Parametric results for: fm25160-c under SRAMs

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0.453000.4575150225300
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113613569102136
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1663316170325479633
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10201013151820
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10 000 000 000100 000 000 000 00010 000 000 00025 007 500 000 00050 005 000 000 00075 002 500 000 000100 000 000 000 000
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760.96720344760.96
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16536 870 91216134 217 740268 435 464536 870 912
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1272169137204272
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-5.2-4.5-5.2-5.03-4.85-4.68-4.5
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4536 870 9124134 217 731268 435 458536 870 912
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4512 000 0004128 000 003256 000 002512 000 000
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252252575125175225
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-5525-55-35-15525
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648 192642 0964 1286 1608 192
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1.2101.23.45.67.810
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Select parts from the table below to compare.
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Select Parts Part Number
IS62C256AL-45TLI-TR
Integrated Silicon Solution Inc
23K640-I/ST
Microchip Technology Inc
23K640T-I/SN
Microchip Technology Inc
23A640T-I/SN
Microchip Technology Inc
23A640-I/P
Microchip Technology Inc
IS61WV25616BLL-10TLI-TR
Integrated Silicon Solution Inc
IS62LV256AL-45TLI
Integrated Silicon Solution Inc
23A640T-I/ST
Microchip Technology Inc
23A640-I/ST
Microchip Technology Inc
23K640T-I/ST
Microchip Technology Inc
Most Relevant Technical Compliance Operating Conditions Physical Dimensions Other
Composite Price
Pbfree Code
Rohs Code
Part Life Cycle Code
Memory Density
Memory Width Organization Supply Voltage-Nom (Vsup)
Access Time-Max
Clock Frequency-Max (fCLK) Memory IC Type
I/O Type
Number of Functions Number of Ports Number of Words Code Number of Words Operating Mode
Output Characteristics
Output Enable
Parallel/Serial
Standby Current-Max
Standby Voltage-Min
Supply Current-Max
Supply Voltage-Max (Vsup)
Supply Voltage-Min (Vsup)
Technology Temperature Grade
JESD-30 Code
Qualification Status
JESD-609 Code
Moisture Sensitivity Level
Operating Temperature-Max
Operating Temperature-Min
Peak Reflow Temperature (Cel)
Screening Level
Time@Peak Reflow Temperature-Max (s)
Number of Terminals
Package Body Material
Package Code
Package Equivalence Code
Package Shape
Package Style
Surface Mount
Terminal Finish
Terminal Form
Terminal Pitch
Terminal Position
Seated Height-Max
Length
Width
Ihs Manufacturer
Part Package Code
Package Description
Pin Count
Reach Compliance Code
ECCN Code
HTS Code
Samacsys Manufacturer
Yes Yes Active 262.144 kbit 8 32KX8 5 V 45 ns STANDARD SRAM 1 32000 32.768 k ASYNCHRONOUS PARALLEL 5.5 V 4.5 V CMOS INDUSTRIAL R-PDSO-G28 Not Qualified e3 3 85 °C -40 °C 28 PLASTIC/EPOXY TSOP1 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES MATTE TIN GULL WING 550 µm DUAL 1.2 mm 11.8 mm 8 mm INTEGRATED SILICON SOLUTION INC TSOP TSOP1, 28 compliant EAR99 8542.32.00.41 Integrated Silicon Solution Inc.
