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M24C16-FMN6TP
STMicroelectronics
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$0.1736 | Yes | Active | 16.384 kbit | 8 | 2KX8 | 1.8 V | 400 kHz | EEPROM | 200 | 4000000 Write/Erase Cycles | 1010DDDR | 1 | 2000 | 2.048 k | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 1.8 V | I2C | 1 µA | 1 µA | 5.5 V | 1.7 V | CMOS | INDUSTRIAL | 5 ms | R-PDSO-G8 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | STMICROELECTRONICS | compliant | EAR99 | 8542.32.00.51 | STMicroelectronics | |||||||||||||
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M93C66-WMN6P
STMicroelectronics
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$0.1749 | Yes | Active | 4.096 kbit | 16 | 256X16 | 5 V | 2 MHz | EEPROM | 8 | 40 | 1000000 Write/Erase Cycles | 1 | 256 | 256 words | SYNCHRONOUS | SERIAL | MICROWIRE | 5 µA | 2 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | SOFTWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | NICKEL PALLADIUM GOLD | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | STMICROELECTRONICS | compliant | EAR99 | 8542.32.00.51 | STMicroelectronics | SOIC | 0.150 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SOP-8 | 8 | ||||||||
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BR24G08FVT-3GE2
ROHM Semiconductor
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$0.1751 | Yes | Active | 8.192 kbit | 1 | 8KX1 | 2.5 V | 400 kHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DMMR | 1 | 8000 | 8.192 k | SYNCHRONOUS | 3-STATE | SERIAL | 2.5 V | I2C | 2 µA | 2 µA | 5.5 V | 1.6 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | ROHM CO LTD | compliant | EAR99 | 8542.32.00.51 | ROHM Semiconductor | TSSOP-8 | |||||||||||
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BR24G08FVM-3GTTR
ROHM Semiconductor
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$0.1751 | Yes | Active | 8.192 kbit | 1 | 8KX1 | 2.5 V | 400 kHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DMMR | 1 | 8000 | 8.192 k | SYNCHRONOUS | 3-STATE | SERIAL | 2.5 V | I2C | 2 µA | 2 µA | 5.5 V | 1.6 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | VSSOP | TSSOP8,.16 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 900 µm | 2.9 mm | 2.8 mm | ROHM CO LTD | compliant | EAR99 | 8542.32.00.51 | ROHM Semiconductor | MSOP-8 | ||||||||||||
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24FC01-I/MS
Microchip Technology Inc
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$0.1763 | Yes | Active | 1.024 kbit | 8 | 128X8 | 5 V | 1 MHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010XXXR | 1 | 1 | 128 | 128 words | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 5 V | I2C | 3 µA | 3 µA | 5.5 V | 1.7 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | S-PDSO-G8 | 85 °C | -40 °C | AEC-Q100 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 1.1 mm | 3 mm | 3 mm | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8542.32.00.51 | Microchip | MSOP-8 | ||||||||||||
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M24256E-FMN6TP
STMicroelectronics
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$0.1768 | Yes | Active | 262.144 kbit | 8 | 32KX8 | 2.5 V | 1 MHz | EEPROM | 200 | 4000000 Write/Erase Cycles | 1010DDDR | 1 | 32000 | 32.768 k | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 2.5 V | I2C | 1 µA | 1 µA | 5.5 V | 1.6 V | CMOS | 5 ms | HARDWARE | R-PDSO-G8 | e4 | 1 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | STMICROELECTRONICS | compliant | STMicroelectronics | |||||||||||||
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24LC02BH-I/SN
Microchip Technology Inc
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$0.1782 | Yes | Active | 2.048 kbit | 8 | 256X8 | 4.5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010XXXR | 1 | 1 | 256 | 256 words | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 4.5 V | I2C | 1 µA | 3 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | YES | Matte Tin (Sn) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8542.32.00.51 | Microchip | SOIC | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | 8 | |||||
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M24C02-FMH6TG
STMicroelectronics
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$0.1789 | Yes | Active | 2.048 kbit | 8 | 256X8 | 1.8 V | 400 kHz | EEPROM | 200 | 4000000 Write/Erase Cycles | 1010000R | 1 | 256 | 256 words | SYNCHRONOUS | OPEN-DRAIN | SERIAL | I2C | 1 µA | 800 nA | 5.5 V | 1.7 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-N5 | 1 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 5 | PLASTIC/EPOXY | VSON | SOLCC5,.06,16 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | YES | NO LEAD | 400 µm | DUAL | 600 µm | 1.7 mm | 1.4 mm | STMICROELECTRONICS | compliant | EAR99 | 8542.32.00.51 | STMicroelectronics | UFDFPN-5 | ||||||||||||
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24FC04-I/ST
Microchip Technology Inc
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$0.1796 | Yes | Active | 4.096 kbit | 8 | 512X8 | 2.5 V | 1 MHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010XXMR | 1 | 1 | 512 | 512 words | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 2.5 V | I2C | 1 µA | 3 µA | 5.5 V | 1.7 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | e3 | 85 °C | -40 °C | AEC-Q100 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8542.32.00.51 | Microchip | TSSOP-8 | ||||||||||
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BR24G02NUX-3ATTR
ROHM Semiconductor
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$0.1799 | Yes | Active | 2.048 kbit | 8 | 256X8 | 400 kHz | EEPROM | 1.7V AT 1MHZ | 1 | 256 | 256 words | SYNCHRONOUS | SERIAL | I2C | 5.5 V | 1.6 V | CMOS | INDUSTRIAL | 5 ms | R-PDSO-N8 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 500 µm | DUAL | 600 µm | 3 mm | 2 mm | ROHM CO LTD | compliant | EAR99 | 8542.32.00.51 | ROHM Semiconductor | 2 X 3 MM, 0.60 MM HEIGHT, HALOGEN FREE, VSON-8 |