Datasheets
XPC850DECZT50B by:

IC,MICROPROCESSOR,32-BIT,CMOS,BGA,256PIN,PLASTIC

Part Details for XPC850DECZT50B by Freescale Semiconductor

Overview of XPC850DECZT50B by Freescale Semiconductor

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Part Details for XPC850DECZT50B

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XPC850DECZT50B Part Data Attributes

XPC850DECZT50B Freescale Semiconductor
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XPC850DECZT50B Freescale Semiconductor IC,MICROPROCESSOR,32-BIT,CMOS,BGA,256PIN,PLASTIC
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description BGA, BGA256,16X16,50
Reach Compliance Code unknown
Bit Size 32
JESD-30 Code S-PBGA-B256
JESD-609 Code e0
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,50
Package Shape SQUARE
Package Style GRID ARRAY
Power Supplies 3.3 V
Qualification Status Not Qualified
Speed 50 MHz
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

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