Part Details for XPC850DECZT50B by Freescale Semiconductor
Overview of XPC850DECZT50B by Freescale Semiconductor
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- Part Data Attributes: (Available)
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Part Details for XPC850DECZT50B
XPC850DECZT50B CAD Models
XPC850DECZT50B Part Data Attributes
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XPC850DECZT50B
Freescale Semiconductor
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Datasheet
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XPC850DECZT50B
Freescale Semiconductor
IC,MICROPROCESSOR,32-BIT,CMOS,BGA,256PIN,PLASTIC
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MOTOROLA SEMICONDUCTOR PRODUCTS | |
Package Description | BGA, BGA256,16X16,50 | |
Reach Compliance Code | unknown | |
Bit Size | 32 | |
JESD-30 Code | S-PBGA-B256 | |
JESD-609 Code | e0 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Power Supplies | 3.3 V | |
Qualification Status | Not Qualified | |
Speed | 50 MHz | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |