Parametric results for: LMU217 under DSP Peripherals

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LX128C-32FN208C
Lattice Semiconductor Corporation
Check for Price Yes Obsolete 200 MHz YES 1.8 V DSP PERIPHERAL, CROSSBAR SWITCH CMOS YES NO 1.95 V 1.65 V S-PBGA-B208 Not Qualified e1 3 90 °C 250 40 208 PLASTIC/EPOXY BGA SQUARE GRID ARRAY TIN SILVER COPPER BALL 1 mm BOTTOM 2.1 mm 17 mm 17 mm LATTICE SEMICONDUCTOR CORP BGA LEAD FREE, FPBGA-208 208 not_compliant 3A991.A.2 8542.39.00.01
QS29FCT521CTL
Quality Semiconductor Inc
Check for Price No Obsolete 8 8 YES 5 V DSP PERIPHERAL, PIPELINE REGISTER CMOS MULTIPLEXED OUTPUTS NO YES 5.25 V 4.75 V COMMERCIAL S-CQCC-N28 Not Qualified e0 70 °C 28 CERAMIC, METAL-SEALED COFIRED QCCN LCC28,.45SQ SQUARE CHIP CARRIER TIN LEAD NO LEAD 1.27 mm QUAD QUALITY SEMICONDUCTOR INC unknown 8542.39.00.01
LMU217FMB25
LOGIC Devices Inc
Check for Price No Obsolete 16 40 MHz 32 YES 5 V DSP PERIPHERAL, MULTIPLIER CMOS NO NO 25 mA 5.5 V 4.5 V MILITARY S-CQFP-G64 Not Qualified e0 3 125 °C -55 °C 225 38535Q/M;38534H;883B 64 CERAMIC, METAL-SEALED COFIRED QFP QFL64,.9SQ SQUARE FLATPACK TIN LEAD GULL WING 1.27 mm QUAD 2.286 mm 22.86 mm 22.86 mm LOGIC DEVICES INC QFP QFP, QFL64,.9SQ 64 unknown 3A991.A.2 8542.39.00.01
TMC208KB5C
TRW Inc
Check for Price No Transferred NO DSP PERIPHERAL, MULTIPLIER CMOS COMMERCIAL R-CDIP-T40 Not Qualified e0 70 °C 40 CERAMIC, METAL-SEALED COFIRED DIP DIP40,.6 RECTANGULAR IN-LINE Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL TRW LSI PRODUCTS INC DIP, DIP40,.6 unknown 8542.39.00.01
AM29528DC
AMD
Check for Price No Obsolete 11 8 NO 5 V DSP PERIPHERAL, COORDINATE TRANSFORM PROCESSOR BIPOLAR NO NO 185 mA 5.25 V 4.75 V COMMERCIAL R-CDIP-T24 Not Qualified e0 70 °C 24 CERAMIC, METAL-SEALED COFIRED DIP DIP24,.3 RECTANGULAR IN-LINE TIN LEAD THROUGH-HOLE 2.54 mm DUAL 5.715 mm 15.24 mm 32.0675 mm ADVANCED MICRO DEVICES INC DIP DIP, DIP24,.3 24 unknown 8542.39.00.01
L64245FB-30
LSI Corporation
Check for Price No Transferred NO 5 V DSP PERIPHERAL, DIGITAL FILTER COMMERCIAL S-CPGA-P68 Not Qualified e0 70 °C 68 CERAMIC, METAL-SEALED COFIRED PGA PGA68,11X11 SQUARE GRID ARRAY Tin/Lead (Sn/Pb) PIN/PEG 2.54 mm PERPENDICULAR LSI CORP PGA, PGA68,11X11 unknown 8542.39.00.01
L64017DMC
LSI Corporation
Check for Price No Transferred NO 5 V DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER CMOS MILITARY R-CDIP-T64 e0 125 °C -55 °C 64 CERAMIC, METAL-SEALED COFIRED DIP DIP64,.9 RECTANGULAR IN-LINE Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL LSI CORP DIP, DIP64,.9 unknown 3A001.A.2.C 8542.39.00.01
MA7190ALE
Marconi Circuit Technology Inc
Check for Price No Obsolete 10 10 NO 5 V DSP PERIPHERAL, DIGITAL FILTER CMOS NO NO 140 mA OTHER S-CPGA-P68 Not Qualified e0 85 °C -25 °C 68 CERAMIC, METAL-SEALED COFIRED PGA PGA68,10X10 SQUARE GRID ARRAY Tin/Lead (Sn/Pb) PIN/PEG 2.54 mm PERPENDICULAR MARCONI CIRCUIT TECHNOLOGY INC PGA, PGA68,10X10 unknown 8542.39.00.01
MAX459C/D
Maxim Integrated Products
Check for Price No Obsolete 8 4 YES DSP PERIPHERAL, CROSSBAR SWITCH CMOS NO NO COMMERCIAL X-XUUC-N44 Not Qualified e0 70 °C 44 UNSPECIFIED DIE UNSPECIFIED UNCASED CHIP TIN LEAD NO LEAD UPPER MAXIM INTEGRATED PRODUCTS INC DIE, compliant 8542.39.00.01
IDT7210L55PQF
Integrated Device Technology Inc
Check for Price Obsolete 16 35 YES 5 V DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER CMOS NO YES 139.1 mA 5.5 V 4.5 V COMMERCIAL S-PQFP-F64 Not Qualified e0 70 °C 64 PLASTIC/EPOXY QFF SQUARE FLATPACK TIN LEAD FLAT 1.27 mm QUAD 2.286 mm 22.86 mm 22.86 mm INTEGRATED DEVICE TECHNOLOGY INC QFP QFF, 64 unknown 8542.39.00.01