Parametric results for: ADA3034-J under Microprocessors

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Select parts from the table below to compare.
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Select Parts Part Number
MC8640DTVU1067NE
Freescale Semiconductor
QU80386EXTC33
Intel Corporation
MPC8548CVTAQGD
Freescale Semiconductor
AT91SAM9G20B-CU-999
Microchip Technology Inc
SAM9X60D1GT-I/4FB
Microchip Technology Inc
SAM9X70-I/4PB
Microchip Technology Inc
FS32R372SDK0MMM
NXP Semiconductors
ATSAMA5D27C-CNR
Microchip Technology Inc
ATSAMA5D36A-CNR
Microchip Technology Inc
ATSAMA5D26C-CNR
Microchip Technology Inc
Most Relevant Technical Compliance Operating Conditions Physical Dimensions Other
Composite Price
Pbfree Code
Rohs Code
Part Life Cycle Code
Bit Size Speed RAM (words) External Data Bus Width
Address Bus Width Clock Frequency-Max
Surface Mount
Supply Voltage-Nom uPs/uCs/Peripheral ICs Type
Technology Additional Feature
Boundary Scan
Format
Integrated Cache
Low Power Mode
Number of DMA Channels Number of External Interrupts Number of Serial I/Os On Chip Data RAM Width
Supply Current-Max
Supply Voltage-Max
Supply Voltage-Min
Temperature Grade
JESD-30 Code
Qualification Status
JESD-609 Code
Moisture Sensitivity Level
Operating Temperature-Max
Operating Temperature-Min
Peak Reflow Temperature (Cel)
Screening Level
Time@Peak Reflow Temperature-Max (s)
Number of Terminals
Package Body Material
Package Code
Package Equivalence Code
Package Shape
Package Style
Terminal Finish
Terminal Form
Terminal Pitch
Terminal Position
Seated Height-Max
Width
Length
Ihs Manufacturer
Part Package Code
Package Description
Pin Count
Reach Compliance Code
ECCN Code
HTS Code
Samacsys Manufacturer
Date Of Intro
No Yes Obsolete 32 1.067 GHz 32 32 166.66 MHz YES 950 mV MICROPROCESSOR CMOS YES FLOATING POINT YES YES 1 V 900 mV INDUSTRIAL S-CBGA-B1023 Not Qualified e2 3 105 °C -40 °C 245 30 1023 CERAMIC, METAL-SEALED COFIRED BGA BGA1023,32X32,40 SQUARE GRID ARRAY Tin/Silver (Sn/Ag) BALL 1 mm BOTTOM 2.97 mm 33 mm 33 mm FREESCALE SEMICONDUCTOR INC BGA 33 X 33 MM, ROHS COMPLIANT, CERAMIC, FCBGA-1023 1023 not_compliant 3A991.A.1 8542.31.00.01
Yes Obsolete 32 33 MHz 0 16 26 25 MHz YES 5 V MICROPROCESSOR, RISC CMOS YES FIXED POINT NO YES 2 12 3 320 mA 5.5 V 4.5 V S-PQFP-G132 Not Qualified 117 °C -40 °C 132 PLASTIC/EPOXY BQFP SPQFP132,1.1SQ SQUARE FLATPACK, BUMPER GULL WING 635 µm QUAD 4.57 mm 24.13 mm 24.13 mm INTEL CORP TQFP-144 unknown 8542.31.00.01 Intel
No Yes Obsolete YES 1.1 V SoC CMOS 1.155 V 1.045 V S-PBGA-B783 Not Qualified e2 3 105 °C -40 °C 260 40 783 PLASTIC/EPOXY BGA BGA783,28X28,40 SQUARE GRID ARRAY Tin/Silver (Sn/Ag) BALL 1 mm BOTTOM 3.38 mm 29 mm 29 mm FREESCALE SEMICONDUCTOR INC BGA-783 not_compliant 3A991.A.2 8542.31.00.01
Active 32 400 MHz 32768 32 26 50 MHz YES 1 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 24 3 1 8 1.1 V 900 mV INDUSTRIAL S-PBGA-B217 85 °C -40 °C NOT SPECIFIED TS 16949 NOT SPECIFIED 217 PLASTIC/EPOXY LFBGA BGA217,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH BALL 800 µm BOTTOM 1.4 mm 15 mm 15 mm MICROCHIP TECHNOLOGY INC LFBGA, BGA217,17X17,32 compliant 3A991.A.2 8542.31.00.01 Microchip
Active 600 MHz 69632 16 6 50 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS 1-Gbit DDR2--SDRAM AVAILABLE YES FIXED POINT YES YES 16 8 1.9 V 1.7 V INDUSTRIAL S-PBGA-B233 e1 3 85 °C -40 °C 260 30 233 PLASTIC/EPOXY TFBGA BGA233,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 14 mm 14 mm MICROCHIP TECHNOLOGY INC TFBGA-233 compliant 5A992.C 8542.31.00.01 Microchip 2019-09-23
Active 32 800 MHz 69632 16 23 50 MHz YES MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 16 1 13 8 3 mA 1.21 V 1.14 V S-PBGA-B240 85 °C -40 °C 240 PLASTIC/EPOXY LFBGA BGA240,16X16,25 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH BALL 650 µm BOTTOM MICROCHIP TECHNOLOGY INC unknown 3A991.A.2 8542.31.00.01 Microchip
Obsolete 32 240 MHz 1048576 40 MHz YES 1.25 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 32 1 8 1.1 A 1.31 V 1.19 V S-PBGA-B257 125 °C -40 °C ISO 26262 257 PLASTIC/EPOXY LFBGA BGA257,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH BALL 800 µm BOTTOM 1.51 mm 14 mm 14 mm NXP SEMICONDUCTORS unknown 3A991.A.2 8542.31.00.01 2018-08-24
Active 32 500 MHz 131072 16 26 24 MHz YES 1.25 V MICROPROCESSOR, RISC CMOS ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED YES FLOATING POINT YES YES 32 1 8 1.32 V 1.2 V INDUSTRIAL S-PBGA-B289 105 °C -40 °C NOT SPECIFIED NOT SPECIFIED 289 PLASTIC/EPOXY LFBGA BGA289,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH BALL 800 µm BOTTOM 1.4 mm 14 mm 14 mm MICROCHIP TECHNOLOGY INC LFBGA, BGA289,17X17,32 compliant 5A992.C 8542.31.00.01 Microchip 2017-05-22
Yes Yes Active 32 536 MHz 131072 16 26 48 MHz YES 1.2 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 39 1 10 8 1.32 V 1.08 V INDUSTRIAL S-PBGA-B324 Not Qualified e1 105 °C -40 °C 324 PLASTIC/EPOXY LFBGA BGA324,18X18,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 1.4 mm 15 mm 15 mm MICROCHIP TECHNOLOGY INC LFBGA, BGA324,18X18,32 compliant 5A992.C 8542.31.00.01 Microchip
Active 32 500 MHz 131072 16 26 24 MHz YES 1.25 V MICROPROCESSOR, RISC CMOS ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED YES FLOATING POINT YES YES 32 1 8 1.32 V 1.2 V INDUSTRIAL S-PBGA-B289 105 °C -40 °C NOT SPECIFIED NOT SPECIFIED 289 PLASTIC/EPOXY LFBGA BGA289,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH BALL 800 µm BOTTOM 1.4 mm 14 mm 14 mm MICROCHIP TECHNOLOGY INC LFBGA, BGA289,17X17,32 compliant 5A992.C 8542.31.00.01 Microchip 2017-05-22
Compare
MC8640DTVU1067NE
Freescale Semiconductor
$0.1395 No Yes Obsolete 32 1.067 GHz 32 32 166.66 MHz YES 950 mV MICROPROCESSOR CMOS YES FLOATING POINT YES YES 1 V 900 mV INDUSTRIAL S-CBGA-B1023 Not Qualified e2 3 105 °C -40 °C 245 30 1023 CERAMIC, METAL-SEALED COFIRED BGA BGA1023,32X32,40 SQUARE GRID ARRAY Tin/Silver (Sn/Ag) BALL 1 mm BOTTOM 2.97 mm 33 mm 33 mm FREESCALE SEMICONDUCTOR INC BGA 33 X 33 MM, ROHS COMPLIANT, CERAMIC, FCBGA-1023 1023 not_compliant 3A991.A.1 8542.31.00.01
QU80386EXTC33
Intel Corporation
$0.3110 Yes Obsolete 32 33 MHz 0 16 26 25 MHz YES 5 V MICROPROCESSOR, RISC CMOS YES FIXED POINT NO YES 2 12 3 320 mA 5.5 V 4.5 V S-PQFP-G132 Not Qualified 117 °C -40 °C 132 PLASTIC/EPOXY BQFP SPQFP132,1.1SQ SQUARE FLATPACK, BUMPER GULL WING 635 µm QUAD 4.57 mm 24.13 mm 24.13 mm INTEL CORP TQFP-144 unknown 8542.31.00.01 Intel
MPC8548CVTAQGD
Freescale Semiconductor
$0.3167 No Yes Obsolete YES 1.1 V SoC CMOS 1.155 V 1.045 V S-PBGA-B783 Not Qualified e2 3 105 °C -40 °C 260 40 783 PLASTIC/EPOXY BGA BGA783,28X28,40 SQUARE GRID ARRAY Tin/Silver (Sn/Ag) BALL 1 mm BOTTOM 3.38 mm 29 mm 29 mm FREESCALE SEMICONDUCTOR INC BGA-783 not_compliant 3A991.A.2 8542.31.00.01
