAD 500 µm QUAD 1 mm 6 mm 6 mm MICROCHIP TECHNOLOGY INC QFN-36 compliant EAR99 8542.31.00.01 Microchip
Yes Active 2 0.625 MBps 80 MHz YES 3.3 V SERIAL IO/COMMUNICATION CONTROLLER, SERIAL CMOS ALSO OPERATES AT 2.5V SUPPLY NO ASYNC, BIT YES 1 3.6 V 3 V INDUSTRIAL S-PQCC-N24 Not Qualified e4 1 85 °C -40 °C 260 30 24 PLASTIC/EPOXY HVQCCN LCC24,.16SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Nickel/Palladium/Gold (Ni/Pd/Au) NO LEAD 500 µm QUAD 1 mm 4 mm 4 mm NXP SEMICONDUCTORS QFN 4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT616-3, HVQFN24 24 compliant 8542.31.00.01 NXP SOT616-3
Yes Active 12.5 MBps 25 MHz YES 1.8 V SERIAL IO/COMMUNICATION CONTROLLER, LAN CMOS NO ASYNC, BIT; SYNC, BYTE NRZI; BIPH-LEVEL(MANCHESTER) YES 4 41.3 mA 3.6 V 3 V COMMERCIAL S-PQCC-N36 Not Qualified e3 70 °C TS 16949 36 PLASTIC/EPOXY HVQCCN LCC36,.24SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Matte Tin (Sn) NO LEAD 500 µm QUAD 1 mm 6 mm 6 mm MICROCHIP TECHNOLOGY INC QFN 6 X 6 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, QFN-36 36 compliant EAR99 8542.39.00.01 Microchip
Yes Active 2 0.625 MBps 80 MHz YES 3.3 V SERIAL IO/COMMUNICATION CONTROLLER, SERIAL CMOS ALSO OPERATES AT 2.5V SUPPLY NO ASYNC, BIT YES 1 3.6 V 3 V INDUSTRIAL R-PDSO-G16 Not Qualified e4 1 85 °C -40 °C 260 30 16 PLASTIC/EPOXY TSSOP TSSOP16,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Nickel/Palladium/Gold (Ni/Pd/Au) GULL WING 650 µm DUAL 1.1 mm 4.4 mm 5 mm NXP SEMICONDUCTORS TSSOP 4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16 16 compliant 8542.31.00.01 NXP SOT403-1
Compare
MCP2515T-E/ST
Microchip Technology Inc
$0.3836 Yes Yes Active CAN, SPI 0.125 MBps 40 MHz YES 5 V SERIAL IO/COMMUNICATION CONTROLLER, SERIAL CMOS NO SYNC; BIT ;BYTE NRZ YES 1 5.5 V 4.5 V AUTOMOTIVE R-PDSO-G20 Not Qualified e3 1 125 °C -40 °C 20 PLASTIC/EPOXY TSSOP TSSOP20,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Matte Tin (Sn) GULL WING 650 µm DUAL 1.2 mm 4.4 mm 6.5 mm MICROCHIP TECHNOLOGY INC TSSOP 4.40 MM, LEAD FREE, PLASTIC, TSSOP-20 20 compliant EAR99 8542.39.00.01 Microchip
NT2H1311F0DTLH
NXP Semiconductors
$0.7084 Yes Active YES 5 V SERIAL IO/COMMUNICATION CONTROLLER, SERIAL NO ASYNC, BIT 1 5.25 V 4.75 V OTHER Not Qualified e4 1 70 °C -25 °C 260 30 4 PLASTIC/EPOXY VFBGA SOLCC4,.08,20 Nickel/Palladium/Gold (Ni/Pd/Au) NXP SEMICONDUCTORS SON 4 compliant NXP SOT1312-1
MC68360AI25L
NXP Semiconductors
$1.0000 Yes Obsolete 2560 68000 32 32 10 MBps 25 MHz 46 YES 3 V SERIAL IO/COMMUNICATION CONTROLLER, LAN CMOS ALSO OPERATES AT 5 V SUPPLY YES ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM... more YES 2 4 8 250 mA 3.3 V 2.7 V INDUSTRIAL S-PQFP-G240 e3 3 85 °C -40 °C 260 40 240 PLASTIC/EPOXY QFP QFP240,1.3SQ,20 SQUARE FLATPACK Tin (Sn) GULL WING 500 µm QUAD 4.1 mm 32 mm 32 mm NXP SEMICONDUCTORS QFP-240 compliant 3A991.A.2 8542.31.00.01 NXP
SC16C554BIB64,157
NXP Semiconductors
$1.0000 Yes Obsolete 8 3 0.625 MBps 80 MHz YES 3.3 V SERIAL IO/COMMUNICATION CONTROLLER, SERIAL CMOS ALSO OPERATES AT 2.5V AND 5V SUPPLY NO ASYNC, BIT NO 4 3.63 V 2.97 V INDUSTRIAL S-PQFP-G64 Not Qualified e3 1 85 °C -40 °C 260 30 64 PLASTIC/EPOXY LFQFP QFP64,.47SQ,20 SQUARE FLATPACK, LOW PROFILE, FINE PITCH Tin (Sn) GULL WING 500 µm QUAD 1.6 mm 10 mm 10 mm NXP SEMICONDUCTORS QFP 10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-314-2, LQFP-64 64 compliant 8542.31.00.01 NXP SOT314-2