Yes Yes Active 65.536 kbit 8 8KX8 3 V 20 MHz STANDARD SRAM SEPARATE 1 1 8000 8.192 k SYNCHRONOUS 3-STATE NO SERIAL 4 µA 2.7 V 10 µA 3.6 V 2.7 V CMOS INDUSTRIAL R-PDSO-G8 Not Qualified e3 1 85 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY TSSOP TSSOP8,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 1.2 mm 4.4 mm 3 mm MICROCHIP TECHNOLOGY INC SOIC 4.40 MM, PLASTIC, TSSOP-8 8 compliant EAR99 8542.32.00.51 Microchip
Yes Yes Active 65.536 kbit 8 8KX8 3 V 20 MHz STANDARD SRAM SEPARATE 1 1 8000 8.192 k SYNCHRONOUS 3-STATE NO SERIAL 4 µA 2.7 V 10 µA 3.6 V 2.7 V CMOS INDUSTRIAL R-PDSO-G8 Not Qualified e3 3 85 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY SOP SOP8,.23 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm MICROCHIP TECHNOLOGY INC SOIC 3.90 MM, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, NSOIC-8 8 compliant EAR99 8542.32.00.41 Microchip
Yes Yes Active 65.536 kbit 8 8KX8 1.8 V 16 MHz STANDARD SRAM SEPARATE 1 1 8000 8.192 k SYNCHRONOUS 3-STATE NO SERIAL 1 µA 1.5 V 10 µA 1.95 V 1.5 V CMOS INDUSTRIAL R-PDSO-G8 Not Qualified e3 3 85 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY SOP SOP8,.23 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm MICROCHIP TECHNOLOGY INC SOIC 3.90 MM, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, NSOIC-8 8 compliant EAR99 8542.32.00.41 Microchip
Yes Yes Active 65.536 kbit 8 8KX8 1.8 V 16 MHz STANDARD SRAM SEPARATE 1 1 8000 8.192 k SYNCHRONOUS 3-STATE NO SERIAL 1 µA 1.5 V 10 µA 1.95 V 1.5 V CMOS INDUSTRIAL R-PDIP-T8 Not Qualified e3 85 °C -40 °C TS 16949 8 PLASTIC/EPOXY DIP DIP8,.3 RECTANGULAR IN-LINE NO MATTE TIN THROUGH-HOLE 2.54 mm DUAL 5.334 mm 9.271 mm 7.62 mm MICROCHIP TECHNOLOGY INC DIP 0.300 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, DIP-8 8 compliant EAR99 8542.32.00.41 Microchip
Yes Yes Active 4.1943 Mbit 16 256KX16 3 V 10 ns STANDARD SRAM COMMON 1 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 9 mA 2 V 45 µA 3.6 V 2.4 V CMOS INDUSTRIAL R-PDSO-G44 Not Qualified e3 3 85 °C -40 °C 44 PLASTIC/EPOXY TSOP2 TSOP44,.46,32 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES Matte Tin (Sn) GULL WING 800 µm DUAL 1.2 mm 18.41 mm 10.16 mm INTEGRATED SILICON SOLUTION INC TSOP2 TSOP2, TSOP44,.46,32 44 compliant 3A991.B.2.A 8542.32.00.41 Integrated Silicon Solution Inc.
Yes Yes Active 262.144 kbit 8 32KX8 3.3 V 45 ns STANDARD SRAM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 20 µA 2 V 12 µA 3.63 V 2.97 V CMOS INDUSTRIAL R-PDSO-G28 Not Qualified e3 3 85 °C -40 °C 260 30 28 PLASTIC/EPOXY TSOP1 TSSOP28,.53,22 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES MATTE TIN GULL WING 550 µm DUAL 1.2 mm 11.8 mm 8 mm INTEGRATED SILICON SOLUTION INC TSOP TSOP1, TSSOP28,.53,22 28 compliant EAR99 8542.32.00.41 Integrated Silicon Solution Inc.
