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31 - 40 of 539,038 results
Select Parts | Part Number |
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23K640-I/P
Microchip Technology Inc
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IS62WV1288BLL-55HLI-TR
Integrated Silicon Solution Inc
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IS62WV1288BLL-55TLI-TR
Integrated Silicon Solution Inc
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IS66WV1M16EBLL-70BLI-TR
Integrated Silicon Solution Inc
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23LCV512-I/P
Microchip Technology Inc
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23A640-I/SN
Microchip Technology Inc
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IS62C256AL-45ULI-TR
Integrated Silicon Solution Inc
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IS61C256AL-12JLI-TR
Integrated Silicon Solution Inc
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IS61LV256AL-10TLI-TR
Integrated Silicon Solution Inc
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IS62C256AL-45TLI-TR
Integrated Silicon Solution Inc
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Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||||||||||||||||
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Composite Price
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Pbfree Code
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Rohs Code
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Part Life Cycle Code
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Memory Density
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Memory Width | Organization |
Supply Voltage-Nom (Vsup)
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Access Time-Max
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Clock Frequency-Max (fCLK) |
Memory IC Type
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I/O Type
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Number of Functions | Number of Ports | Number of Words Code | Number of Words |
Operating Mode
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Output Characteristics
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Output Enable
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Parallel/Serial
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Standby Current-Max
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Standby Voltage-Min
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Supply Current-Max
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Supply Voltage-Max (Vsup)
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Supply Voltage-Min (Vsup)
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Technology |
Temperature Grade
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JESD-30 Code
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Qualification Status
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JESD-609 Code
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Moisture Sensitivity Level
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Operating Temperature-Max
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Operating Temperature-Min
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Peak Reflow Temperature (Cel)
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Screening Level
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Time@Peak Reflow Temperature-Max (s)
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Number of Terminals
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Package Body Material
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Package Code
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Package Equivalence Code
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Package Shape
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Package Style
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Surface Mount
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Terminal Finish
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Terminal Form
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Terminal Pitch
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Terminal Position
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Seated Height-Max
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Length
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Width
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Ihs Manufacturer
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Part Package Code
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Package Description
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Pin Count
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Reach Compliance Code
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ECCN Code
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HTS Code
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Samacsys Manufacturer
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Yes | Yes | Active | 65.536 kbit | 8 | 8KX8 | 3 V | 20 MHz | STANDARD SRAM | SEPARATE | 1 | 1 | 8000 | 8.192 k | SYNCHRONOUS | 3-STATE | NO | SERIAL | 4 µA | 2.7 V | 10 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PDIP-T8 | Not Qualified | e3 | 85 °C | -40 °C | TS 16949 | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 5.334 mm | 9.271 mm | 7.62 mm | MICROCHIP TECHNOLOGY INC | DIP | 0.300 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, DIP-8 | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | |||||
