Parametric results for: idt7200l12dm under FIFOs

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7201LA12SOG
Integrated Device Technology Inc
$6.3714 Yes Yes Transferred 4.608 kbit 9 512X9 5 V 12 ns 50 MHz 20 ns OTHER FIFO RETRANSMIT 1 512 512 words ASYNCHRONOUS NO PARALLEL 5 mA 80 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDSO-G28 Not Qualified e3 3 70 °C 260 28 PLASTIC/EPOXY SOP SOP28,.5 RECTANGULAR SMALL OUTLINE YES TIN GULL WING 1.27 mm DUAL 3.048 mm 18.3642 mm 8.763 mm INTEGRATED DEVICE TECHNOLOGY INC SOIC GREEN, SOIC-28 28 PEG28 compliant EAR99 8542.32.00.71 1988-01-01
7200L12SOG
Integrated Device Technology Inc
$6.4711 Yes Yes Transferred 2.304 kbit 9 256X9 5 V 12 ns 50 MHz 20 ns OTHER FIFO RETRANSMIT 1 256 256 words ASYNCHRONOUS NO PARALLEL 5 mA 80 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDSO-G28 Not Qualified e3 3 70 °C 260 40 28 PLASTIC/EPOXY SOP SOP28,.5 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 3.048 mm 18.3642 mm 8.763 mm INTEGRATED DEVICE TECHNOLOGY INC SOIC GREEN, SOIC-28 28 PEG28 compliant EAR99 8542.32.00.71 1988-01-01
7202LA12JG
Integrated Device Technology Inc
$6.4728 Yes Yes Transferred 9.216 kbit 9 1KX9 5 V 12 ns 50 MHz 20 ns OTHER FIFO RETRANSMIT 1 1000 1.024 k ASYNCHRONOUS NO PARALLEL 5 mA 80 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e3 3 70 °C 260 30 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC PLCC GREEN, PLASTIC, LCC-32 32 PLG32 compliant EAR99 8542.32.00.71 1988-01-01
72V01L25JGI
Integrated Device Technology Inc
$6.4807 Yes Yes Transferred 4.608 kbit 9 512X9 3.3 V 25 ns 28.5 MHz 35 ns OTHER FIFO 1 512 512 words ASYNCHRONOUS 3-STATE NO PARALLEL 5 mA 60 µA 3.6 V 3 V CMOS INDUSTRIAL R-PQCC-J32 e3 3 85 °C -40 °C 260 30 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 3.556 mm 13.995 mm 11.455 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ PLCC-32 32 compliant EAR99 8542.32.00.71
7200L12TPG
Integrated Device Technology Inc
$6.4986 Yes Yes Transferred 2.304 kbit 9 256X9 5 V 12 ns 50 MHz 20 ns OTHER FIFO RETRANSMIT 1 256 256 words ASYNCHRONOUS NO PARALLEL 5 mA 80 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDIP-T28 Not Qualified e3 70 °C 28 PLASTIC/EPOXY DIP DIP28,.3 RECTANGULAR IN-LINE NO MATTE TIN THROUGH-HOLE 2.54 mm DUAL 4.572 mm 34.671 mm 7.62 mm INTEGRATED DEVICE TECHNOLOGY INC DIP GREEN, PLASTIC, DIP-28 28 compliant EAR99 8542.32.00.71
7202LA12TPG
Integrated Device Technology Inc
$6.5498 Yes Yes Transferred 9.216 kbit 9 1KX9 5 V 12 ns 50 MHz 20 ns OTHER FIFO RETRANSMIT 1 1000 1.024 k ASYNCHRONOUS NO PARALLEL 5 mA 80 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDIP-T28 Not Qualified e3 1 70 °C 260 28 PLASTIC/EPOXY DIP DIP28,.3 RECTANGULAR IN-LINE NO MATTE TIN THROUGH-HOLE 2.54 mm DUAL 4.572 mm 34.671 mm 7.62 mm INTEGRATED DEVICE TECHNOLOGY INC PDIP GREEN, PLASTIC, DIP-28 28 PTG28 compliant EAR99 8542.32.00.71 1988-01-01
7200L15SOGI
Integrated Device Technology Inc
$6.6581 Yes Yes Transferred 2.304 kbit 9 256X9 5 V 15 ns 40 MHz 25 ns OTHER FIFO RETRANSMIT 1 256 256 words ASYNCHRONOUS NO PARALLEL 5 mA 80 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-PDSO-G28 Not Qualified e3 1 85 °C -40 °C 260 30 28 PLASTIC/EPOXY SOP SOP28,.5 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 3.048 mm 18.3642 mm 8.763 mm INTEGRATED DEVICE TECHNOLOGY INC SOIC GREEN, SOIC-28 28 PEG28 compliant EAR99 8542.32.00.71 1988-01-01
7202LA15SOGI8
Integrated Device Technology Inc
$6.6623 Yes Yes Transferred 9.216 kbit 9 1KX9 5 V 15 ns 40 MHz 25 ns OTHER FIFO RETRANSMIT 1 1000 1.024 k ASYNCHRONOUS NO PARALLEL 5 mA 80 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-PDSO-G28 Not Qualified e3 3 85 °C -40 °C 260 28 PLASTIC/EPOXY SOP SOP28,.5 RECTANGULAR SMALL OUTLINE YES TIN GULL WING 1.27 mm DUAL 3.048 mm 18.3642 mm 8.763 mm INTEGRATED DEVICE TECHNOLOGY INC SOIC PLASTIC, SOIC-28 28 PEG28 compliant EAR99 8542.32.00.71 1988-01-01
7202LA12SOG8
Integrated Device Technology Inc
$6.6623 Yes Yes Transferred 9.216 kbit 9 1KX9 5 V 12 ns 50 MHz 20 ns OTHER FIFO RETRANSMIT 1 1000 1.024 k ASYNCHRONOUS NO PARALLEL 5 mA 80 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDSO-G28 Not Qualified e3 3 70 °C 260 28 PLASTIC/EPOXY SOP SOP28,.5 RECTANGULAR SMALL OUTLINE YES TIN GULL WING 1.27 mm DUAL 3.048 mm 18.3642 mm 8.763 mm INTEGRATED DEVICE TECHNOLOGY INC SOIC PLASTIC, SOIC-28 28 PEG28 compliant EAR99 8542.32.00.71 1988-01-01
CY7C425-10JXC
Cypress Semiconductor
$6.7521 Yes Obsolete 9.216 kbit 9 1KX9 5 V 10 ns 50 MHz 20 ns OTHER FIFO RETRANSMIT 1 1000 1.024 k ASYNCHRONOUS NO PARALLEL 5 mA 85 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e3 3 70 °C 260 20 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm CYPRESS SEMICONDUCTOR CORP QFJ LEAD FREE, PLASTIC, LCC-32 32 unknown EAR99 8542.32.00.71