Datasheets
XM28C040 by:

512KX8 EEPROM 5V MODULE, 300ns, CDIP32, SIDE BRAZED, CERAMIC, MODULE, DIP-32

Part Details for XM28C040 by Intersil Corporation

Overview of XM28C040 by Intersil Corporation

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Applications Consumer Electronics

Part Details for XM28C040

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XM28C040 Part Data Attributes:

XM28C040 Intersil Corporation
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XM28C040 Intersil Corporation 512KX8 EEPROM 5V MODULE, 300ns, CDIP32, SIDE BRAZED, CERAMIC, MODULE, DIP-32
Part Life Cycle Code Obsolete
Ihs Manufacturer INTERSIL CORP
Part Package Code DIP
Package Description DIP,
Pin Count 32
Reach Compliance Code unknown
ECCN Code 3A991.B.1.B.1
HTS Code 8542.32.00.51
Access Time-Max 300 ns
Additional Feature PAGE WRITE
JESD-30 Code R-CDIP-T32
JESD-609 Code e0
Length 40.64 mm
Memory Density 4194304 bit
Memory IC Type EEPROM MODULE
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 512KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Programming Voltage 5 V
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for XM28C040

This table gives cross-reference parts and alternative options found for XM28C040. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XM28C040, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
5962-9309102HXX EEPROM Module, 512KX8, 300ns, Parallel, CMOS, CDIP32, DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32 White Microelectronics XM28C040 vs 5962-9309102HXX
XM28C040M EEPROM Module, 512KX8, 300ns, Parallel, CMOS, CDIP32, SIDE BRAZED, CERAMIC, MODULE, DIP-32 Xicor Inc XM28C040 vs XM28C040M
5962-9309102HXX EEPROM Module, 512KX8, 300ns, Parallel, CMOS, CDIP32, DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32 Microsemi Corporation XM28C040 vs 5962-9309102HXX
XM28C040MHR EEPROM Module, 512KX8, 300ns, Parallel, CMOS, CDIP32, SIDE BRAZED, CERAMIC, MODULE, DIP-32 Xicor Inc XM28C040 vs XM28C040MHR
5962-9309102HXX EEPROM Module, 512KX8, 300ns, Parallel, CMOS, CDIP32, DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32 Mercury Systems Inc XM28C040 vs 5962-9309102HXX
Part Number Description Manufacturer Compare
5962-9309102HXX EEPROM Module, 512KX8, 300ns, Parallel, CMOS, CDIP32, DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32 White Microelectronics XM28C040 vs 5962-9309102HXX
5962-9309102HXX EEPROM Module, 512KX8, 300ns, Parallel, CMOS, CDIP32, DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32 Mercury Systems Inc XM28C040 vs 5962-9309102HXX
XM28C040MHR EEPROM Module, 512KX8, 300ns, Parallel, CMOS, CDIP32, SIDE BRAZED, CERAMIC, MODULE, DIP-32 Xicor Inc XM28C040 vs XM28C040MHR
XM28C040M EEPROM Module, 512KX8, 300ns, Parallel, CMOS, CDIP32, SIDE BRAZED, CERAMIC, MODULE, DIP-32 Xicor Inc XM28C040 vs XM28C040M

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