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Select Parts | Part Number |
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MCIMX6S5DVM10ABR
NXP Semiconductors
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MCIMX6S6AVM08ABR
NXP Semiconductors
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MCIMX6U5DVM10ABR
NXP Semiconductors
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MCIMX6U1AVM08ABR
NXP Semiconductors
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MCIMX6U5EVM10ABR
NXP Semiconductors
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MCIMX6U6AVM08ABR
NXP Semiconductors
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MCIMX6U4AVM08ABR
NXP Semiconductors
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SMJ34020AGBM40
Texas Instruments
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SMJ34020AGBM32
Texas Instruments
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5962-9162303MXC
Texas Instruments
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Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||||
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Composite Price
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Pbfree Code
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Rohs Code
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Part Life Cycle Code
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External Data Bus Width
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Clock Frequency-Max
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Surface Mount
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Supply Voltage-Nom |
uPs/uCs/Peripheral ICs Type
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Technology |
Maximum Num of Bits per Pixel
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Supply Current-Max
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Supply Voltage-Max
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Supply Voltage-Min
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Temperature Grade
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JESD-30 Code
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Qualification Status
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JESD-609 Code
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Moisture Sensitivity Level
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Operating Temperature-Max
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Operating Temperature-Min
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Peak Reflow Temperature (Cel)
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Screening Level
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Time@Peak Reflow Temperature-Max (s)
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Number of Terminals
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Package Body Material
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Package Code
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Package Equivalence Code
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Package Shape
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Package Style
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Terminal Finish
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Terminal Form
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Terminal Pitch
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Terminal Position
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Seated Height-Max
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Width
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Length
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Ihs Manufacturer
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Package Description
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Reach Compliance Code
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ECCN Code
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HTS Code
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Samacsys Manufacturer
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Part Package Code
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Pin Count
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Date Of Intro
