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7201LA12SOG
Integrated Device Technology Inc
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$6.3714 | Yes | Yes | Transferred | 4.608 kbit | 9 | 512X9 | 5 V | 12 ns | 50 MHz | 20 ns | OTHER FIFO | RETRANSMIT | 1 | 512 | 512 words | ASYNCHRONOUS | NO | PARALLEL | 5 mA | 80 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDSO-G28 | Not Qualified | e3 | 3 | 70 °C | 260 | 28 | PLASTIC/EPOXY | SOP | SOP28,.5 | RECTANGULAR | SMALL OUTLINE | YES | TIN | GULL WING | 1.27 mm | DUAL | 3.048 mm | 18.3642 mm | 8.763 mm | INTEGRATED DEVICE TECHNOLOGY INC | SOIC | GREEN, SOIC-28 | 28 | PEG28 | compliant | EAR99 | 8542.32.00.71 | 1988-01-01 | |||||
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7200L12SOG
Integrated Device Technology Inc
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$6.4711 | Yes | Yes | Transferred | 2.304 kbit | 9 | 256X9 | 5 V | 12 ns | 50 MHz | 20 ns | OTHER FIFO | RETRANSMIT | 1 | 256 | 256 words | ASYNCHRONOUS | NO | PARALLEL | 5 mA | 80 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDSO-G28 | Not Qualified | e3 | 3 | 70 °C | 260 | 40 | 28 | PLASTIC/EPOXY | SOP | SOP28,.5 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 3.048 mm | 18.3642 mm | 8.763 mm | INTEGRATED DEVICE TECHNOLOGY INC | SOIC | GREEN, SOIC-28 | 28 | PEG28 | compliant | EAR99 | 8542.32.00.71 | 1988-01-01 | ||||
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7202LA12JG
Integrated Device Technology Inc
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$6.4728 | Yes | Yes | Transferred | 9.216 kbit | 9 | 1KX9 | 5 V | 12 ns | 50 MHz | 20 ns | OTHER FIFO | RETRANSMIT | 1 | 1000 | 1.024 k | ASYNCHRONOUS | NO | PARALLEL | 5 mA | 80 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PQCC-J32 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | J BEND | 1.27 mm | QUAD | 3.55 mm | 13.97 mm | 11.43 mm | INTEGRATED DEVICE TECHNOLOGY INC | PLCC | GREEN, PLASTIC, LCC-32 | 32 | PLG32 | compliant | EAR99 | 8542.32.00.71 | 1988-01-01 | ||||
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72V01L25JGI
Integrated Device Technology Inc
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$6.4807 | Yes | Yes | Transferred | 4.608 kbit | 9 | 512X9 | 3.3 V | 25 ns | 28.5 MHz | 35 ns | OTHER FIFO | 1 | 512 | 512 words | ASYNCHRONOUS | 3-STATE | NO | PARALLEL | 5 mA | 60 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | R-PQCC-J32 | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.995 mm | 11.455 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFJ | PLCC-32 | 32 | compliant | EAR99 | 8542.32.00.71 | ||||||
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7200L12TPG
Integrated Device Technology Inc
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$6.4986 | Yes | Yes | Transferred | 2.304 kbit | 9 | 256X9 | 5 V | 12 ns | 50 MHz | 20 ns | OTHER FIFO | RETRANSMIT | 1 | 256 | 256 words | ASYNCHRONOUS | NO | PARALLEL | 5 mA | 80 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDIP-T28 | Not Qualified | e3 | 70 °C | 28 | PLASTIC/EPOXY | DIP | DIP28,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 4.572 mm | 34.671 mm | 7.62 mm | INTEGRATED DEVICE TECHNOLOGY INC | DIP | GREEN, PLASTIC, DIP-28 | 28 | compliant | EAR99 | 8542.32.00.71 | |||||||||
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7202LA12TPG
Integrated Device Technology Inc
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$6.5498 | Yes | Yes | Transferred | 9.216 kbit | 9 | 1KX9 | 5 V | 12 ns | 50 MHz | 20 ns | OTHER FIFO | RETRANSMIT | 1 | 1000 | 1.024 k | ASYNCHRONOUS | NO | PARALLEL | 5 mA | 80 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDIP-T28 | Not Qualified | e3 | 1 | 70 °C | 260 | 28 | PLASTIC/EPOXY | DIP | DIP28,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 4.572 mm | 34.671 mm | 7.62 mm | INTEGRATED DEVICE TECHNOLOGY INC | PDIP | GREEN, PLASTIC, DIP-28 | 28 | PTG28 | compliant | EAR99 | 8542.32.00.71 | 1988-01-01 | |||||
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7200L15SOGI
Integrated Device Technology Inc
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$6.6581 | Yes | Yes | Transferred | 2.304 kbit | 9 | 256X9 | 5 V | 15 ns | 40 MHz | 25 ns | OTHER FIFO | RETRANSMIT | 1 | 256 | 256 words | ASYNCHRONOUS | NO | PARALLEL | 5 mA | 80 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PDSO-G28 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 28 | PLASTIC/EPOXY | SOP | SOP28,.5 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 3.048 mm | 18.3642 mm | 8.763 mm | INTEGRATED DEVICE TECHNOLOGY INC | SOIC | GREEN, SOIC-28 | 28 | PEG28 | compliant | EAR99 | 8542.32.00.71 | 1988-01-01 | |||
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7202LA15SOGI8
Integrated Device Technology Inc
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$6.6623 | Yes | Yes | Transferred | 9.216 kbit | 9 | 1KX9 | 5 V | 15 ns | 40 MHz | 25 ns | OTHER FIFO | RETRANSMIT | 1 | 1000 | 1.024 k | ASYNCHRONOUS | NO | PARALLEL | 5 mA | 80 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PDSO-G28 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 28 | PLASTIC/EPOXY | SOP | SOP28,.5 | RECTANGULAR | SMALL OUTLINE | YES | TIN | GULL WING | 1.27 mm | DUAL | 3.048 mm | 18.3642 mm | 8.763 mm | INTEGRATED DEVICE TECHNOLOGY INC | SOIC | PLASTIC, SOIC-28 | 28 | PEG28 | compliant | EAR99 | 8542.32.00.71 | 1988-01-01 | ||||
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7202LA12SOG8
Integrated Device Technology Inc
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$6.6623 | Yes | Yes | Transferred | 9.216 kbit | 9 | 1KX9 | 5 V | 12 ns | 50 MHz | 20 ns | OTHER FIFO | RETRANSMIT | 1 | 1000 | 1.024 k | ASYNCHRONOUS | NO | PARALLEL | 5 mA | 80 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDSO-G28 | Not Qualified | e3 | 3 | 70 °C | 260 | 28 | PLASTIC/EPOXY | SOP | SOP28,.5 | RECTANGULAR | SMALL OUTLINE | YES | TIN | GULL WING | 1.27 mm | DUAL | 3.048 mm | 18.3642 mm | 8.763 mm | INTEGRATED DEVICE TECHNOLOGY INC | SOIC | PLASTIC, SOIC-28 | 28 | PEG28 | compliant | EAR99 | 8542.32.00.71 | 1988-01-01 | |||||
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CY7C425-10JXC
Cypress Semiconductor
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$6.7521 | Yes | Obsolete | 9.216 kbit | 9 | 1KX9 | 5 V | 10 ns | 50 MHz | 20 ns | OTHER FIFO | RETRANSMIT | 1 | 1000 | 1.024 k | ASYNCHRONOUS | NO | PARALLEL | 5 mA | 85 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PQCC-J32 | Not Qualified | e3 | 3 | 70 °C | 260 | 20 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Matte Tin (Sn) | J BEND | 1.27 mm | QUAD | 3.55 mm | 13.97 mm | 11.43 mm | CYPRESS SEMICONDUCTOR CORP | QFJ | LEAD FREE, PLASTIC, LCC-32 | 32 | unknown | EAR99 | 8542.32.00.71 |