Yes | Yes | Active | 1.0486 Mbit | 8 | 128KX8 | 3 V | 55 ns | STANDARD SRAM | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 3.6 V | 2.5 V | CMOS | INDUSTRIAL | R-PDSO-G32 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | TSOP1 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.25 mm | 11.8 mm | 8 mm | INTEGRATED SILICON SOLUTION INC | TSOP1 | TSOP1, | 32 | compliant | EAR99 | 8542.32.00.41 | Integrated Silicon Solution Inc. | |||||||||||||
Yes | Yes | Active | 1.0486 Mbit | 8 | 128KX8 | 3 V | 55 ns | STANDARD SRAM | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 3.6 V | 2.5 V | CMOS | INDUSTRIAL | R-PDSO-G32 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | TSOP1 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 8 mm | INTEGRATED SILICON SOLUTION INC | TSOP1 | TSOP1, | 32 | compliant | EAR99 | 8542.32.00.41 | Integrated Silicon Solution Inc. | |||||||||||||
Yes | Yes | Active | 16.7772 Mbit | 16 | 1MX16 | 3 V | 70 ns | PSEUDO STATIC RAM | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 3.6 V | 2.5 V | CMOS | INDUSTRIAL | R-PBGA-B48 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 48 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 750 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | INTEGRATED SILICON SOLUTION INC | TFBGA, | compliant | 3A991.B.2.A | 8542.32.00.41 | Integrated Silicon Solution Inc. | |||||||||||||||||
Yes | Active | 524.288 kbit | 8 | 64KX8 | 20 MHz | STANDARD SRAM | COMMON | 1 | 1 | 64000 | 65.536 k | SYNCHRONOUS | 3-STATE | NO | SERIAL | 10 µA | 2.5 V | 10 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | R-PDIP-T8 | e3 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 5.334 mm | 9.271 mm | 7.62 mm | MICROCHIP TECHNOLOGY INC | DIP-8 | compliant | EAR99 | 8542.32.00.51 | Microchip | |||||||||||
Yes | Yes | Active | 65.536 kbit | 8 | 8KX8 | 1.8 V | 16 MHz | STANDARD SRAM | SEPARATE | 1 | 1 | 8000 | 8.192 k | SYNCHRONOUS | 3-STATE | NO | SERIAL | 1 µA | 1.5 V | 10 µA | 1.95 V | 1.5 V | CMOS | INDUSTRIAL | R-PDSO-G8 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | TS 16949 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | MICROCHIP TECHNOLOGY INC | SOIC | 3.90 MM, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, NSOIC-8 | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | ||
Yes | Yes | Active | 262.144 kbit | 8 | 32KX8 | 5 V | 45 ns | STANDARD SRAM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PDSO-G28 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 28 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 2.84 mm | 18.11 mm | 8.405 mm | INTEGRATED SILICON SOLUTION INC | SOIC | SOP, | 28 | compliant | EAR99 | 8542.32.00.41 | Integrated Silicon Solution Inc. | |||||||||||
Yes | Yes | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 12 ns | STANDARD SRAM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PDSO-J28 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 28 | PLASTIC/EPOXY | SOJ | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | J BEND | 1.27 mm | DUAL | 3.56 mm | 18.415 mm | 7.62 mm | INTEGRATED SILICON SOLUTION INC | SOJ | SOJ, | 28 | compliant | EAR99 | 8542.32.00.41 | Integrated Silicon Solution Inc. | |||||||||||
Yes | Yes | Active | 262.144 kbit | 8 | 32KX8 | 3.3 V | 10 ns | STANDARD SRAM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 3.63 V | 3.135 V | CMOS | INDUSTRIAL | R-PDSO-G28 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | TSOP1 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 550 µm | DUAL | 1.2 mm | 11.8 mm | 8 mm | INTEGRATED SILICON SOLUTION INC | TSOP1 | TSOP1, | 28 | compliant | EAR99 | 8542.32.00.41 | Integrated Silicon Solution Inc. | |||||||||||||
Yes | Yes | Active | 262.144 kbit | 8 | 32KX8 | 5 V | 45 ns | STANDARD SRAM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PDSO-G28 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | TSOP1 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 550 µm | DUAL | 1.2 mm | 11.8 mm | 8 mm | INTEGRATED SILICON SOLUTION INC | TSOP | TSOP1, | 28 | compliant | EAR99 | 8542.32.00.41 | Integrated Silicon Solution Inc. |
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23K640-I/P
Microchip Technology Inc
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$0.7322 | Yes | Yes | Active | 65.536 kbit | 8 | 8KX8 | 3 V | 20 MHz | STANDARD SRAM | SEPARATE | 1 | 1 | 8000 | 8.192 k | SYNCHRONOUS | 3-STATE | NO | SERIAL | 4 µA | 2.7 V | 10 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | R-PDIP-T8 | Not Qualified | e3 | 85 °C | -40 °C | TS 16949 | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 5.334 mm | 9.271 mm | 7.62 mm | MICROCHIP TECHNOLOGY INC | DIP | 0.300 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, DIP-8 | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | ||||||
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IS62WV1288BLL-55HLI-TR
Integrated Silicon Solution Inc