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Yes | Not Recommended | YES | SoC | CMOS | 1.5 V | 1.35 V | OTHER | S-PBGA-B624 | Not Qualified | e1 | 3 | 95 °C | 260 | 40 | 624 | PLASTIC/EPOXY | LFBGA | BGA624,25X25,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.6 mm | 21 mm | 21 mm | NXP SEMICONDUCTORS | MABGA-624 | compliant | 5A992.C | 8542.31.00.01 | NXP | ||||||||||||
Yes | Not Recommended | YES | SoC | CMOS | 1.5 V | 1.275 V | S-PBGA-B624 | Not Qualified | e1 | 3 | 125 °C | -40 °C | 260 | 40 | 624 | PLASTIC/EPOXY | LFBGA | BGA624,25X25,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.5 mm | 21 mm | 21 mm | NXP SEMICONDUCTORS | MAPBGA-624 | compliant | 5A992.C | 8542.31.00.01 | NXP | ||||||||||||
Yes | Not Recommended | YES | GRAPHICS PROCESSOR | CMOS | 2.2 A | Not Qualified | e1 | 3 | 260 | 40 | 624 | PLASTIC/EPOXY | BGA624,25X25,32 | Tin/Silver/Copper (Sn/Ag/Cu) | NXP SEMICONDUCTORS | compliant | 5A992.C | 8542.31.00.01 | NXP | ||||||||||||||||||||||||||
Yes | Not Recommended | YES | SoC | CMOS | 1.5 V | 1.275 V | S-PBGA-B624 | Not Qualified | e1 | 3 | 125 °C | -40 °C | 260 | 40 | 624 | PLASTIC/EPOXY | LFBGA | BGA624,25X25,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.5 mm | 21 mm | 21 mm | NXP SEMICONDUCTORS | MAPBGA-624 | compliant | 5A992.C | 8542.31.00.01 | NXP | ||||||||||||
Yes | Not Recommended | YES | GRAPHICS PROCESSOR | CMOS | 2.2 A | Not Qualified | e1 | 3 | 260 | 40 | 624 | PLASTIC/EPOXY | BGA624,25X25,32 | Tin/Silver/Copper (Sn/Ag/Cu) | NXP SEMICONDUCTORS | compliant | 5A992.C | 8542.31.00.01 | NXP | ||||||||||||||||||||||||||
Yes | Not Recommended | YES | SoC | CMOS | 1.5 V | 1.275 V | S-PBGA-B624 | Not Qualified | e1 | 3 | 125 °C | -40 °C | 260 | 40 | 624 | PLASTIC/EPOXY | LFBGA | BGA624,25X25,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.5 mm | 21 mm | 21 mm | NXP SEMICONDUCTORS | MAPBGA-624 | compliant | 5A992.C | 8542.31.00.01 | NXP | ||||||||||||
Yes | Not Recommended | YES | SoC | CMOS | 1.5 V | 1.275 V | S-PBGA-B624 | Not Qualified | e1 | 3 | 125 °C | -40 °C | 260 | 40 | 624 | PLASTIC/EPOXY | LFBGA | BGA624,25X25,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.5 mm | 21 mm | 21 mm | NXP SEMICONDUCTORS | MAPBGA-624 | compliant | 5A992.C | 8542.31.00.01 | NXP | ||||||||||||
Yes | No | Not Recommended | 32 | 40 MHz | NO | 5 V | GRAPHICS PROCESSOR | CMOS | 32 | 280 mA | 5.25 V | 4.75 V | MILITARY | S-CPGA-P145 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 145 | CERAMIC, METAL-SEALED COFIRED | PGA | PGA145,15X15 | SQUARE | GRID ARRAY | Tin/Lead (Sn/Pb) | PIN/PEG | 2.54 mm | PERPENDICULAR | 5.21 mm | 39.75 mm | 39.75 mm | TEXAS INSTRUMENTS INC | PGA, PGA145,15X15 | not_compliant | 3A001.A.2.C | 8542.31.00.01 | PGA | 145 | 1990-04-01 | |||||
Yes | No | Not Recommended | 32 | 32 MHz | NO | 5 V | GRAPHICS PROCESSOR | CMOS | 32 | 265 mA | 5.5 V | 4.5 V | MILITARY | S-CPGA-P145 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 145 | CERAMIC, METAL-SEALED COFIRED | PGA | PGA145,15X15 | SQUARE | GRID ARRAY | Tin/Lead (Sn/Pb) | PIN/PEG | 2.54 mm | PERPENDICULAR | 5.21 mm | 39.75 mm | 39.75 mm | TEXAS INSTRUMENTS INC | PGA, PGA145,15X15 | not_compliant | 3A001.A.2.C | 8542.31.00.01 | PGA | 145 | 1990-04-01 | |||||
Yes | No | Not Recommended | 32 | 32 MHz | NO | 5 V | GRAPHICS PROCESSOR | CMOS | 32 | 265 mA | 5.5 V | 4.5 V | MILITARY | S-CPGA-P145 | Qualified | 125 °C | -55 °C | NOT SPECIFIED | MIL-STD-883 | NOT SPECIFIED | 145 | CERAMIC, METAL-SEALED COFIRED | PGA | PGA144,15X15 | SQUARE | GRID ARRAY | PIN/PEG | 2.54 mm | PERPENDICULAR | 5.21 mm | 39.75 mm | 39.75 mm | TEXAS INSTRUMENTS INC | PGA, PGA144,15X15 | not_compliant | 3A001.A.2.C | 8542.31.00.01 | PGA | 145 |
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MCIMX6S5DVM10ABR
NXP Semiconductors
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$27.6550 Buy | Yes | Not Recommended | YES | SoC | CMOS | 1.5 V | 1.35 V | OTHER | S-PBGA-B624 | Not Qualified | e1 | 3 | 95 °C | 260 | 40 | 624 | PLASTIC/EPOXY | LFBGA | BGA624,25X25,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.6 mm | 21 mm | 21 mm | NXP SEMICONDUCTORS | MABGA-624 | compliant | 5A992.C | 8542.31.00.01 | NXP | |||||||||||||
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MCIMX6S6AVM08ABR
NXP Semiconductors
|
$33.1750 Buy | Yes | Not Recommended | YES | SoC | CMOS | 1.5 V | 1.275 V | S-PBGA-B624 | Not Qualified | e1 | 3 | 125 °C | -40 °C | 260 | 40 | 624 | PLASTIC/EPOXY | LFBGA | BGA624,25X25,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.5 mm | 21 mm | 21 mm | NXP SEMICONDUCTORS | MAPBGA-624 | compliant | 5A992.C | 8542.31.00.01 | NXP | |||||||||||||
