Part Details for FS32R372SDK0MMM by NXP Semiconductors
Overview of FS32R372SDK0MMM by NXP Semiconductors
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for FS32R372SDK0MMM
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
37AC4215
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Newark | Fs32R372Sdk0Mm/ Tray Rohs Compliant: Yes |Nxp FS32R372SDK0mm Min Qty: 760 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$34.6100 | Buy Now |
DISTI #
FS32R372SDK0MMM-ND
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DigiKey | 1MB SRAM, 1.3MB FLASH, C Min Qty: 760 Lead time: 14 Weeks Container: Tray | Limited Supply - Call |
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$38.4252 | Buy Now |
DISTI #
FS32R372SDK0MMM
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Avnet Americas | 1MB SRAM, 1.3MB FLASH, C - Trays (Alt: FS32R372SDK0MMM) RoHS: Not Compliant Min Qty: 760 Package Multiple: 760 Lead time: 52 Weeks, 0 Days Container: Tray | 0 |
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$32.2324 / $36.9880 | Buy Now |
DISTI #
FS32R372SDK0MMM
|
Avnet Americas | 1MB SRAM, 1.3MB FLASH, C - Trays (Alt: FS32R372SDK0MMM) RoHS: Not Compliant Min Qty: 760 Package Multiple: 760 Lead time: 52 Weeks, 0 Days Container: Tray | 0 |
|
$32.2324 / $36.9880 | Buy Now |
Part Details for FS32R372SDK0MMM
FS32R372SDK0MMM CAD Models
FS32R372SDK0MMM Part Data Attributes:
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FS32R372SDK0MMM
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
FS32R372SDK0MMM
NXP Semiconductors
RISC Microprocessor
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 52 Weeks | |
Date Of Intro | 2018-08-24 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 40 MHz | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B257 | |
Length | 14 mm | |
Low Power Mode | YES | |
Number of DMA Channels | 32 | |
Number of External Interrupts | 1 | |
Number of Terminals | 257 | |
On Chip Data RAM Width | 8 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA257,17X17,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
RAM (words) | 1048576 | |
Screening Level | ISO 26262 | |
Seated Height-Max | 1.51 mm | |
Speed | 240 MHz | |
Supply Current-Max | 1100 mA | |
Supply Voltage-Max | 1.31 V | |
Supply Voltage-Min | 1.19 V | |
Supply Voltage-Nom | 1.25 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 14 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |