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LTC2634IUD-LMI8#PBF
Linear Technology
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$2.7642 | Yes | Transferred | 0.19 % | 8 | YES | D/A CONVERTER | BINARY | 4 | 900 µA | CMOS | INDUSTRIAL | S-PQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | QCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER | MATTE TIN | NO LEAD | 500 µm | QUAD | LINEAR TECHNOLOGY CORP | QFN | 16 | UD | compliant | ||||
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LTC2634IUD-HZ8#PBF
Linear Technology
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$2.7642 | Yes | Transferred | 5 V | 0.19 % | 8 | YES | D/A CONVERTER | BINARY | 4 | 900 µA | CMOS | INDUSTRIAL | S-PQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | QCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER | MATTE TIN | NO LEAD | 500 µm | QUAD | LINEAR TECHNOLOGY CORP | QFN | 16 | UD | compliant | |||
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LTC2634IUD-LZ8#PBF
Linear Technology
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$2.7642 | Yes | Transferred | 0.19 % | 8 | YES | D/A CONVERTER | BINARY | 4 | 900 µA | CMOS | INDUSTRIAL | S-PQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | QCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER | MATTE TIN | NO LEAD | 500 µm | QUAD | LINEAR TECHNOLOGY CORP | QFN | 16 | UD | compliant | ||||
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LTC2634IMSE-LMX8#PBF
Linear Technology
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$2.7642 | Yes | Transferred | 0.19 % | 8 | YES | D/A CONVERTER | BINARY | 4 | 900 µA | CMOS | INDUSTRIAL | R-PDSO-G10 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 500 µm | DUAL | LINEAR TECHNOLOGY CORP | MSOP | 10 | MSE | compliant | ||||
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LTC2634IMSE-LZ8#PBF
Linear Technology
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$2.7642 | Yes | Transferred | 0.19 % | 8 | YES | D/A CONVERTER | BINARY | 4 | 900 µA | CMOS | INDUSTRIAL | R-PDSO-G10 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 500 µm | DUAL | LINEAR TECHNOLOGY CORP | MSOP | 10 | MSE | compliant | ||||
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LTC2634IMSE-HMX8#PBF
Linear Technology
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$2.7642 | Yes | Transferred | 5 V | 0.19 % | 8 | YES | D/A CONVERTER | BINARY | 4 | 900 µA | CMOS | INDUSTRIAL | R-PDSO-G10 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 500 µm | DUAL | LINEAR TECHNOLOGY CORP | MSOP | 10 | MSE | compliant | |||
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LTC2634IMSE-HMI8#PBF
Linear Technology
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$2.7642 | Yes | Transferred | 5 V | 0.19 % | 8 | YES | D/A CONVERTER | BINARY | 4 | 900 µA | CMOS | INDUSTRIAL | R-PDSO-G10 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 500 µm | DUAL | LINEAR TECHNOLOGY CORP | MSOP | 10 | MSE | compliant | |||
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DAC104S085CISD/NOPB
National Semiconductor Corporation
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$2.8863 | Yes | Transferred | 0.19 % | 10 | YES | D/A CONVERTER | BINARY | 4 | 6 µs | 650 µA | CMOS | INDUSTRIAL | R-PDSO-N10 | Not Qualified | e3 | 1 | 105 °C | -40 °C | 260 | 40 | 10 | PLASTIC/EPOXY | SON | SOLCC10,.11,20 | RECTANGULAR | SMALL OUTLINE | MATTE TIN | NO LEAD | 500 µm | DUAL | NATIONAL SEMICONDUCTOR CORP | unknown | ||||||
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DAC104S085CIMM/NOPB
National Semiconductor Corporation
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$2.8863 | Yes | Transferred | 0.19 % | 10 | YES | D/A CONVERTER | BINARY | 4 | 6 µs | 650 µA | CMOS | INDUSTRIAL | R-PDSO-G10 | Not Qualified | e3 | 1 | 105 °C | -40 °C | 260 | 40 | 10 | PLASTIC/EPOXY | TSSOP | TSSOP10,.19,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 500 µm | DUAL | NATIONAL SEMICONDUCTOR CORP | compliant | ||||||
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LTC2634CUD-HMI10#PBF
Linear Technology
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$3.0074 | Yes | Transferred | 5 V | 0.097 % | 10 | YES | D/A CONVERTER | BINARY | 4 | 900 µA | CMOS | COMMERCIAL | S-PQCC-N16 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 16 | PLASTIC/EPOXY | QCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER | MATTE TIN | NO LEAD | 500 µm | QUAD | LINEAR TECHNOLOGY CORP | QFN | 16 | UD | compliant |