Filter Your Search
11 - 20 of 82,224 results
Select Parts | Part Number |
---|
|
ATSAMA5D35A-CNR
Microchip Technology Inc
|
||
|
ATSAMA5D27C-D5M-CUR
Microchip Technology Inc
|
||
|
MPC8308CVMAFDA
NXP Semiconductors
|
||
|
ATSAMA5D42B-CUR
Microchip Technology Inc
|
||
|
ATSAMA5D27C-CUR
Microchip Technology Inc
|
||
|
ATSAMA5D33A-CUR
Microchip Technology Inc
|
||
|
MPC8347VRAGDB
NXP Semiconductors
|
||
|
ATSAMA5D27C-D1G-CUR
Microchip Technology Inc
|
||
|
ATSAMA5D31A-CFUR
Microchip Technology Inc
|
||
|
ATSAMA5D28C-LD2G-CUR
Microchip Technology Inc
|
Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Composite Price
|
Pbfree Code
|
Rohs Code
|
Part Life Cycle Code
|
Bit Size | Speed | RAM (words) |
External Data Bus Width
|
Address Bus Width |
Clock Frequency-Max
|
Surface Mount
|
Supply Voltage-Nom |
uPs/uCs/Peripheral ICs Type
|
Technology |
Additional Feature
|
Boundary Scan
|
Format
|
Integrated Cache
|
Low Power Mode
|
Number of DMA Channels | Number of External Interrupts | Number of Serial I/Os |
On Chip Data RAM Width
|
Supply Voltage-Max
|
Supply Voltage-Min
|
Temperature Grade
|
JESD-30 Code
|
Qualification Status
|
JESD-609 Code
|
Moisture Sensitivity Level
|
Operating Temperature-Max
|
Operating Temperature-Min
|
Peak Reflow Temperature (Cel)
|
Screening Level
|
Time@Peak Reflow Temperature-Max (s)
|
Number of Terminals
|
Package Body Material
|
Package Code
|
Package Equivalence Code
|
Package Shape
|
Package Style
|
Terminal Finish
|
Terminal Form
|
Terminal Pitch
|
Terminal Position
|
Seated Height-Max
|
Width
|
Length
|
Ihs Manufacturer
|
Package Description
|
Reach Compliance Code
|
ECCN Code
|
HTS Code
|
Samacsys Manufacturer
|
Date Of Intro
|
Yes | Yes | Active | 32 | 536 MHz | 131072 | 16 | 26 | 48 MHz | YES | 1.2 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 39 | 1 | 10 | 8 | 1.32 V | 1.08 V | INDUSTRIAL | S-PBGA-B324 | Not Qualified | e1 | 105 °C | -40 °C | 324 | PLASTIC/EPOXY | LFBGA | BGA324,18X18,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.4 mm | 15 mm | 15 mm | MICROCHIP TECHNOLOGY INC | LFBGA-324 | compliant | 5A992.C | 8542.31.00.01 | Microchip | |||||||
Active | MICROCHIP TECHNOLOGY INC | TFBGA-289 | compliant | 5A992.C | 8542.31.00.01 | Microchip | 2017-09-07 | |||||||||||||||||||||||||||||||||||||||||||||||
Yes | Obsolete | 32 | 333 MHz | YES | 1 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 4 | 1.05 V | 950 mV | INDUSTRIAL | S-PBGA-B473 | Not Qualified | e2 | 3 | 105 °C | -40 °C | 260 | 40 | 473 | PLASTIC/EPOXY | LFBGA | BGA473,23X23,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver (Sn/Ag) | BALL | 800 µm | BOTTOM | 1.54 mm | 19 mm | 19 mm | NXP SEMICONDUCTORS | MAPBGA-473 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP | ||||||||||||
Yes | Active | 32 | 600 MHz | 131072 | 32 | 26 | 50 MHz | YES | 1.26 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 32 | 1 | 2 | 8 | 1.32 V | 1.16 V | INDUSTRIAL | S-PBGA-B361 | e1 | 1 | 85 °C | -40 °C | NOT SPECIFIED | TS 16949 | NOT SPECIFIED | 361 | PLASTIC/EPOXY | TFBGA | BGA361,19X19,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | TIN SILVER COPPER OVER NICKEL | BALL | 800 µm | BOTTOM | 1.2 mm | 16 mm | 16 mm | MICROCHIP TECHNOLOGY INC | compliant | 5A992.C | 8542.31.00.01 | Microchip | 2017-10-26 | |||||