MCP2515T-E/SO
Microchip Technology Inc
$1.0000 Yes Yes Active CAN, SPI 0.125 MBps 40 MHz YES 5 V SERIAL IO/COMMUNICATION CONTROLLER, SERIAL CMOS NO SYNC; BIT ;BYTE NRZ YES 1 5.5 V 4.5 V AUTOMOTIVE R-PDSO-G18 Not Qualified e3 1 125 °C -40 °C 260 18 PLASTIC/EPOXY SOP SOP18,.4 RECTANGULAR SMALL OUTLINE Matte Tin (Sn) GULL WING 1.27 mm DUAL 2.65 mm 7.5 mm 11.55 mm MICROCHIP TECHNOLOGY INC SOIC 7.50 MM, LEAD FREE, PLASTIC, SOIC-18 18 compliant EAR99 8542.39.00.01 Microchip
MCP2515-E/P
Microchip Technology Inc
$1.0000 Yes Yes Active 14 SPI 0.125 MBps 40 MHz NO 5 V SERIAL IO/COMMUNICATION CONTROLLER, CAN CMOS NO SYNC; BIT ;BYTE NRZ YES 1 8 10 mA 5.5 V 4.5 V AUTOMOTIVE R-PDIP-T18 e3 125 °C -40 °C 18 PLASTIC/EPOXY DIP DIP18,.3 RECTANGULAR IN-LINE Matte Tin (Sn) THROUGH-HOLE 2.54 mm DUAL 5.334 mm 7.62 mm 22.86 mm MICROCHIP TECHNOLOGY INC DIP DIP-18 18 compliant EAR99 8542.39.00.01 Microchip
USB3280-AEZG
Microchip Technology Inc
$1.1386 Yes Active USB 8 60 MBps 24 MHz YES 3.3 V SERIAL IO/COMMUNICATION CONTROLLER, SERIAL CMOS 24 MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE NO ASYNC, BIT; SYNC, BYTE NRZI YES 2 3.6 V 3 V INDUSTRIAL S-PQCC-N36 e3 3 85 °C -40 °C 260 TS 16949 36 PLASTIC/EPOXY HVQCCN LCC36,.24SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Matte Tin (Sn) NO LEAD 500 µm QUAD 1 mm 6 mm 6 mm MICROCHIP TECHNOLOGY INC QFN-36 compliant EAR99 8542.31.00.01 Microchip
SC16IS750IBS,128
NXP Semiconductors
$1.1519 Yes Active 2 0.625 MBps 80 MHz YES 3.3 V SERIAL IO/COMMUNICATION CONTROLLER, SERIAL CMOS ALSO OPERATES AT 2.5V SUPPLY NO ASYNC, BIT YES 1 3.6 V 3 V INDUSTRIAL S-PQCC-N24 Not Qualified e4 1 85 °C -40 °C 260 30 24 PLASTIC/EPOXY HVQCCN LCC24,.16SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Nickel/Palladium/Gold (Ni/Pd/Au) NO LEAD 500 µm QUAD 1 mm 4 mm 4 mm NXP SEMICONDUCTORS QFN 4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT616-3, HVQFN24 24 compliant 8542.31.00.01 NXP SOT616-3
LAN8700C-AEZG
Microchip Technology Inc
$1.3126 Yes Active 12.5 MBps 25 MHz YES 1.8 V SERIAL IO/COMMUNICATION CONTROLLER, LAN CMOS NO ASYNC, BIT; SYNC, BYTE NRZI; BIPH-LEVEL(MANCHESTER) YES 4 41.3 mA 3.6 V 3 V COMMERCIAL S-PQCC-N36 Not Qualified e3 70 °C TS 16949 36 PLASTIC/EPOXY HVQCCN LCC36,.24SQ,20 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Matte Tin (Sn) NO LEAD 500 µm QUAD 1 mm 6 mm 6 mm MICROCHIP TECHNOLOGY INC QFN 6 X 6 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, QFN-36 36 compliant EAR99 8542.39.00.01 Microchip
SC16IS740IPW,128
NXP Semiconductors
$1.5298 Yes Active 2 0.625 MBps 80 MHz YES 3.3 V SERIAL IO/COMMUNICATION CONTROLLER, SERIAL CMOS ALSO OPERATES AT 2.5V SUPPLY NO ASYNC, BIT YES 1 3.6 V 3 V INDUSTRIAL R-PDSO-G16 Not Qualified e4 1 85 °C -40 °C 260 30 16 PLASTIC/EPOXY TSSOP TSSOP16,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Nickel/Palladium/Gold (Ni/Pd/Au) GULL WING 650 µm DUAL 1.1 mm 4.4 mm 5 mm NXP SEMICONDUCTORS TSSOP 4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16 16 compliant 8542.31.00.01 NXP SOT403-1