Parametric results for: TC55NEM208AFPN70 under SRAMs

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0.453000.4575150225300
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Select parts from the table below to compare.
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Select Parts Part Number
23K640-I/P
Microchip Technology Inc
IS62WV1288BLL-55HLI-TR
Integrated Silicon Solution Inc
IS62WV1288BLL-55TLI-TR
Integrated Silicon Solution Inc
IS66WV1M16EBLL-70BLI-TR
Integrated Silicon Solution Inc
23LCV512-I/P
Microchip Technology Inc
23A640-I/SN
Microchip Technology Inc
IS62C256AL-45ULI-TR
Integrated Silicon Solution Inc
IS61C256AL-12JLI-TR
Integrated Silicon Solution Inc
IS61LV256AL-10TLI-TR
Integrated Silicon Solution Inc
IS62C256AL-45TLI-TR
Integrated Silicon Solution Inc
Most Relevant Technical Compliance Operating Conditions Physical Dimensions Other
Composite Price
Pbfree Code
Rohs Code
Part Life Cycle Code
Memory Density
Memory Width Organization Supply Voltage-Nom (Vsup)
Access Time-Max
Clock Frequency-Max (fCLK) Memory IC Type
I/O Type
Number of Functions Number of Ports Number of Words Code Number of Words Operating Mode
Output Characteristics
Output Enable
Parallel/Serial
Standby Current-Max
Standby Voltage-Min
Supply Current-Max
Supply Voltage-Max (Vsup)
Supply Voltage-Min (Vsup)
Technology Temperature Grade
JESD-30 Code
Qualification Status
JESD-609 Code
Moisture Sensitivity Level
Operating Temperature-Max
Operating Temperature-Min
Peak Reflow Temperature (Cel)
Screening Level
Time@Peak Reflow Temperature-Max (s)
Number of Terminals
Package Body Material
Package Code
Package Equivalence Code
Package Shape
Package Style
Surface Mount
Terminal Finish
Terminal Form
Terminal Pitch
Terminal Position
Seated Height-Max
Length
Width
Ihs Manufacturer
Part Package Code
Package Description
Pin Count
Reach Compliance Code
ECCN Code
HTS Code
Samacsys Manufacturer
Yes Yes Active 65.536 kbit 8 8KX8 3 V 20 MHz STANDARD SRAM SEPARATE 1 1 8000 8.192 k SYNCHRONOUS 3-STATE NO SERIAL 4 µA 2.7 V 10 µA 3.6 V 2.7 V CMOS INDUSTRIAL R-PDIP-T8 Not Qualified e3 85 °C -40 °C TS 16949 8 PLASTIC/EPOXY DIP DIP8,.3 RECTANGULAR IN-LINE NO MATTE TIN THROUGH-HOLE 2.54 mm DUAL 5.334 mm 9.271 mm 7.62 mm MICROCHIP TECHNOLOGY INC DIP 0.300 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, DIP-8 8 compliant EAR99 8542.32.00.51 Microchip
Yes Yes Active 1.0486 Mbit 8 128KX8 3 V 55 ns STANDARD SRAM 1 128000 131.072 k ASYNCHRONOUS PARALLEL 3.6 V 2.5 V CMOS INDUSTRIAL R-PDSO-G32 Not Qualified e3 3 85 °C -40 °C 32 PLASTIC/EPOXY TSOP1 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES MATTE TIN GULL WING 500 µm DUAL 1.25 mm 11.8 mm 8 mm INTEGRATED SILICON SOLUTION INC TSOP1 TSOP1, 32 compliant EAR99 8542.32.00.41 Integrated Silicon Solution Inc.
Yes Yes Active 1.0486 Mbit 8 128KX8 3 V 55 ns STANDARD SRAM 1 128000 131.072 k ASYNCHRONOUS PARALLEL 3.6 V 2.5 V CMOS INDUSTRIAL R-PDSO-G32 Not Qualified e3 3 85 °C -40 °C 32 PLASTIC/EPOXY TSOP1 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 8 mm INTEGRATED SILICON SOLUTION INC TSOP1 TSOP1, 32 compliant EAR99 8542.32.00.41 Integrated Silicon Solution Inc.
