Part Details for 5962-9309102HXX by Microsemi Corporation
Overview of 5962-9309102HXX by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (5 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Part Details for 5962-9309102HXX
5962-9309102HXX CAD Models
5962-9309102HXX Part Data Attributes:
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5962-9309102HXX
Microsemi Corporation
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5962-9309102HXX
Microsemi Corporation
EEPROM Module, 512KX8, 300ns, Parallel, CMOS, CDIP32, DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 300 ns | |
| Additional Feature | AUTOMATIC WRITE | |
| JESD-30 Code | R-CDIP-T32 | |
| Length | 42.4 mm | |
| Memory Density | 4194304 bit | |
| Memory IC Type | EEPROM MODULE | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 512KX8 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 5 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 6.98 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for 5962-9309102HXX
This table gives cross-reference parts and alternative options found for 5962-9309102HXX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 5962-9309102HXX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| XM28C040I | EEPROM Module, 512KX8, 300ns, Parallel, CMOS, CDIP32, SIDE BRAZED, CERAMIC, MODULE, DIP-32 | Xicor Inc | 5962-9309102HXX vs XM28C040I |
| XM28C040M | EEPROM Module, 512KX8, 300ns, Parallel, CMOS, CDIP32, SIDE BRAZED, CERAMIC, MODULE, DIP-32 | Xicor Inc | 5962-9309102HXX vs XM28C040M |
| XM28C040MHR | EEPROM Module, 512KX8, 300ns, Parallel, CMOS, CDIP32, SIDE BRAZED, CERAMIC, MODULE, DIP-32 | Xicor Inc | 5962-9309102HXX vs XM28C040MHR |
| 5962-9309102HXX | EEPROM Module, 512KX8, 300ns, Parallel, CMOS, CDIP32, DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32 | Mercury Systems Inc | 5962-9309102HXX vs 5962-9309102HXX |
| 5962-9309102HXA | EEPROM Module, 512KX8, 300ns, Parallel, CMOS, CDIP32, DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32 | Microsemi Corporation | 5962-9309102HXX vs 5962-9309102HXA |