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IS42S16800F-6BL
Integrated Silicon Solution Inc
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$1.8857 | Yes | Obsolete | 134.2177 Mbit | 16 | 8MX16 | 3.3 V | 5.4 ns | 166 MHz | 4096 | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | AUTO/SELF REFRESH | COMMON | 1,2,4,8 | 1 | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | 3-STATE | YES | 1,2,4,8,FP | 2 mA | 120 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | S-PBGA-B54 | Not Qualified | 70 °C | 54 | PLASTIC/EPOXY | TFBGA | BGA54,9X9,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 8 mm | INTEGRATED SILICON SOLUTION INC | BGA | TFBGA, BGA54,9X9,32 | 54 | compliant | EAR99 | 8542.32.00.02 | Integrated Silicon Solution Inc. | ||||||||||||
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IS45S16100H-7TLA1
Integrated Silicon Solution Inc
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$1.9178 | Yes | Active | 16.7772 Mbit | 16 | 1MX16 | 3.3 V | 5.5 ns | 143 MHz | 2048 | DUAL BANK PAGE BURST | SYNCHRONOUS DRAM | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH | COMMON | 1,2,4,8 | 1 | 1 | 1000000 | 1.0486 M | SYNCHRONOUS | 3-STATE | YES | 1,2,4,8,FP | 3.5 mA | 70 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | R-PDSO-G50 | Not Qualified | 85 °C | -40 °C | AEC-Q100 | 50 | PLASTIC/EPOXY | TSOP2 | TSOP50,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 800 µm | DUAL | 1.2 mm | 20.95 mm | 10.16 mm | INTEGRATED SILICON SOLUTION INC | TSOP2, TSOP50,.46,32 | compliant | EAR99 | 8542.32.00.02 | Integrated Silicon Solution Inc. | ||||||||||||
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IS42S32200L-7TL
Integrated Silicon Solution Inc
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$1.9276 | Yes | Obsolete | 67.1089 Mbit | 32 | 2MX32 | 3.3 V | 5.4 ns | 143 MHz | 4096 | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | AUTO/SELF REFRESH | COMMON | 1,2,4,8 | 1 | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | 3-STATE | YES | 1,2,4,8,FP | 2 mA | 90 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G86 | Not Qualified | 70 °C | 86 | PLASTIC/EPOXY | TSOP2 | TSSOP86,.46,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 500 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | INTEGRATED SILICON SOLUTION INC | TSOP2 | TSOP2, TSSOP86,.46,20 | 86 | compliant | EAR99 | 8542.32.00.02 | Integrated Silicon Solution Inc. | ||||||||||||
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IS43DR16160B-3DBL
Integrated Silicon Solution Inc
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$1.9424 | Yes | Active | 268.4355 Mbit | 16 | 16MX16 | 1.8 V | 450 ps | 333 MHz | 8192 | FOUR BANK PAGE BURST | DDR2 DRAM | AUTO/SELF REFRESH | COMMON | 4,8 | 1 | 1 | 16000000 | 16.7772 M | SYNCHRONOUS | 3-STATE | YES | 4,8 | 25 mA | 280 µA | 1.9 V | 1.7 V | CMOS | OTHER | R-PBGA-B84 | Not Qualified | e1 | 3 | 85 °C | 84 | PLASTIC/EPOXY | TFBGA | BGA84,9X15,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.2 mm | 12.5 mm | 8 mm | INTEGRATED SILICON SOLUTION INC | TFBGA, BGA84,9X15,32 | compliant | EAR99 | 8542.32.00.24 | ||||||||||||
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IS42S16400J-7TLI
Integrated Silicon Solution Inc
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$1.9871 | Yes | Obsolete | 67.1089 Mbit | 16 | 4MX16 | 3.3 V | 5.4 ns | 143 MHz | 4096 | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | AUTO/SELF REFRESH | COMMON | 1,2,4,8 | 1 | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | 3-STATE | NO | YES | 1,2,4,8,FP | 70 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | R-PDSO-G54 | Not Qualified | e3 | 85 °C | -40 °C | 260 | 30 | 54 | PLASTIC/EPOXY | TSOP2 | TSOP54,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | MATTE TIN | GULL WING | 800 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | INTEGRATED SILICON SOLUTION INC | TSOP2 | TSOP2, TSOP54,.46,32 | 54 | compliant | EAR99 | 8542.32.00.02 | Integrated Silicon Solution Inc. | |||||||
