Datasheets
S75NS128NDEZFWNK2 by:

Memory Circuit, 8MX16, CMOS, PBGA133, 11 X 10 MM, 1.02 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, FBGA-133

Part Details for S75NS128NDEZFWNK2 by Spansion

Overview of S75NS128NDEZFWNK2 by Spansion

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Applications Computing and Data Storage

Part Details for S75NS128NDEZFWNK2

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S75NS128NDEZFWNK2 Part Data Attributes:

S75NS128NDEZFWNK2 Spansion
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S75NS128NDEZFWNK2 Spansion Memory Circuit, 8MX16, CMOS, PBGA133, 11 X 10 MM, 1.02 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, FBGA-133
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SPANSION INC
Part Package Code BGA
Package Description LFBGA,
Pin Count 133
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.71
JESD-30 Code R-PBGA-B133
JESD-609 Code e1
Length 11 mm
Memory Density 134217728 bit
Memory IC Type MEMORY CIRCUIT
Memory Width 16
Number of Functions 1
Number of Terminals 133
Number of Words 8388608 words
Number of Words Code 8000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -25 °C
Organization 8MX16
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.3 mm
Supply Voltage-Max (Vsup) 1.95 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 0.5 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 10 mm

Alternate Parts for S75NS128NDEZFWNK2

This table gives cross-reference parts and alternative options found for S75NS128NDEZFWNK2. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of S75NS128NDEZFWNK2, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
S75NS128NDEZFWNK3 Memory Circuit, 8MX16, CMOS, PBGA133, 11 X 10 MM, 1.02 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, FBGA-133 Spansion S75NS128NDEZFWNK2 vs S75NS128NDEZFWNK3
S75NS128NDEZJWNK3 Memory Circuit, 8MX16, CMOS, PBGA133, 11 X 10 MM, 1.02 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, FBGA-133 Spansion S75NS128NDEZFWNK2 vs S75NS128NDEZJWNK3
Part Number Description Manufacturer Compare
S75NS128NDEZJWNK3 Memory Circuit, 8MX16, CMOS, PBGA133, 11 X 10 MM, 1.02 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, FBGA-133 Spansion S75NS128NDEZFWNK2 vs S75NS128NDEZJWNK3
S75NS128NDEZFWNK3 Memory Circuit, 8MX16, CMOS, PBGA133, 11 X 10 MM, 1.02 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, FBGA-133 Spansion S75NS128NDEZFWNK2 vs S75NS128NDEZFWNK3

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