Yes Yes Active 16.7772 Mbit 16 1MX16 3 V 70 ns PSEUDO STATIC RAM 1 1000000 1.0486 M ASYNCHRONOUS PARALLEL 3.6 V 2.5 V CMOS INDUSTRIAL R-PBGA-B48 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 48 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 750 µm BOTTOM 1.2 mm 8 mm 6 mm INTEGRATED SILICON SOLUTION INC TFBGA, compliant 3A991.B.2.A 8542.32.00.41 Integrated Silicon Solution Inc.
Yes Active 524.288 kbit 8 64KX8 20 MHz STANDARD SRAM COMMON 1 1 64000 65.536 k SYNCHRONOUS 3-STATE NO SERIAL 10 µA 2.5 V 10 µA 5.5 V 2.5 V CMOS INDUSTRIAL R-PDIP-T8 e3 85 °C -40 °C 8 PLASTIC/EPOXY DIP DIP8,.3 RECTANGULAR IN-LINE NO MATTE TIN THROUGH-HOLE 2.54 mm DUAL 5.334 mm 9.271 mm 7.62 mm MICROCHIP TECHNOLOGY INC DIP-8 compliant EAR99 8542.32.00.51 Microchip
Yes Yes Active 65.536 kbit 8 8KX8 1.8 V 16 MHz STANDARD SRAM SEPARATE 1 1 8000 8.192 k SYNCHRONOUS 3-STATE NO SERIAL 1 µA 1.5 V 10 µA 1.95 V 1.5 V CMOS INDUSTRIAL R-PDSO-G8 Not Qualified e3 3 85 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY SOP SOP8,.23 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm MICROCHIP TECHNOLOGY INC SOIC 3.90 MM, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, NSOIC-8 8 compliant EAR99 8542.32.00.51 Microchip
Yes Yes Active 262.144 kbit 8 32KX8 5 V 45 ns STANDARD SRAM 1 32000 32.768 k ASYNCHRONOUS PARALLEL 5.5 V 4.5 V CMOS INDUSTRIAL R-PDSO-G28 Not Qualified e3 3 85 °C -40 °C 260 40 28 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES Matte Tin (Sn) GULL WING 1.27 mm DUAL 2.84 mm 18.11 mm 8.405 mm INTEGRATED SILICON SOLUTION INC SOIC SOP, 28 compliant EAR99 8542.32.00.41 Integrated Silicon Solution Inc.
Yes Yes Obsolete 262.144 kbit 8 32KX8 5 V 12 ns STANDARD SRAM 1 32000 32.768 k ASYNCHRONOUS PARALLEL 5.5 V 4.5 V CMOS INDUSTRIAL R-PDSO-J28 Not Qualified e3 3 85 °C -40 °C 260 40 28 PLASTIC/EPOXY SOJ RECTANGULAR SMALL OUTLINE YES Matte Tin (Sn) J BEND 1.27 mm DUAL 3.56 mm 18.415 mm 7.62 mm INTEGRATED SILICON SOLUTION INC SOJ SOJ, 28 compliant EAR99 8542.32.00.41 Integrated Silicon Solution Inc.
Yes Yes Active 262.144 kbit 8 32KX8 3.3 V 10 ns STANDARD SRAM 1 32000 32.768 k ASYNCHRONOUS PARALLEL 3.63 V 3.135 V CMOS INDUSTRIAL R-PDSO-G28 Not Qualified e3 3 85 °C -40 °C 28 PLASTIC/EPOXY TSOP1 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES MATTE TIN GULL WING 550 µm DUAL 1.2 mm 11.8 mm 8 mm INTEGRATED SILICON SOLUTION INC TSOP1 TSOP1, 28 compliant EAR99 8542.32.00.41 Integrated Silicon Solution Inc.