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AS4C8M16SA-7TCN
Alliance Memory Inc
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$2.0071 | Yes | Active | 134.2177 Mbit | 16 | 8MX16 | 3.3 V | 5.4 ns | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | AUTO/SELF REFRESH | 1 | 1 | 8000000 | 8.3886 M | SYNCHRONOUS | YES | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G54 | e3 | 3 | 70 °C | 54 | PLASTIC/EPOXY | TSOP2 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | TIN | GULL WING | 800 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | ALLIANCE MEMORY INC | 0.400 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, TSOP2-54 | compliant | EAR99 | 8542.32.00.02 | Alliance Memory | |||||||||||||||||||||
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AS4C2M32SA-7TCN
Alliance Memory Inc
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$2.0782 | Yes | Yes | Active | 67.1089 Mbit | 32 | 2MX32 | 3.3 V | 5.4 ns | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | AUTO/SELF REFRESH | 1 | 1 | 2000000 | 2.0972 M | SYNCHRONOUS | YES | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G86 | 3 | 70 °C | 86 | PLASTIC/EPOXY | TSOP2 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | GULL WING | 500 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | ALLIANCE MEMORY INC | TSOPII-86 | compliant | EAR99 | 8542.32.00.02 | Alliance Memory | ||||||||||||||||||||||
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AS4C4M16SA-7TCNTR
Alliance Memory Inc
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$2.0785 | Yes | Active | 67.1089 Mbit | 16 | 4MX16 | 3.3 V | 5.4 ns | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | AUTO/SELF REFRESH | 1 | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | YES | 3.6 V | 3 V | CMOS | COMMERCIAL | R-PDSO-G54 | e3 | 3 | 70 °C | 54 | PLASTIC/EPOXY | TSOP2 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | YES | Tin (Sn) | GULL WING | 800 µm | DUAL | 1.2 mm | 22.22 mm | 10.16 mm | ALLIANCE MEMORY INC | TSOP2-54 | compliant | EAR99 | 8542.32.00.02 | Alliance Memory | 2018-10-04 | ||||||||||||||||||||
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IS42S16400J-7BL
Integrated Silicon Solution Inc
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$2.1019 | Yes | Obsolete | 67.1089 Mbit | 16 | 4MX16 | 3.3 V | 5.4 ns | 143 MHz | 4096 | FOUR BANK PAGE BURST | SYNCHRONOUS DRAM | AUTO/SELF REFRESH | COMMON | 1,2,4,8 | 1 | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | 3-STATE | NO | YES | 1,2,4,8,FP | 70 µA | 3.6 V | 3 V | CMOS | COMMERCIAL | S-PBGA-B54 | Not Qualified | 70 °C | 54 | PLASTIC/EPOXY | TFBGA | BGA54,9X9,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 8 mm | INTEGRATED SILICON SOLUTION INC | BGA | TFBGA, BGA54,9X9,32 | 54 | compliant | EAR99 | 8542.32.00.02 | Integrated Silicon Solution Inc. | ||||||||||||
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MT41J128M16JT-125:K
Micron Technology Inc
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$2.1052 | Yes | Yes | Active | 2.1475 Gbit | 16 | 128MX16 | 1.5 V | 225 ps | 800 MHz | 8192 | MULTI BANK PAGE BURST | DDR3 DRAM | AUTO/SELF REFRESH | COMMON | 8 | 1 | 1 | 128000000 | 134.2177 M | SYNCHRONOUS | 3-STATE | YES | 8 | 12 mA | 202 µA | 1.575 V | 1.425 V | CMOS | OTHER | R-PBGA-B96 | Not Qualified | e1 | 3 | 85 °C | 260 | 30 | 96 | PLASTIC/EPOXY | TFBGA | BGA96,9X16,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.2 mm | 14 mm | 8 mm | MICRON TECHNOLOGY INC | BGA | TFBGA, BGA96,9X16,32 | 96 | compliant | EAR99 | 8542.32.00.36 | Micron |