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$0.7558 | Yes | Yes | Active | 1.0486 Mbit | 8 | 128KX8 | 3 V | 55 ns | STANDARD SRAM | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 3.6 V | 2.5 V | CMOS | INDUSTRIAL | R-PDSO-G32 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | TSOP1 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.25 mm | 11.8 mm | 8 mm | INTEGRATED SILICON SOLUTION INC | TSOP1 | TSOP1, | 32 | compliant | EAR99 | 8542.32.00.41 | Integrated Silicon Solution Inc. | ||||||||||||||
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IS62WV1288BLL-55TLI-TR
Integrated Silicon Solution Inc
|
$0.7558 | Yes | Yes | Active | 1.0486 Mbit | 8 | 128KX8 | 3 V | 55 ns | STANDARD SRAM | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 3.6 V | 2.5 V | CMOS | INDUSTRIAL | R-PDSO-G32 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | TSOP1 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 8 mm | INTEGRATED SILICON SOLUTION INC | TSOP1 | TSOP1, | 32 | compliant | EAR99 | 8542.32.00.41 | Integrated Silicon Solution Inc. | ||||||||||||||
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IS66WV1M16EBLL-70BLI-TR
Integrated Silicon Solution Inc
|
$0.8173 | Yes | Yes | Active | 16.7772 Mbit | 16 | 1MX16 | 3 V | 70 ns | PSEUDO STATIC RAM | 1 | 1000000 | 1.0486 M | ASYNCHRONOUS | PARALLEL | 3.6 V | 2.5 V | CMOS | INDUSTRIAL | R-PBGA-B48 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 48 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 750 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | INTEGRATED SILICON SOLUTION INC | TFBGA, | compliant | 3A991.B.2.A | 8542.32.00.41 | Integrated Silicon Solution Inc. | ||||||||||||||||||
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23LCV512-I/P
Microchip Technology Inc
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$0.8255 | Yes | Active | 524.288 kbit | 8 | 64KX8 | 20 MHz | STANDARD SRAM | COMMON | 1 | 1 | 64000 | 65.536 k | SYNCHRONOUS | 3-STATE | NO | SERIAL | 10 µA | 2.5 V | 10 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | R-PDIP-T8 | e3 | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 5.334 mm | 9.271 mm | 7.62 mm | MICROCHIP TECHNOLOGY INC | DIP-8 | compliant | EAR99 | 8542.32.00.51 | Microchip | ||||||||||||
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23A640-I/SN
Microchip Technology Inc
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$0.8277 | Yes | Yes | Active | 65.536 kbit | 8 | 8KX8 | 1.8 V | 16 MHz | STANDARD SRAM | SEPARATE | 1 | 1 | 8000 | 8.192 k | SYNCHRONOUS | 3-STATE | NO | SERIAL | 1 µA | 1.5 V | 10 µA | 1.95 V | 1.5 V | CMOS | INDUSTRIAL | R-PDSO-G8 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | TS 16949 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | MICROCHIP TECHNOLOGY INC | SOIC | 3.90 MM, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, NSOIC-8 | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | |||
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IS62C256AL-45ULI-TR
Integrated Silicon Solution Inc
|
$0.8301 | Yes | Yes | Active | 262.144 kbit | 8 | 32KX8 | 5 V | 45 ns | STANDARD SRAM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PDSO-G28 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 28 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 2.84 mm | 18.11 mm | 8.405 mm | INTEGRATED SILICON SOLUTION INC | SOIC | SOP, | 28 | compliant | EAR99 | 8542.32.00.41 | Integrated Silicon Solution Inc. | ||||||||||||
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IS61C256AL-12JLI-TR
Integrated Silicon Solution Inc
|
$0.8301 | Yes | Yes | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 12 ns | STANDARD SRAM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PDSO-J28 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 28 | PLASTIC/EPOXY | SOJ | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | J BEND | 1.27 mm | DUAL | 3.56 mm | 18.415 mm | 7.62 mm | INTEGRATED SILICON SOLUTION INC | SOJ | SOJ, | 28 | compliant | EAR99 | 8542.32.00.41 | Integrated Silicon Solution Inc. | ||||||||||||
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IS61LV256AL-10TLI-TR
Integrated Silicon Solution Inc
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$0.8301 | Yes | Yes | Active | 262.144 kbit | 8 | 32KX8 | 3.3 V | 10 ns | STANDARD SRAM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 3.63 V | 3.135 V | CMOS | INDUSTRIAL | R-PDSO-G28 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | TSOP1 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 550 µm | DUAL | 1.2 mm | 11.8 mm | 8 mm | INTEGRATED SILICON SOLUTION INC | TSOP1 | TSOP1, | 28 | compliant | EAR99 | 8542.32.00.41 | Integrated Silicon Solution Inc. | ||||||||||||||
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IS62C256AL-45TLI-TR
Integrated Silicon Solution Inc
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$0.8301 | Yes | Yes | Active | 262.144 kbit | 8 | 32KX8 | 5 V | 45 ns | STANDARD SRAM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PDSO-G28 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | TSOP1 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 550 µm | DUAL | 1.2 mm | 11.8 mm | 8 mm | INTEGRATED SILICON SOLUTION INC | TSOP | TSOP1, | 28 | compliant | EAR99 | 8542.32.00.41 | Integrated Silicon Solution Inc. |