Part Details for XQVR1000-4CG560M by AMD Xilinx
Overview of XQVR1000-4CG560M by AMD Xilinx
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (3 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (9 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Part Details for XQVR1000-4CG560M
XQVR1000-4CG560M CAD Models
XQVR1000-4CG560M Part Data Attributes:
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XQVR1000-4CG560M
AMD Xilinx
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Datasheet
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XQVR1000-4CG560M
AMD Xilinx
Field Programmable Gate Array, 6144 CLBs, 1124022 Gates, 27648-Cell, CMOS, CBGA560, HEAT SINK, CERAMIC, CGA-560
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | CGA | |
| Package Description | HEAT SINK, CERAMIC, CGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | S-CBGA-X560 | |
| Length | 42.5 mm | |
| Number of CLBs | 6144 | |
| Number of Equivalent Gates | 1124022 | |
| Number of Inputs | 404 | |
| Number of Logic Cells | 27648 | |
| Number of Outputs | 404 | |
| Number of Terminals | 560 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 6144 CLBS, 1124022 GATES | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | HCGA | |
| Package Equivalence Code | CGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 4.9 mm | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| Supply Voltage-Nom | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | UNSPECIFIED | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Total Dose | 100k Rad(Si) V | |
| Width | 42.5 mm |
Alternate Parts for XQVR1000-4CG560M
This table gives cross-reference parts and alternative options found for XQVR1000-4CG560M. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XQVR1000-4CG560M, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| XQVR1000-4CGG560V | Field Programmable Gate Array, 6144 CLBs, 1124022 Gates, CMOS, CBGA560, HEAT SINK, CERAMIC, CGA-560 | AMD Xilinx | XQVR1000-4CG560M vs XQVR1000-4CGG560V |
| XQVR1000-4CG560V | Field Programmable Gate Array, 6144 CLBs, 1124022 Gates, 27648-Cell, CMOS, CBGA560, HEAT SINK, CERAMIC, CGA-560 | AMD Xilinx | XQVR1000-4CG560M vs XQVR1000-4CG560V |
| XQVR1000-4CGG560M | Field Programmable Gate Array, 6144 CLBs, 1124022 Gates, CMOS, CBGA560, HEAT SINK, CERAMIC, CGA-560 | AMD Xilinx | XQVR1000-4CG560M vs XQVR1000-4CGG560M |