AT91SAM9G20B-CU-999
Microchip Technology Inc
$0.9814 Active 32 400 MHz 32768 32 26 50 MHz YES 1 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 24 3 1 8 1.1 V 900 mV INDUSTRIAL S-PBGA-B217 85 °C -40 °C NOT SPECIFIED TS 16949 NOT SPECIFIED 217 PLASTIC/EPOXY LFBGA BGA217,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH BALL 800 µm BOTTOM 1.4 mm 15 mm 15 mm MICROCHIP TECHNOLOGY INC LFBGA, BGA217,17X17,32 compliant 3A991.A.2 8542.31.00.01 Microchip
SAM9X60D1GT-I/4FB
Microchip Technology Inc
$1.0000 Active 600 MHz 69632 16 6 50 MHz YES 1.8 V MICROPROCESSOR, RISC CMOS 1-Gbit DDR2--SDRAM AVAILABLE YES FIXED POINT YES YES 16 8 1.9 V 1.7 V INDUSTRIAL S-PBGA-B233 e1 3 85 °C -40 °C 260 30 233 PLASTIC/EPOXY TFBGA BGA233,17X17,32 SQUARE GRID ARRAY, THIN PROFILE, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 1.2 mm 14 mm 14 mm MICROCHIP TECHNOLOGY INC TFBGA-233 compliant 5A992.C 8542.31.00.01 Microchip 2019-09-23
SAM9X70-I/4PB
Microchip Technology Inc
$1.0000 Active 32 800 MHz 69632 16 23 50 MHz YES MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 16 1 13 8 3 mA 1.21 V 1.14 V S-PBGA-B240 85 °C -40 °C 240 PLASTIC/EPOXY LFBGA BGA240,16X16,25 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH BALL 650 µm BOTTOM MICROCHIP TECHNOLOGY INC unknown 3A991.A.2 8542.31.00.01 Microchip
FS32R372SDK0MMM
NXP Semiconductors
$1.0000 Obsolete 32 240 MHz 1048576 40 MHz YES 1.25 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 32 1 8 1.1 A 1.31 V 1.19 V S-PBGA-B257 125 °C -40 °C ISO 26262 257 PLASTIC/EPOXY LFBGA BGA257,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH BALL 800 µm BOTTOM 1.51 mm 14 mm 14 mm NXP SEMICONDUCTORS unknown 3A991.A.2 8542.31.00.01 2018-08-24
ATSAMA5D27C-CNR
Microchip Technology Inc
$1.0000 Active 32 500 MHz 131072 16 26 24 MHz YES 1.25 V MICROPROCESSOR, RISC CMOS ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED YES FLOATING POINT YES YES 32 1 8 1.32 V 1.2 V INDUSTRIAL S-PBGA-B289 105 °C -40 °C NOT SPECIFIED NOT SPECIFIED 289 PLASTIC/EPOXY LFBGA BGA289,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH BALL 800 µm BOTTOM 1.4 mm 14 mm 14 mm MICROCHIP TECHNOLOGY INC LFBGA, BGA289,17X17,32 compliant 5A992.C 8542.31.00.01 Microchip 2017-05-22
ATSAMA5D36A-CNR
Microchip Technology Inc
$1.0000 Yes Yes Active 32 536 MHz 131072 16 26 48 MHz YES 1.2 V MICROPROCESSOR, RISC CMOS YES FLOATING POINT YES YES 39 1 10 8 1.32 V 1.08 V INDUSTRIAL S-PBGA-B324 Not Qualified e1 105 °C -40 °C 324 PLASTIC/EPOXY LFBGA BGA324,18X18,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH TIN SILVER COPPER BALL 800 µm BOTTOM 1.4 mm 15 mm 15 mm MICROCHIP TECHNOLOGY INC LFBGA, BGA324,18X18,32 compliant 5A992.C 8542.31.00.01 Microchip
ATSAMA5D26C-CNR
Microchip Technology Inc
$1.0000 Active 32 500 MHz 131072 16 26 24 MHz YES 1.25 V MICROPROCESSOR, RISC CMOS ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED YES FLOATING POINT YES YES 32 1 8 1.32 V 1.2 V INDUSTRIAL S-PBGA-B289 105 °C -40 °C NOT SPECIFIED NOT SPECIFIED 289 PLASTIC/EPOXY LFBGA BGA289,17X17,32 SQUARE GRID ARRAY, LOW PROFILE, FINE PITCH BALL 800 µm BOTTOM 1.4 mm 14 mm 14 mm MICROCHIP TECHNOLOGY INC LFBGA, BGA289,17X17,32 compliant 5A992.C 8542.31.00.01 Microchip 2017-05-22