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Select Parts | Part Number |
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24AA025E48T-I/SN
Microchip Technology Inc
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BR24G01FVT-3GE2
ROHM Semiconductor
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BR24G04F-3GTE2
ROHM Semiconductor
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M24C02-RDW6TP
STMicroelectronics
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M24C16-WMN6P
STMicroelectronics
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M24C04-RDW6TP
STMicroelectronics
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M93C56-RDW6TP
STMicroelectronics
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BR24G02FVM-3GTTR
ROHM Semiconductor
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BR24G02FVT-3GE2
ROHM Semiconductor
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BR24G02FV-3GTE2
ROHM Semiconductor
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Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Composite Price
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Pbfree Code
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Rohs Code
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Part Life Cycle Code
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Memory Density
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Memory Width | Organization |
Supply Voltage-Nom (Vsup)
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Clock Frequency-Max (fCLK) |
Memory IC Type
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Additional Feature
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Alternate Memory Width
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Data Retention Time-Min
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Endurance
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I2C Control Byte
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Number of Functions | Number of Ports | Number of Words Code | Number of Words |
Operating Mode
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Output Characteristics
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Parallel/Serial
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Programming Voltage
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Serial Bus Type
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Standby Current-Max
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Supply Current-Max
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Supply Voltage-Max (Vsup)
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Supply Voltage-Min (Vsup)
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Technology |
Temperature Grade
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Write Cycle Time-Max (tWC)
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Write Protection
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JESD-30 Code
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Qualification Status
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JESD-609 Code
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Moisture Sensitivity Level
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Operating Temperature-Max
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Operating Temperature-Min
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Peak Reflow Temperature (Cel)
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Screening Level
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Time@Peak Reflow Temperature-Max (s)
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Number of Terminals
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Package Body Material
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Package Code
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Package Equivalence Code
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Package Shape
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Package Style
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Surface Mount
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Terminal Finish
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Terminal Form
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Terminal Pitch
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Terminal Position
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Seated Height-Max
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Length
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Width
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Ihs Manufacturer
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Reach Compliance Code
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ECCN Code
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HTS Code