Yes Yes Active 65.536 kbit 8 8KX8 1.8 V 16 MHz STANDARD SRAM SEPARATE 1 1 8000 8.192 k SYNCHRONOUS 3-STATE NO SERIAL 1 µA 1.5 V 10 µA 1.95 V 1.5 V CMOS INDUSTRIAL R-PDSO-G8 Not Qualified e3 1 85 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY TSSOP TSSOP8,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 1.2 mm 4.4 mm 3 mm MICROCHIP TECHNOLOGY INC SOIC 4.40 MM, PLASTIC, TSSOP-8 8 compliant EAR99 8542.32.00.51 Microchip
Yes Yes Active 65.536 kbit 8 8KX8 1.8 V 16 MHz STANDARD SRAM SEPARATE 1 1 8000 8.192 k SYNCHRONOUS 3-STATE NO SERIAL 1 µA 1.5 V 10 µA 1.95 V 1.5 V CMOS INDUSTRIAL R-PDSO-G8 Not Qualified e3 1 85 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY TSSOP TSSOP8,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 1.2 mm 4.4 mm 3 mm MICROCHIP TECHNOLOGY INC SOIC 4.40 MM, PLASTIC, TSSOP-8 8 compliant EAR99 8542.32.00.51 Microchip
Yes Yes Active 65.536 kbit 8 8KX8 3 V 20 MHz STANDARD SRAM SEPARATE 1 1 8000 8.192 k SYNCHRONOUS 3-STATE NO SERIAL 4 µA 2.7 V 10 µA 3.6 V 2.7 V CMOS INDUSTRIAL R-PDSO-G8 Not Qualified e3 1 85 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY TSSOP TSSOP8,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 1.2 mm 4.4 mm 3 mm MICROCHIP TECHNOLOGY INC SOIC 4.40 MM, PLASTIC, TSSOP-8 8 compliant EAR99 8542.32.00.51 Microchip
Compare
IS62C256AL-45TLI-TR
Integrated Silicon Solution Inc
$0.8301 Yes Yes Active 262.144 kbit 8 32KX8 5 V 45 ns STANDARD SRAM 1 32000 32.768 k ASYNCHRONOUS PARALLEL 5.5 V 4.5 V CMOS INDUSTRIAL R-PDSO-G28 Not Qualified e3 3 85 °C -40 °C 28 PLASTIC/EPOXY TSOP1 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES MATTE TIN GULL WING 550 µm DUAL 1.2 mm 11.8 mm 8 mm INTEGRATED SILICON SOLUTION INC TSOP TSOP1, 28 compliant EAR99 8542.32.00.41 Integrated Silicon Solution Inc.
23K640-I/ST
Microchip Technology Inc
$0.8554 Yes Yes Active 65.536 kbit 8 8KX8 3 V 20 MHz STANDARD SRAM SEPARATE 1 1 8000 8.192 k SYNCHRONOUS 3-STATE NO SERIAL 4 µA 2.7 V 10 µA 3.6 V 2.7 V CMOS INDUSTRIAL R-PDSO-G8 Not Qualified e3 1 85 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY TSSOP TSSOP8,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 1.2 mm 4.4 mm 3 mm MICROCHIP TECHNOLOGY INC SOIC 4.40 MM, PLASTIC, TSSOP-8 8 compliant EAR99 8542.32.00.51 Microchip
23K640T-I/SN
Microchip Technology Inc
$0.8760 Yes Yes Active 65.536 kbit 8 8KX8 3 V 20 MHz STANDARD SRAM SEPARATE 1 1 8000 8.192 k SYNCHRONOUS 3-STATE NO SERIAL 4 µA 2.7 V 10 µA 3.6 V 2.7 V CMOS INDUSTRIAL R-PDSO-G8 Not Qualified e3 3 85 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY SOP SOP8,.23 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm MICROCHIP TECHNOLOGY INC SOIC 3.90 MM, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, NSOIC-8 8 compliant EAR99 8542.32.00.41 Microchip
23A640T-I/SN
Microchip Technology Inc
$0.8760 Yes Yes Active 65.536 kbit 8 8KX8 1.8 V 16 MHz STANDARD SRAM SEPARATE 1 1 8000 8.192 k SYNCHRONOUS 3-STATE NO SERIAL 1 µA 1.5 V 10 µA 1.95 V 1.5 V CMOS INDUSTRIAL R-PDSO-G8 Not Qualified e3 3 85 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY SOP SOP8,.23 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 1.75 mm 4.9 mm 3.9 mm MICROCHIP TECHNOLOGY INC SOIC 3.90 MM, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, NSOIC-8 8 compliant EAR99 8542.32.00.41 Microchip
23A640-I/P
Microchip Technology Inc
$0.9069 Yes Yes Active 65.536 kbit 8 8KX8 1.8 V 16 MHz STANDARD SRAM SEPARATE 1 1 8000 8.192 k SYNCHRONOUS 3-STATE NO SERIAL 1 µA 1.5 V 10 µA 1.95 V 1.5 V CMOS INDUSTRIAL R-PDIP-T8 Not Qualified e3 85 °C -40 °C TS 16949 8 PLASTIC/EPOXY DIP DIP8,.3 RECTANGULAR IN-LINE NO MATTE TIN THROUGH-HOLE 2.54 mm DUAL 5.334 mm 9.271 mm 7.62 mm MICROCHIP TECHNOLOGY INC DIP 0.300 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, DIP-8 8 compliant EAR99 8542.32.00.41 Microchip
IS61WV25616BLL-10TLI-TR
Integrated Silicon Solution Inc
$0.9099 Yes Yes Active 4.1943 Mbit 16 256KX16 3 V 10 ns STANDARD SRAM COMMON 1 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 9 mA 2 V 45 µA 3.6 V 2.4 V CMOS INDUSTRIAL R-PDSO-G44 Not Qualified e3 3 85 °C -40 °C 44 PLASTIC/EPOXY TSOP2 TSOP44,.46,32 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES Matte Tin (Sn) GULL WING 800 µm DUAL 1.2 mm 18.41 mm 10.16 mm INTEGRATED SILICON SOLUTION INC TSOP2 TSOP2, TSOP44,.46,32 44 compliant 3A991.B.2.A 8542.32.00.41 Integrated Silicon Solution Inc.