Yes Yes Active 262.144 kbit 8 32KX8 5 V 45 ns STANDARD SRAM 1 32000 32.768 k ASYNCHRONOUS PARALLEL 5.5 V 4.5 V CMOS INDUSTRIAL R-PDSO-G28 Not Qualified e3 3 85 °C -40 °C 28 PLASTIC/EPOXY TSOP1 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES MATTE TIN GULL WING 550 µm DUAL 1.2 mm 11.8 mm 8 mm INTEGRATED SILICON SOLUTION INC TSOP TSOP1, 28 compliant EAR99 8542.32.00.41 Integrated Silicon Solution Inc.
Compare
23K640-I/P
Microchip Technology Inc
$0.7322 Yes Yes Active 65.536 kbit 8 8KX8 3 V 20 MHz STANDARD SRAM SEPARATE 1 1 8000 8.192 k SYNCHRONOUS 3-STATE NO SERIAL 4 µA 2.7 V 10 µA 3.6 V 2.7 V CMOS INDUSTRIAL R-PDIP-T8 Not Qualified e3 85 °C -40 °C TS 16949 8 PLASTIC/EPOXY DIP DIP8,.3 RECTANGULAR IN-LINE NO MATTE TIN THROUGH-HOLE 2.54 mm DUAL 5.334 mm 9.271 mm 7.62 mm MICROCHIP TECHNOLOGY INC DIP 0.300 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, DIP-8 8 compliant EAR99 8542.32.00.51 Microchip
IS62WV1288BLL-55HLI-TR
Integrated Silicon Solution Inc
$0.7558 Yes Yes Active 1.0486 Mbit 8 128KX8 3 V 55 ns STANDARD SRAM 1 128000 131.072 k ASYNCHRONOUS PARALLEL 3.6 V 2.5 V CMOS INDUSTRIAL R-PDSO-G32 Not Qualified e3 3 85 °C -40 °C 32 PLASTIC/EPOXY TSOP1 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES MATTE TIN GULL WING 500 µm DUAL 1.25 mm 11.8 mm 8 mm INTEGRATED SILICON SOLUTION INC TSOP1 TSOP1, 32 compliant EAR99 8542.32.00.41 Integrated Silicon Solution Inc.
IS62WV1288BLL-55TLI-TR
Integrated Silicon Solution Inc
$0.7558 Yes Yes Active 1.0486 Mbit 8 128KX8 3 V 55 ns STANDARD SRAM 1 128000 131.072 k ASYNCHRONOUS PARALLEL 3.6 V 2.5 V CMOS INDUSTRIAL R-PDSO-G32 Not Qualified e3 3 85 °C -40 °C 32 PLASTIC/EPOXY TSOP1 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES MATTE TIN GULL WING 500 µm DUAL 1.2 mm 18.4 mm 8 mm INTEGRATED SILICON SOLUTION INC TSOP1 TSOP1, 32 compliant EAR99 8542.32.00.41 Integrated Silicon Solution Inc.
IS66WV1M16EBLL-70BLI-TR
Integrated Silicon Solution Inc
$0.8173 Yes Yes Active 16.7772 Mbit 16 1MX16 3 V 70 ns PSEUDO STATIC RAM 1 1000000 1.0486 M ASYNCHRONOUS PARALLEL 3.6 V 2.5 V CMOS INDUSTRIAL R-PBGA-B48 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 48 PLASTIC/EPOXY TFBGA RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES BALL 750 µm BOTTOM 1.2 mm 8 mm 6 mm INTEGRATED SILICON SOLUTION INC TFBGA, compliant 3A991.B.2.A 8542.32.00.41 Integrated Silicon Solution Inc.
