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Select Parts | Part Number |
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MC8640DTVU1067NE
Freescale Semiconductor
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QU80386EXTC33
Intel Corporation
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MPC8548CVTAQGD
Freescale Semiconductor
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AT91SAM9G20B-CU-999
Microchip Technology Inc
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SAM9X60D1GT-I/4FB
Microchip Technology Inc
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SAM9X70-I/4PB
Microchip Technology Inc
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FS32R372SDK0MMM
NXP Semiconductors
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ATSAMA5D27C-CNR
Microchip Technology Inc
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ATSAMA5D36A-CNR
Microchip Technology Inc
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ATSAMA5D26C-CNR
Microchip Technology Inc
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Composite Price
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Pbfree Code
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Rohs Code
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Part Life Cycle Code
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Bit Size | Speed | RAM (words) |
External Data Bus Width
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Address Bus Width |
Clock Frequency-Max
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Surface Mount
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Supply Voltage-Nom |
uPs/uCs/Peripheral ICs Type
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Technology |
Additional Feature
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Boundary Scan
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Format
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Integrated Cache
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Low Power Mode
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Number of DMA Channels | Number of External Interrupts | Number of Serial I/Os |
On Chip Data RAM Width
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Supply Current-Max
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Supply Voltage-Max
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Supply Voltage-Min
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Temperature Grade
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JESD-30 Code
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Qualification Status
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JESD-609 Code
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Moisture Sensitivity Level
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Operating Temperature-Max
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Operating Temperature-Min
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Peak Reflow Temperature (Cel)
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Screening Level
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Time@Peak Reflow Temperature-Max (s)
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Number of Terminals
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Package Body Material
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Package Code
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Package Equivalence Code
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Package Shape
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Package Style
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Terminal Finish
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Terminal Form
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Terminal Pitch
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Terminal Position
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Seated Height-Max