Yes | Active | 32 | 500 MHz | 131072 | 16 | 26 | 24 MHz | YES | 1.25 V | MICROPROCESSOR, RISC | CMOS | ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED | YES | FLOATING POINT | YES | YES | 32 | 1 | 8 | 1.32 V | 1.2 V | INDUSTRIAL | S-PBGA-B289 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 289 | PLASTIC/EPOXY | LFBGA | BGA289,17X17,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | BALL | 800 µm | BOTTOM | 1.4 mm | 14 mm | 14 mm | MICROCHIP TECHNOLOGY INC | compliant | 5A992.C | 8542.31.00.01 | Microchip | 2017-05-22 | |||||||||
Yes | Yes | Active | 32 | 536 MHz | 131072 | 16 | 26 | 48 MHz | YES | 1.2 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 39 | 1 | 10 | 8 | 1.32 V | 1.08 V | INDUSTRIAL | S-PBGA-B324 | Not Qualified | e1 | 85 °C | -40 °C | 324 | PLASTIC/EPOXY | LFBGA | BGA324,18X18,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.4 mm | 15 mm | 15 mm | MICROCHIP TECHNOLOGY INC | LFBGA-324 | compliant | 5A992.C | 8542.31.00.01 | Microchip | |||||||
Yes | Not Recommended | 32 | 400 MHz | 32 | 32 | 66 MHz | YES | 1.2 V | MICROPROCESSOR | CMOS | ALSO REQUIRES 2.5V AND 3.3V SUPPLY | YES | FLOATING POINT | YES | YES | 1.26 V | 1.14 V | OTHER | S-PBGA-B620 | Not Qualified | e2 | 3 | 105 °C | 260 | 40 | 620 | PLASTIC/EPOXY | BGA | BGA620,28X28,40 | SQUARE | GRID ARRAY | Tin/Silver (Sn/Ag) | BALL | 1 mm | BOTTOM | 2.46 mm | 29 mm | 29 mm | NXP SEMICONDUCTORS | 29 X 29 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-620 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP | ||||||||||
Active | MICROCHIP TECHNOLOGY INC | TFBGA-289 | compliant | 5A992.C | 8542.31.00.01 | Microchip | 2017-07-24 | |||||||||||||||||||||||||||||||||||||||||||||||
Yes | Yes | Active | 32 | 536 MHz | 131072 | 16 | 26 | 48 MHz | YES | 1.2 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 39 | 1 | 10 | 8 | 1.32 V | 1.08 V | INDUSTRIAL | S-PBGA-B324 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 324 | PLASTIC/EPOXY | TFBGA | BGA324,22X22,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | BALL | 500 µm | BOTTOM | 1.2 mm | 12 mm | 12 mm | MICROCHIP TECHNOLOGY INC | TFBGA-324 | compliant | 5A992.C | 8542.31.00.01 | Microchip | |||||||
Active | 16 | 500 MHz | 32768 | 24 MHz | YES | 1.8 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 51 | 1 | 32 | 1.9 V | 1.7 V | INDUSTRIAL | S-PBGA-B361 | 85 °C | -40 °C | 361 | PLASTIC/EPOXY | TFBGA | BGA361,19X19,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | BALL | 800 µm | BOTTOM | 1.2 mm | 16 mm | 16 mm | MICROCHIP TECHNOLOGY INC | TFBGA-361 | compliant | 5A992.C | 8542.31.00.01 | Microchip | 2018-12-14 |
|
ATSAMA5D35A-CNR
Microchip Technology Inc
|
$1.0000 | Yes | Yes | Active | 32 | 536 MHz | 131072 | 16 | 26 | 48 MHz | YES | 1.2 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 39 | 1 | 10 | 8 | 1.32 V | 1.08 V | INDUSTRIAL | S-PBGA-B324 | Not Qualified | e1 | 105 °C | -40 °C | 324 | PLASTIC/EPOXY | LFBGA | BGA324,18X18,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.4 mm | 15 mm | 15 mm | MICROCHIP TECHNOLOGY INC | LFBGA-324 | compliant | 5A992.C | 8542.31.00.01 | Microchip | ||||||||
|
ATSAMA5D27C-D5M-CUR
Microchip Technology Inc
|
$1.0000 | Active | MICROCHIP TECHNOLOGY INC | TFBGA-289 | compliant | 5A992.C | 8542.31.00.01 | Microchip | 2017-09-07 | ||||||||||||||||||||||||||||||||||||||||||||||||
|
MPC8308CVMAFDA
NXP Semiconductors
|
$1.0000 | Yes | Obsolete | 32 | 333 MHz | YES | 1 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 4 | 1.05 V | 950 mV | INDUSTRIAL | S-PBGA-B473 | Not Qualified | e2 | 3 | 105 °C | -40 °C | 260 | 40 | 473 | PLASTIC/EPOXY | LFBGA | BGA473,23X23,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver (Sn/Ag) | BALL | 800 µm | BOTTOM | 1.54 mm | 19 mm | 19 mm | NXP SEMICONDUCTORS | MAPBGA-473 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP | |||||||||||||