23LCV512-I/P
Microchip Technology Inc
$0.8255 Yes Active 524.288 kbit 8 64KX8 20 MHz STANDARD SRAM COMMON 1 1 64000 65.536 k SYNCHRONOUS 3-STATE NO SERIAL 10 µA 2.5 V 10 µA 5.5 V 2.5 V CMOS INDUSTRIAL R-PDIP-T8 e3 85 °C -40 °C 8 PLASTIC/EPOXY DIP DIP8,.3 RECTANGULAR IN-LINE NO MATTE TIN THROUGH-HOLE 2.54 mm DUAL 5.334 mm 9.271 mm 7.62 mm MICROCHIP TECHNOLOGY INC DIP-8 compliant EAR99 8542.32.00.51 Microchip
23A640-I/SN
Microchip Technology Inc
$0.8277 Yes Yes Active 65.536 kbit 8 8KX8 1.8 V 16 MHz STANDARD SRAM SEPARATE 1 1 8000 8.192 k SYNCHRONOUS 3-STATE NO SERIAL 1 µA 1.5 V 10 µA 1.95 V 1.5 V CMOS INDUSTRIAL R-PDSO-G8 Not Qualified e3 3 85 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY SOP SOP8,.23 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm MICROCHIP TECHNOLOGY INC SOIC 3.90 MM, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, NSOIC-8 8 compliant EAR99 8542.32.00.51 Microchip
IS62C256AL-45ULI-TR
Integrated Silicon Solution Inc
$0.8301 Yes Yes Active 262.144 kbit 8 32KX8 5 V 45 ns STANDARD SRAM 1 32000 32.768 k ASYNCHRONOUS PARALLEL 5.5 V 4.5 V CMOS INDUSTRIAL R-PDSO-G28 Not Qualified e3 3 85 °C -40 °C 260 40 28 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES Matte Tin (Sn) GULL WING 1.27 mm DUAL 2.84 mm 18.11 mm 8.405 mm INTEGRATED SILICON SOLUTION INC SOIC SOP, 28 compliant EAR99 8542.32.00.41 Integrated Silicon Solution Inc.
IS61C256AL-12JLI-TR
Integrated Silicon Solution Inc
$0.8301 Yes Yes Obsolete 262.144 kbit 8 32KX8 5 V 12 ns STANDARD SRAM 1 32000 32.768 k ASYNCHRONOUS PARALLEL 5.5 V 4.5 V CMOS INDUSTRIAL R-PDSO-J28 Not Qualified e3 3 85 °C -40 °C 260 40 28 PLASTIC/EPOXY SOJ RECTANGULAR SMALL OUTLINE YES Matte Tin (Sn) J BEND 1.27 mm DUAL 3.56 mm 18.415 mm 7.62 mm INTEGRATED SILICON SOLUTION INC SOJ SOJ, 28 compliant EAR99 8542.32.00.41 Integrated Silicon Solution Inc.
IS61LV256AL-10TLI-TR
Integrated Silicon Solution Inc
$0.8301 Yes Yes Active 262.144 kbit 8 32KX8 3.3 V 10 ns STANDARD SRAM 1 32000 32.768 k ASYNCHRONOUS PARALLEL 3.63 V 3.135 V CMOS INDUSTRIAL R-PDSO-G28 Not Qualified e3 3 85 °C -40 °C 28 PLASTIC/EPOXY TSOP1 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES MATTE TIN GULL WING 550 µm DUAL 1.2 mm 11.8 mm 8 mm INTEGRATED SILICON SOLUTION INC TSOP1 TSOP1, 28 compliant EAR99 8542.32.00.41 Integrated Silicon Solution Inc.
IS62C256AL-45TLI-TR
Integrated Silicon Solution Inc
$0.8301 Yes Yes Active 262.144 kbit 8 32KX8 5 V 45 ns STANDARD SRAM 1 32000 32.768 k ASYNCHRONOUS PARALLEL 5.5 V 4.5 V CMOS INDUSTRIAL R-PDSO-G28 Not Qualified e3 3 85 °C -40 °C 28 PLASTIC/EPOXY TSOP1 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES MATTE TIN GULL WING 550 µm DUAL 1.2 mm 11.8 mm 8 mm INTEGRATED SILICON SOLUTION INC TSOP TSOP1, 28 compliant EAR99 8542.32.00.41 Integrated Silicon Solution Inc.