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MPC5200CVR400B
NXP Semiconductors
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$1.0000 | Yes | Not Recommended | 400 MHz | 32 | 13 | 35 MHz | YES | 1.5 V | MICROPROCESSOR | CMOS | YES | FLOATING POINT | YES | YES | 1.58 V | 1.42 V | INDUSTRIAL | S-PBGA-B272 | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 272 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1.27 mm | BOTTOM | 2.65 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | TEBGA-272 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP | ||||||||||||||
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MPC8314CVRAFDA
NXP Semiconductors
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$1.0000 | Yes | Not Recommended | 32 | 333 MHz | 66.67 MHz | YES | 1 V | MICROPROCESSOR | CMOS | YES | FLOATING POINT | YES | YES | 1.05 V | 950 mV | INDUSTRIAL | S-PBGA-B620 | Not Qualified | e2 | 3 | 105 °C | -40 °C | 260 | 40 | 620 | PLASTIC/EPOXY | HBGA | BGA620,28X28,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Silver (Sn/Ag) | BALL | 1 mm | BOTTOM | 2.46 mm | 29 mm | 29 mm | NXP SEMICONDUCTORS | 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-620 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP | |||||||||||||
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MCF5471ZP200
NXP Semiconductors
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$1.0000 | No | Not Recommended | 32 | 200 MHz | 32 | 32 | 66.66 MHz | YES | 1.5 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 1.58 V | 1.43 V | COMMERCIAL | S-PBGA-B388 | Not Qualified | e0 | 3 | 70 °C | 260 | 40 | 388 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | 27 X 27 MM, MS-034AAL-1, PBGA-388 | unknown | 5A002.A.1 | 8542.31.00.01 | NXP | |||||||||||||
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SAM9X60D6KT-I/4GB
Microchip Technology Inc
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$1.0000 | Active | 600 MHz | 69632 | 16 | 6 | 50 MHz | YES | 1.8 V | MICROPROCESSOR, RISC | CMOS | 64-Mbit DDR2--SDRAM AVAILABLE | YES | FIXED POINT | YES | YES | 16 | 8 | 1.9 V | 1.7 V | INDUSTRIAL | S-PBGA-B196 | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 196 | PLASTIC/EPOXY | TFBGA | BGA196,16X16,25 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 650 µm | BOTTOM | 1.2 mm | 11 mm | 11 mm | MICROCHIP TECHNOLOGY INC | TFBGA-196 | compliant | 5A992.C | 8542.31.00.01 | Microchip | 2019-09-23 | |||||||||
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MPC8270ZQMIBA
NXP Semiconductors
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$1.0000 | No | Not Recommended | 32 | 66.67 MHz | 64 | 32 | 266 MHz | YES | 1.5 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | NO | 1.6 V | 1.45 V | COMMERCIAL | S-PBGA-B516 | Not Qualified | e0 | 3 | 70 °C | 245 | 30 | 516 | PLASTIC/EPOXY | BGA | BGA516,26X26,40 | SQUARE | GRID ARRAY | Tin/Lead/Silver (Sn/Pb/Ag) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | 27 X 27 MM, 1 MM PITCH, PLASTIC, FBGA-516 | not_compliant | 3A991.A.2 | 8542.31.00.01 | NXP | ||||||||||||
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ATSAMA5D27C-LD1G-CUR
Microchip Technology Inc
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$1.0000 | Active | 16 | 500 MHz | 32768 | 24 MHz | YES | 1.8 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 51 | 1 | 32 | 1.9 V | 1.7 V | INDUSTRIAL | S-PBGA-B361 | 85 °C | -40 °C | 361 | PLASTIC/EPOXY | TFBGA | BGA361,19X19,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | BALL | 800 µm | BOTTOM | 1.2 mm | 16 mm | 16 mm | MICROCHIP TECHNOLOGY INC | TFBGA-361 | compliant | 5A992.C | 8542.31.00.01 | Microchip | 2018-12-14 | |||||||||||||||
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SPC5200CBV400B
NXP Semiconductors
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$1.0000 | No | Not Recommended | 32 | 400 MHz | 32 | 32 | 66 MHz | YES | 1.5 V | MICROPROCESSOR | CMOS | ALSO REQUIRES 3.3V SUPPLY | YES | FLOATING POINT | YES | YES | 1.58 V | 1.42 V | INDUSTRIAL | S-PBGA-B272 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 245 | AEC-Q100 | 30 | 272 | PLASTIC/EPOXY | BGA | BGA272,20X20,50 | SQUARE | GRID ARRAY | Tin/Lead/Silver (Sn/Pb/Ag) | BALL | 1.27 mm | BOTTOM | 2.65 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | 27 X 27 MM, 1.27 MM PITCH, PLASTIC, BGA-272 | not_compliant | 3A991.A.2 | 8542.31.00.01 | NXP | |||||||||
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SAM9X70T-I/4PB
Microchip Technology Inc
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$1.0000 | Active | 32 | 800 MHz | 69632 | 16 | 23 | 50 MHz | YES | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 16 | 1 | 13 | 8 | 3 mA | 1.21 V | 1.14 V | S-PBGA-B240 | 85 °C | -40 °C | 240 | PLASTIC/EPOXY | LFBGA | BGA240,16X16,25 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | BALL | 650 µm | BOTTOM | MICROCHIP TECHNOLOGY INC | unknown | 3A991.A.2 | 8542.31.00.01 | Microchip | ||||||||||||||||||
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MCIMX6S5EVM10AB
NXP Semiconductors
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$1.0000 | Yes | Not Recommended | YES | SoC | CMOS | 1.5 V | 1.35 V | OTHER | S-PBGA-B624 | e1 | 3 | 105 °C | -20 °C | 260 | 40 | 624 | PLASTIC/EPOXY | LFBGA | BGA624,25X25,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.6 mm | 21 mm | 21 mm | NXP SEMICONDUCTORS | MABGA-624 | compliant | 5A992.C | 8542.31.00.01 | NXP | ||||||||||||||||||||||
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MCF52277CVM160
NXP Semiconductors
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$1.0000 | Yes | Not Recommended | 32 | 166.67 MHz | 32 | 24 | 66.67 MHz | YES | 1.5 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | NO | 700 µA | 1.6 V | 1.4 V | INDUSTRIAL | S-PBGA-B196 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 196 | PLASTIC/EPOXY | LFBGA | BGA196,14X14,40 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 500 µm | BOTTOM | 1.7 mm | 15 mm | 15 mm | NXP SEMICONDUCTORS | 15 X 15 MM, ROHS COMPLIANT, MAPBGA-196 | compliant | 3A991.A.2 | 8542.31.00.01 |