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Samacsys Manufacturer
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Package Description
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Part Package Code
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Pin Count
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Yes | Yes | Active | 2.048 kbit | 8 | 256X8 | 5 V | 400 kHz | EEPROM | 1.7V TO 2.5V @ 0.1MHz | 200 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 1 | 256 | 256 words | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 5 V | I2C | 1 µA | 3 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | TS 16949 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8542.32.00.51 | Microchip | ||||||
Yes | Active | 1.024 kbit | 8 | 128X8 | 2.5 V | 400 kHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 128 | 128 words | SYNCHRONOUS | SERIAL | I2C | 2 µA | 2 µA | 5.5 V | 1.6 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | ROHM CO LTD | compliant | EAR99 | 8542.32.00.51 | ROHM Semiconductor | TSSOP-8 | |||||||||||||
Yes | Active | 4.096 kbit | 8 | 512X8 | 2.5 V | 400 kHz | EEPROM | 1 | 512 | 512 words | SYNCHRONOUS | SERIAL | I2C | 5.5 V | 1.6 V | CMOS | INDUSTRIAL | 5 ms | R-PDSO-G8 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 1.71 mm | 5 mm | 4.4 mm | ROHM CO LTD | compliant | EAR99 | 8542.32.00.51 | ROHM Semiconductor | SOP-8 | |||||||||||||||||||||
Yes | Active | 2.048 kbit | 8 | 256X8 | 2.5 V | 400 kHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 256 | 256 words | SYNCHRONOUS | SERIAL | I2C | 1 µA | 800 nA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | STMICROELECTRONICS | compliant | EAR99 | 8542.32.00.51 | STMicroelectronics | 0.169 INCH, HALOGEN FREE AND ROHS COMPLIANT, TSSOP-8 | SOIC | 8 | ||||||||
Yes | Not Recommended | 16.384 kbit | 8 | 2KX8 | 400 kHz | EEPROM | 200 | 4000000 Write/Erase Cycles | 1010DDDR | 1 | 2000 | 2.048 k | SYNCHRONOUS | OPEN-DRAIN | SERIAL | I2C | 2 µA | 1 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | STMICROELECTRONICS | not_compliant | EAR99 | 8542.32.00.51 | STMicroelectronics | SOIC | 8 | ||||||||||
Yes | Active | 4.096 kbit | 8 | 512X8 | 2.5 V | 400 kHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DDMR | 1 | 512 | 512 words | SYNCHRONOUS | SERIAL | I2C | 1 µA | 800 nA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | STMICROELECTRONICS | compliant | EAR99 | 8542.32.00.51 | STMicroelectronics | 0.169 INCH, HALOGEN FREE AND ROHS COMPLIANT, TSSOP-8 | SOIC | 8 | ||||||||
Yes | Active | 2.048 kbit | 16 | 128X16 | 5 V | 1 MHz | EEPROM | 8 | 40 | 1000000 Write/Erase Cycles | 1 | 128 | 128 words | SYNCHRONOUS | SERIAL | MICROWIRE | 2 µA | 2 µA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | 10 ms | SOFTWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | STMICROELECTRONICS | compliant | EAR99 | 8542.32.00.51 | STMicroelectronics | 0.169 INCH, HALOGEN FREE AND ROHS COMPLIANT, TSSOP-8 | SOIC | 8 | ||||||||
Yes | Active | 2.048 kbit | 8 | 256X8 | 2.5 V | 400 kHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 256 | 256 words | SYNCHRONOUS | 3-STATE | SERIAL | 2.5 V | I2C | 2 µA | 2 µA | 5.5 V | 1.6 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | VSSOP | TSSOP8,.16 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 900 µm | 2.9 mm | 2.8 mm | ROHM CO LTD | compliant | EAR99 | 8542.32.00.51 | ROHM Semiconductor | MSOP-8 | ||||||||||||
Yes | Active | 2.048 kbit | 8 | 256X8 | 2.5 V | 400 kHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 256 | 256 words | SYNCHRONOUS | 3-STATE | SERIAL | 2.5 V | I2C | 2 µA | 2 µA | 5.5 V | 1.6 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | ROHM CO LTD | compliant | EAR99 | 8542.32.00.51 | ROHM Semiconductor | TSSOP-8 | ||||||||||||
Yes | Not Recommended | 2.048 kbit | 8 | 256X8 | 2.5 V | 400 kHz | EEPROM | SEATED HT-CALCULATED | 40 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 256 | 256 words | SYNCHRONOUS | 3-STATE | SERIAL | 2.5 V | I2C | 2 µA | 2 µA | 5.5 V | 1.6 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | LSSOP | SSOP8,.25 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 1.35 mm | 4.4 mm | 3 mm | ROHM CO LTD | compliant | EAR99 | 8542.32.00.51 | ROHM Semiconductor | SSOP-8 |
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24AA025E48T-I/SN
Microchip Technology Inc
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$0.1315 Buy | Yes | Yes | Active | 2.048 kbit | 8 | 256X8 | 5 V | 400 kHz | EEPROM | 1.7V TO 2.5V @ 0.1MHz | 200 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 1 | 256 | 256 words | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 5 V | I2C | 1 µA | 3 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | TS 16949 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8542.32.00.51 | Microchip | |||||||
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BR24G01FVT-3GE2
ROHM Semiconductor
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$0.1332 Buy | Yes | Active | 1.024 kbit | 8 | 128X8 | 2.5 V | 400 kHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 128 | 128 words | SYNCHRONOUS | SERIAL | I2C | 2 µA | 2 µA | 5.5 V | 1.6 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | ROHM CO LTD | compliant | EAR99 | 8542.32.00.51 | ROHM Semiconductor | TSSOP-8 | ||||||||||||||
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BR24G04F-3GTE2
ROHM Semiconductor
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$0.1341 Buy | Yes | Active | 4.096 kbit | 8 | 512X8 | 2.5 V | 400 kHz | EEPROM | 1 | 512 | 512 words | SYNCHRONOUS | SERIAL | I2C | 5.5 V | 1.6 V | CMOS | INDUSTRIAL | 5 ms | R-PDSO-G8 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 1.71 mm | 5 mm | 4.4 mm | ROHM CO LTD | compliant | EAR99 | 8542.32.00.51 | ROHM Semiconductor | SOP-8 | ||||||||||||||||||||||
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M24C02-RDW6TP
STMicroelectronics
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$0.1348 Buy | Yes | Active | 2.048 kbit | 8 | 256X8 | 2.5 V | 400 kHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 256 | 256 words | SYNCHRONOUS | SERIAL | I2C | 1 µA | 800 nA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | STMICROELECTRONICS | compliant | EAR99 | 8542.32.00.51 | STMicroelectronics | 0.169 INCH, HALOGEN FREE AND ROHS COMPLIANT, TSSOP-8 | SOIC | 8 | |||||||||
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M24C16-WMN6P
STMicroelectronics
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$0.1406 Buy | Yes | Not Recommended | 16.384 kbit | 8 | 2KX8 | 400 kHz | EEPROM | 200 | 4000000 Write/Erase Cycles | 1010DDDR | 1 | 2000 | 2.048 k | SYNCHRONOUS | OPEN-DRAIN | SERIAL | I2C | 2 µA | 1 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | STMICROELECTRONICS | not_compliant | EAR99 | 8542.32.00.51 | STMicroelectronics | SOIC | 8 | |||||||||||
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M24C04-RDW6TP
STMicroelectronics
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$0.1417 Buy | Yes | Active | 4.096 kbit | 8 | 512X8 | 2.5 V | 400 kHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DDMR | 1 | 512 | 512 words | SYNCHRONOUS | SERIAL | I2C | 1 µA | 800 nA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | STMICROELECTRONICS | compliant | EAR99 | 8542.32.00.51 | STMicroelectronics | 0.169 INCH, HALOGEN FREE AND ROHS COMPLIANT, TSSOP-8 | SOIC | 8 | |||||||||
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M93C56-RDW6TP
STMicroelectronics
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$0.1433 Buy | Yes | Active | 2.048 kbit | 16 | 128X16 | 5 V | 1 MHz | EEPROM | 8 | 40 | 1000000 Write/Erase Cycles | 1 | 128 | 128 words | SYNCHRONOUS | SERIAL | MICROWIRE | 2 µA | 2 µA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | 10 ms | SOFTWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | STMICROELECTRONICS | compliant | EAR99 | 8542.32.00.51 | STMicroelectronics | 0.169 INCH, HALOGEN FREE AND ROHS COMPLIANT, TSSOP-8 | SOIC | 8 | |||||||||
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BR24G02FVM-3GTTR
ROHM Semiconductor
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$0.1441 Buy | Yes | Active | 2.048 kbit | 8 | 256X8 | 2.5 V | 400 kHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 256 | 256 words | SYNCHRONOUS | 3-STATE | SERIAL | 2.5 V | I2C | 2 µA | 2 µA | 5.5 V | 1.6 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | VSSOP | TSSOP8,.16 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 900 µm | 2.9 mm | 2.8 mm | ROHM CO LTD | compliant | EAR99 | 8542.32.00.51 | ROHM Semiconductor | MSOP-8 | |||||||||||||
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BR24G02FVT-3GE2
ROHM Semiconductor
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$0.1441 Buy | Yes | Active | 2.048 kbit | 8 | 256X8 | 2.5 V | 400 kHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 256 | 256 words | SYNCHRONOUS | 3-STATE | SERIAL | 2.5 V | I2C | 2 µA | 2 µA | 5.5 V | 1.6 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | ROHM CO LTD | compliant | EAR99 | 8542.32.00.51 | ROHM Semiconductor | TSSOP-8 | |||||||||||||
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BR24G02FV-3GTE2
ROHM Semiconductor
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$0.1441 Buy | Yes | Not Recommended | 2.048 kbit | 8 | 256X8 | 2.5 V | 400 kHz | EEPROM | SEATED HT-CALCULATED | 40 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 256 | 256 words | SYNCHRONOUS | 3-STATE | SERIAL | 2.5 V | I2C | 2 µA | 2 µA | 5.5 V | 1.6 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | LSSOP | SSOP8,.25 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 1.35 mm | 4.4 mm | 3 mm | ROHM CO LTD | compliant | EAR99 | 8542.32.00.51 | ROHM Semiconductor | SSOP-8 |