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Width
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Length
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Ihs Manufacturer
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Part Package Code
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Package Description
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Pin Count
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Reach Compliance Code
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ECCN Code
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HTS Code
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Samacsys Manufacturer
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Date Of Intro
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No | Yes | Obsolete | 32 | 1.067 GHz | 32 | 32 | 166.66 MHz | YES | 950 mV | MICROPROCESSOR | CMOS | YES | FLOATING POINT | YES | YES | 1 V | 900 mV | INDUSTRIAL | S-CBGA-B1023 | Not Qualified | e2 | 3 | 105 °C | -40 °C | 245 | 30 | 1023 | CERAMIC, METAL-SEALED COFIRED | BGA | BGA1023,32X32,40 | SQUARE | GRID ARRAY | Tin/Silver (Sn/Ag) | BALL | 1 mm | BOTTOM | 2.97 mm | 33 mm | 33 mm | FREESCALE SEMICONDUCTOR INC | BGA | 33 X 33 MM, ROHS COMPLIANT, CERAMIC, FCBGA-1023 | 1023 | not_compliant | 3A991.A.1 | 8542.31.00.01 | |||||||||||
Yes | Obsolete | 32 | 33 MHz | 0 | 16 | 26 | 25 MHz | YES | 5 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | NO | YES | 2 | 12 | 3 | 320 mA | 5.5 V | 4.5 V | S-PQFP-G132 | Not Qualified | 117 °C | -40 °C | 132 | PLASTIC/EPOXY | BQFP | SPQFP132,1.1SQ | SQUARE | FLATPACK, BUMPER | GULL WING | 635 µm | QUAD | 4.57 mm | 24.13 mm | 24.13 mm | INTEL CORP | TQFP-144 | unknown | 8542.31.00.01 | Intel | |||||||||||||||
No | Yes | Obsolete | YES | 1.1 V | SoC | CMOS | 1.155 V | 1.045 V | S-PBGA-B783 | Not Qualified | e2 | 3 | 105 °C | -40 °C | 260 | 40 | 783 | PLASTIC/EPOXY | BGA | BGA783,28X28,40 | SQUARE | GRID ARRAY | Tin/Silver (Sn/Ag) | BALL | 1 mm | BOTTOM | 3.38 mm | 29 mm | 29 mm | FREESCALE SEMICONDUCTOR INC | BGA-783 | not_compliant | 3A991.A.2 | 8542.31.00.01 | |||||||||||||||||||||||
Active | 32 | 400 MHz | 32768 | 32 | 26 | 50 MHz | YES | 1 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 24 | 3 | 1 | 8 | 1.1 V | 900 mV | INDUSTRIAL | S-PBGA-B217 | 85 °C | -40 °C | NOT SPECIFIED | TS 16949 | NOT SPECIFIED | 217 | PLASTIC/EPOXY | LFBGA | BGA217,17X17,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | BALL | 800 µm | BOTTOM | 1.4 mm | 15 mm | 15 mm | MICROCHIP TECHNOLOGY INC | LFBGA, BGA217,17X17,32 | compliant | 3A991.A.2 | 8542.31.00.01 | Microchip | ||||||||||||
Active | 600 MHz | 69632 | 16 | 6 | 50 MHz | YES | 1.8 V | MICROPROCESSOR, RISC | CMOS | 1-Gbit DDR2--SDRAM AVAILABLE | YES | FIXED POINT | YES | YES | 16 | 8 | 1.9 V | 1.7 V | INDUSTRIAL | S-PBGA-B233 | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 233 | PLASTIC/EPOXY | TFBGA | BGA233,17X17,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 14 mm | 14 mm | MICROCHIP TECHNOLOGY INC | TFBGA-233 | compliant | 5A992.C | 8542.31.00.01 | Microchip | 2019-09-23 | |||||||||||
Active | 32 | 800 MHz | 69632 | 16 | 23 | 50 MHz | YES | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 16 | 1 | 13 | 8 | 3 mA | 1.21 V | 1.14 V | S-PBGA-B240 | 85 °C | -40 °C | 240 | PLASTIC/EPOXY | LFBGA | BGA240,16X16,25 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | BALL | 650 µm | BOTTOM | MICROCHIP TECHNOLOGY INC | unknown | 3A991.A.2 | 8542.31.00.01 | Microchip | ||||||||||||||||||||
Obsolete | 32 | 240 MHz | 1048576 | 40 MHz | YES | 1.25 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 32 | 1 | 8 | 1.1 A | 1.31 V | 1.19 V | S-PBGA-B257 | 125 °C | -40 °C | ISO 26262 | 257 | PLASTIC/EPOXY | LFBGA | BGA257,17X17,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | BALL | 800 µm | BOTTOM | 1.51 mm | 14 mm | 14 mm | NXP SEMICONDUCTORS | unknown | 3A991.A.2 | 8542.31.00.01 | 2018-08-24 | ||||||||||||||||||