|
ATSAMA5D42B-CUR
Microchip Technology Inc
|
$1.0000 | Yes | Active | 32 | 600 MHz | 131072 | 32 | 26 | 50 MHz | YES | 1.26 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 32 | 1 | 2 | 8 | 1.32 V | 1.16 V | INDUSTRIAL | S-PBGA-B361 | e1 | 1 | 85 °C | -40 °C | NOT SPECIFIED | TS 16949 | NOT SPECIFIED | 361 | PLASTIC/EPOXY | TFBGA | BGA361,19X19,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | TIN SILVER COPPER OVER NICKEL | BALL | 800 µm | BOTTOM | 1.2 mm | 16 mm | 16 mm | MICROCHIP TECHNOLOGY INC | compliant | 5A992.C | 8542.31.00.01 | Microchip | 2017-10-26 | ||||||
|
ATSAMA5D27C-CUR
Microchip Technology Inc
|
$1.0000 | Yes | Active | 32 | 500 MHz | 131072 | 16 | 26 | 24 MHz | YES | 1.25 V | MICROPROCESSOR, RISC | CMOS | ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED | YES | FLOATING POINT | YES | YES | 32 | 1 | 8 | 1.32 V | 1.2 V | INDUSTRIAL | S-PBGA-B289 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 289 | PLASTIC/EPOXY | LFBGA | BGA289,17X17,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | BALL | 800 µm | BOTTOM | 1.4 mm | 14 mm | 14 mm | MICROCHIP TECHNOLOGY INC | compliant | 5A992.C | 8542.31.00.01 | Microchip | 2017-05-22 | ||||||||||
|
ATSAMA5D33A-CUR
Microchip Technology Inc
|
$1.0000 | Yes | Yes | Active | 32 | 536 MHz | 131072 | 16 | 26 | 48 MHz | YES | 1.2 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 39 | 1 | 10 | 8 | 1.32 V | 1.08 V | INDUSTRIAL | S-PBGA-B324 | Not Qualified | e1 | 85 °C | -40 °C | 324 | PLASTIC/EPOXY | LFBGA | BGA324,18X18,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.4 mm | 15 mm | 15 mm | MICROCHIP TECHNOLOGY INC | LFBGA-324 | compliant | 5A992.C | 8542.31.00.01 | Microchip | ||||||||
|
MPC8347VRAGDB
NXP Semiconductors
|
$1.0000 | Yes | Not Recommended | 32 | 400 MHz | 32 | 32 | 66 MHz | YES | 1.2 V | MICROPROCESSOR | CMOS | ALSO REQUIRES 2.5V AND 3.3V SUPPLY | YES | FLOATING POINT | YES | YES | 1.26 V | 1.14 V | OTHER | S-PBGA-B620 | Not Qualified | e2 | 3 | 105 °C | 260 | 40 | 620 | PLASTIC/EPOXY | BGA | BGA620,28X28,40 | SQUARE | GRID ARRAY | Tin/Silver (Sn/Ag) | BALL | 1 mm | BOTTOM | 2.46 mm | 29 mm | 29 mm | NXP SEMICONDUCTORS | 29 X 29 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-620 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP | |||||||||||
|
ATSAMA5D27C-D1G-CUR
Microchip Technology Inc
|
$1.0000 | Active | MICROCHIP TECHNOLOGY INC | TFBGA-289 | compliant | 5A992.C | 8542.31.00.01 | Microchip | 2017-07-24 | ||||||||||||||||||||||||||||||||||||||||||||||||
|
ATSAMA5D31A-CFUR
Microchip Technology Inc
|
$1.0000 | Yes | Yes | Active | 32 | 536 MHz | 131072 | 16 | 26 | 48 MHz | YES | 1.2 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 39 | 1 | 10 | 8 | 1.32 V | 1.08 V | INDUSTRIAL | S-PBGA-B324 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 324 | PLASTIC/EPOXY | TFBGA | BGA324,22X22,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | BALL | 500 µm | BOTTOM | 1.2 mm | 12 mm | 12 mm | MICROCHIP TECHNOLOGY INC | TFBGA-324 | compliant | 5A992.C | 8542.31.00.01 | Microchip | ||||||||
|
ATSAMA5D28C-LD2G-CUR
Microchip Technology Inc
|
$1.0000 | Active | 16 | 500 MHz | 32768 | 24 MHz | YES | 1.8 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 51 | 1 | 32 | 1.9 V | 1.7 V | INDUSTRIAL | S-PBGA-B361 | 85 °C | -40 °C | 361 | PLASTIC/EPOXY | TFBGA | BGA361,19X19,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | BALL | 800 µm | BOTTOM | 1.2 mm | 16 mm | 16 mm | MICROCHIP TECHNOLOGY INC | TFBGA-361 | compliant | 5A992.C | 8542.31.00.01 | Microchip | 2018-12-14 |