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MCIMX6U5DVM10ABR
NXP Semiconductors
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$34.5700 Buy | Yes | Not Recommended | YES | GRAPHICS PROCESSOR | CMOS | 2.2 A | Not Qualified | e1 | 3 | 260 | 40 | 624 | PLASTIC/EPOXY | BGA624,25X25,32 | Tin/Silver/Copper (Sn/Ag/Cu) | NXP SEMICONDUCTORS | compliant | 5A992.C | 8542.31.00.01 | NXP | |||||||||||||||||||||||||||
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MCIMX6U1AVM08ABR
NXP Semiconductors
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$38.0350 Buy | Yes | Not Recommended | YES | SoC | CMOS | 1.5 V | 1.275 V | S-PBGA-B624 | Not Qualified | e1 | 3 | 125 °C | -40 °C | 260 | 40 | 624 | PLASTIC/EPOXY | LFBGA | BGA624,25X25,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.5 mm | 21 mm | 21 mm | NXP SEMICONDUCTORS | MAPBGA-624 | compliant | 5A992.C | 8542.31.00.01 | NXP | |||||||||||||
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MCIMX6U5EVM10ABR
NXP Semiconductors
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$38.0350 Buy | Yes | Not Recommended | YES | GRAPHICS PROCESSOR | CMOS | 2.2 A | Not Qualified | e1 | 3 | 260 | 40 | 624 | PLASTIC/EPOXY | BGA624,25X25,32 | Tin/Silver/Copper (Sn/Ag/Cu) | NXP SEMICONDUCTORS | compliant | 5A992.C | 8542.31.00.01 | NXP | |||||||||||||||||||||||||||
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MCIMX6U6AVM08ABR
NXP Semiconductors
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$41.4850 Buy | Yes | Not Recommended | YES | SoC | CMOS | 1.5 V | 1.275 V | S-PBGA-B624 | Not Qualified | e1 | 3 | 125 °C | -40 °C | 260 | 40 | 624 | PLASTIC/EPOXY | LFBGA | BGA624,25X25,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.5 mm | 21 mm | 21 mm | NXP SEMICONDUCTORS | MAPBGA-624 | compliant | 5A992.C | 8542.31.00.01 | NXP | |||||||||||||
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MCIMX6U4AVM08ABR
NXP Semiconductors
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$47.7300 Buy | Yes | Not Recommended | YES | SoC | CMOS | 1.5 V | 1.275 V | S-PBGA-B624 | Not Qualified | e1 | 3 | 125 °C | -40 °C | 260 | 40 | 624 | PLASTIC/EPOXY | LFBGA | BGA624,25X25,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.5 mm | 21 mm | 21 mm | NXP SEMICONDUCTORS | MAPBGA-624 | compliant | 5A992.C | 8542.31.00.01 | NXP | |||||||||||||
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SMJ34020AGBM40
Texas Instruments
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$1,053.3372 Buy | Yes | No | Not Recommended | 32 | 40 MHz | NO | 5 V | GRAPHICS PROCESSOR | CMOS | 32 | 280 mA | 5.25 V | 4.75 V | MILITARY | S-CPGA-P145 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 145 | CERAMIC, METAL-SEALED COFIRED | PGA | PGA145,15X15 | SQUARE | GRID ARRAY | Tin/Lead (Sn/Pb) | PIN/PEG | 2.54 mm | PERPENDICULAR | 5.21 mm | 39.75 mm | 39.75 mm | TEXAS INSTRUMENTS INC | PGA, PGA145,15X15 | not_compliant | 3A001.A.2.C | 8542.31.00.01 | PGA | 145 | 1990-04-01 | ||||||
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SMJ34020AGBM32
Texas Instruments
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$1,132.7541 Buy | Yes | No | Not Recommended | 32 | 32 MHz | NO | 5 V | GRAPHICS PROCESSOR | CMOS | 32 | 265 mA | 5.5 V | 4.5 V | MILITARY | S-CPGA-P145 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 145 | CERAMIC, METAL-SEALED COFIRED | PGA | PGA145,15X15 | SQUARE | GRID ARRAY | Tin/Lead (Sn/Pb) | PIN/PEG | 2.54 mm | PERPENDICULAR | 5.21 mm | 39.75 mm | 39.75 mm | TEXAS INSTRUMENTS INC | PGA, PGA145,15X15 | not_compliant | 3A001.A.2.C | 8542.31.00.01 | PGA | 145 | 1990-04-01 | ||||||
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5962-9162303MXC
Texas Instruments
|
$1,184.7981 Buy | Yes | No | Not Recommended | 32 | 32 MHz | NO | 5 V | GRAPHICS PROCESSOR | CMOS | 32 | 265 mA | 5.5 V | 4.5 V | MILITARY | S-CPGA-P145 | Qualified | 125 °C | -55 °C | NOT SPECIFIED | MIL-STD-883 | NOT SPECIFIED | 145 | CERAMIC, METAL-SEALED COFIRED | PGA | PGA144,15X15 | SQUARE | GRID ARRAY | PIN/PEG | 2.54 mm | PERPENDICULAR | 5.21 mm | 39.75 mm | 39.75 mm | TEXAS INSTRUMENTS INC | PGA, PGA144,15X15 | not_compliant | 3A001.A.2.C | 8542.31.00.01 | PGA | 145 |