Active | 32 | 500 MHz | 131072 | 16 | 26 | 24 MHz | YES | 1.25 V | MICROPROCESSOR, RISC | CMOS | ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED | YES | FLOATING POINT | YES | YES | 32 | 1 | 8 | 1.32 V | 1.2 V | INDUSTRIAL | S-PBGA-B289 | 105 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 289 | PLASTIC/EPOXY | LFBGA | BGA289,17X17,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | BALL | 800 µm | BOTTOM | 1.4 mm | 14 mm | 14 mm | MICROCHIP TECHNOLOGY INC | LFBGA, BGA289,17X17,32 | compliant | 5A992.C | 8542.31.00.01 | Microchip | 2017-05-22 | ||||||||||||
Yes | Yes | Active | 32 | 536 MHz | 131072 | 16 | 26 | 48 MHz | YES | 1.2 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 39 | 1 | 10 | 8 | 1.32 V | 1.08 V | INDUSTRIAL | S-PBGA-B324 | Not Qualified | e1 | 105 °C | -40 °C | 324 | PLASTIC/EPOXY | LFBGA | BGA324,18X18,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.4 mm | 15 mm | 15 mm | MICROCHIP TECHNOLOGY INC | LFBGA, BGA324,18X18,32 | compliant | 5A992.C | 8542.31.00.01 | Microchip | ||||||||||
Active | 32 | 500 MHz | 131072 | 16 | 26 | 24 MHz | YES | 1.25 V | MICROPROCESSOR, RISC | CMOS | ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED | YES | FLOATING POINT | YES | YES | 32 | 1 | 8 | 1.32 V | 1.2 V | INDUSTRIAL | S-PBGA-B289 | 105 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 289 | PLASTIC/EPOXY | LFBGA | BGA289,17X17,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | BALL | 800 µm | BOTTOM | 1.4 mm | 14 mm | 14 mm | MICROCHIP TECHNOLOGY INC | LFBGA, BGA289,17X17,32 | compliant | 5A992.C | 8542.31.00.01 | Microchip | 2017-05-22 |
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MC8640DTVU1067NE
Freescale Semiconductor
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$0.1395 | No | Yes | Obsolete | 32 | 1.067 GHz | 32 | 32 | 166.66 MHz | YES | 950 mV | MICROPROCESSOR | CMOS | YES | FLOATING POINT | YES | YES | 1 V | 900 mV | INDUSTRIAL | S-CBGA-B1023 | Not Qualified | e2 | 3 | 105 °C | -40 °C | 245 | 30 | 1023 | CERAMIC, METAL-SEALED COFIRED | BGA | BGA1023,32X32,40 | SQUARE | GRID ARRAY | Tin/Silver (Sn/Ag) | BALL | 1 mm | BOTTOM | 2.97 mm | 33 mm | 33 mm | FREESCALE SEMICONDUCTOR INC | BGA | 33 X 33 MM, ROHS COMPLIANT, CERAMIC, FCBGA-1023 | 1023 | not_compliant | 3A991.A.1 | 8542.31.00.01 | ||||||||||||
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QU80386EXTC33
Intel Corporation
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$0.3110 | Yes | Obsolete | 32 | 33 MHz | 0 | 16 | 26 | 25 MHz | YES | 5 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | NO | YES | 2 | 12 | 3 | 320 mA | 5.5 V | 4.5 V | S-PQFP-G132 | Not Qualified | 117 °C | -40 °C | 132 | PLASTIC/EPOXY | BQFP | SPQFP132,1.1SQ | SQUARE | FLATPACK, BUMPER | GULL WING | 635 µm | QUAD | 4.57 mm | 24.13 mm | 24.13 mm | INTEL CORP | TQFP-144 | unknown | 8542.31.00.01 | Intel | ||||||||||||||||
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MPC8548CVTAQGD
Freescale Semiconductor
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$0.3167 | No | Yes | Obsolete | YES | 1.1 V | SoC | CMOS | 1.155 V | 1.045 V | S-PBGA-B783 | Not Qualified | e2 | 3 | 105 °C | -40 °C | 260 | 40 | 783 | PLASTIC/EPOXY | BGA | BGA783,28X28,40 | SQUARE | GRID ARRAY | Tin/Silver (Sn/Ag) | BALL | 1 mm | BOTTOM | 3.38 mm | 29 mm | 29 mm | FREESCALE SEMICONDUCTOR INC | BGA-783 | not_compliant | 3A991.A.2 | 8542.31.00.01 | ||||||||||||||||||||||||
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AT91SAM9G20B-CU-999
Microchip Technology Inc
|
$0.9814 | Active | 32 | 400 MHz | 32768 | 32 | 26 | 50 MHz | YES | 1 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 24 | 3 | 1 | 8 | 1.1 V | 900 mV | INDUSTRIAL | S-PBGA-B217 | 85 °C | -40 °C | NOT SPECIFIED | TS 16949 | NOT SPECIFIED | 217 | PLASTIC/EPOXY | LFBGA | BGA217,17X17,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | BALL | 800 µm | BOTTOM | 1.4 mm | 15 mm | 15 mm | MICROCHIP TECHNOLOGY INC | LFBGA, BGA217,17X17,32 | compliant | 3A991.A.2 | 8542.31.00.01 | Microchip | |||||||||||||