IS62LV256AL-45TLI
Integrated Silicon Solution Inc
$0.9148 Yes Yes Active 262.144 kbit 8 32KX8 3.3 V 45 ns STANDARD SRAM COMMON 1 32000 32.768 k ASYNCHRONOUS 3-STATE PARALLEL 20 µA 2 V 12 µA 3.63 V 2.97 V CMOS INDUSTRIAL R-PDSO-G28 Not Qualified e3 3 85 °C -40 °C 260 30 28 PLASTIC/EPOXY TSOP1 TSSOP28,.53,22 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES MATTE TIN GULL WING 550 µm DUAL 1.2 mm 11.8 mm 8 mm INTEGRATED SILICON SOLUTION INC TSOP TSOP1, TSSOP28,.53,22 28 compliant EAR99 8542.32.00.41 Integrated Silicon Solution Inc.
23A640T-I/ST
Microchip Technology Inc
$0.9425 Yes Yes Active 65.536 kbit 8 8KX8 1.8 V 16 MHz STANDARD SRAM SEPARATE 1 1 8000 8.192 k SYNCHRONOUS 3-STATE NO SERIAL 1 µA 1.5 V 10 µA 1.95 V 1.5 V CMOS INDUSTRIAL R-PDSO-G8 Not Qualified e3 1 85 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY TSSOP TSSOP8,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 1.2 mm 4.4 mm 3 mm MICROCHIP TECHNOLOGY INC SOIC 4.40 MM, PLASTIC, TSSOP-8 8 compliant EAR99 8542.32.00.51 Microchip
23A640-I/ST
Microchip Technology Inc
$0.9425 Yes Yes Active 65.536 kbit 8 8KX8 1.8 V 16 MHz STANDARD SRAM SEPARATE 1 1 8000 8.192 k SYNCHRONOUS 3-STATE NO SERIAL 1 µA 1.5 V 10 µA 1.95 V 1.5 V CMOS INDUSTRIAL R-PDSO-G8 Not Qualified e3 1 85 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY TSSOP TSSOP8,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 1.2 mm 4.4 mm 3 mm MICROCHIP TECHNOLOGY INC SOIC 4.40 MM, PLASTIC, TSSOP-8 8 compliant EAR99 8542.32.00.51 Microchip
23K640T-I/ST
Microchip Technology Inc
$0.9575 Yes Yes Active 65.536 kbit 8 8KX8 3 V 20 MHz STANDARD SRAM SEPARATE 1 1 8000 8.192 k SYNCHRONOUS 3-STATE NO SERIAL 4 µA 2.7 V 10 µA 3.6 V 2.7 V CMOS INDUSTRIAL R-PDSO-G8 Not Qualified e3 1 85 °C -40 °C 260 TS 16949 40 8 PLASTIC/EPOXY TSSOP TSSOP8,.25 RECTANGULAR SMALL OUTLINE, THIN PROFILE, SHRINK PITCH YES MATTE TIN GULL WING 650 µm DUAL 1.2 mm 4.4 mm 3 mm MICROCHIP TECHNOLOGY INC SOIC 4.40 MM, PLASTIC, TSSOP-8 8 compliant EAR99 8542.32.00.51 Microchip