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SAM9X60D1GT-I/4FB
Microchip Technology Inc
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$1.0000 | Active | 600 MHz | 69632 | 16 | 6 | 50 MHz | YES | 1.8 V | MICROPROCESSOR, RISC | CMOS | 1-Gbit DDR2--SDRAM AVAILABLE | YES | FIXED POINT | YES | YES | 16 | 8 | 1.9 V | 1.7 V | INDUSTRIAL | S-PBGA-B233 | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 233 | PLASTIC/EPOXY | TFBGA | BGA233,17X17,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 14 mm | 14 mm | MICROCHIP TECHNOLOGY INC | TFBGA-233 | compliant | 5A992.C | 8542.31.00.01 | Microchip | 2019-09-23 | ||||||||||||
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SAM9X70-I/4PB
Microchip Technology Inc
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$1.0000 | Active | 32 | 800 MHz | 69632 | 16 | 23 | 50 MHz | YES | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 16 | 1 | 13 | 8 | 3 mA | 1.21 V | 1.14 V | S-PBGA-B240 | 85 °C | -40 °C | 240 | PLASTIC/EPOXY | LFBGA | BGA240,16X16,25 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | BALL | 650 µm | BOTTOM | MICROCHIP TECHNOLOGY INC | unknown | 3A991.A.2 | 8542.31.00.01 | Microchip | |||||||||||||||||||||
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FS32R372SDK0MMM
NXP Semiconductors
|
$1.0000 | Obsolete | 32 | 240 MHz | 1048576 | 40 MHz | YES | 1.25 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 32 | 1 | 8 | 1.1 A | 1.31 V | 1.19 V | S-PBGA-B257 | 125 °C | -40 °C | ISO 26262 | 257 | PLASTIC/EPOXY | LFBGA | BGA257,17X17,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | BALL | 800 µm | BOTTOM | 1.51 mm | 14 mm | 14 mm | NXP SEMICONDUCTORS | unknown | 3A991.A.2 | 8542.31.00.01 | 2018-08-24 | |||||||||||||||||||
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ATSAMA5D27C-CNR
Microchip Technology Inc
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$1.0000 | Active | 32 | 500 MHz | 131072 | 16 | 26 | 24 MHz | YES | 1.25 V | MICROPROCESSOR, RISC | CMOS | ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED | YES | FLOATING POINT | YES | YES | 32 | 1 | 8 | 1.32 V | 1.2 V | INDUSTRIAL | S-PBGA-B289 | 105 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 289 | PLASTIC/EPOXY | LFBGA | BGA289,17X17,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | BALL | 800 µm | BOTTOM | 1.4 mm | 14 mm | 14 mm | MICROCHIP TECHNOLOGY INC | LFBGA, BGA289,17X17,32 | compliant | 5A992.C | 8542.31.00.01 | Microchip | 2017-05-22 | |||||||||||||
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ATSAMA5D36A-CNR
Microchip Technology Inc
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$1.0000 | Yes | Yes | Active | 32 | 536 MHz | 131072 | 16 | 26 | 48 MHz | YES | 1.2 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 39 | 1 | 10 | 8 | 1.32 V | 1.08 V | INDUSTRIAL | S-PBGA-B324 | Not Qualified | e1 | 105 °C | -40 °C | 324 | PLASTIC/EPOXY | LFBGA | BGA324,18X18,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.4 mm | 15 mm | 15 mm | MICROCHIP TECHNOLOGY INC | LFBGA, BGA324,18X18,32 | compliant | 5A992.C | 8542.31.00.01 | Microchip | |||||||||||
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ATSAMA5D26C-CNR
Microchip Technology Inc
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$1.0000 | Active | 32 | 500 MHz | 131072 | 16 | 26 | 24 MHz | YES | 1.25 V | MICROPROCESSOR, RISC | CMOS | ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED | YES | FLOATING POINT | YES | YES | 32 | 1 | 8 | 1.32 V | 1.2 V | INDUSTRIAL | S-PBGA-B289 | 105 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 289 | PLASTIC/EPOXY | LFBGA | BGA289,17X17,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | BALL | 800 µm | BOTTOM | 1.4 mm | 14 mm | 14 mm | MICROCHIP TECHNOLOGY INC | LFBGA, BGA289,17X17,32 | compliant | 5A992.C | 8542.31.00.01 | Microchip | 2017-05-22 |