XM28C010PI-70
Xicor Inc
Description: EEPROM Module, 32KX32, 70ns, Parallel, CMOS, CPGA66, CERAMIC, PGA-66

Overview of XM28C010PI-70 by Xicor Inc

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Where used in Applications: Computing and Data Storage Financial Technology (Fintech) Telecommunications

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Part Data Attributes for XM28C010PI-70 by Xicor Inc

XM28C010PI-70
Xicor Inc
-
-
Part Life Cycle Code
Obsolete
Ihs Manufacturer
XICOR INC
Package Description
CERAMIC, PGA-66
Reach Compliance Code
unknown
ECCN Code
3A991.B.1.B.2
HTS Code
8542.32.00.51
Access Time-Max
70 ns
Additional Feature
CONFIGURABLE AS 128K X 8
Alternate Memory Width
16
JESD-30 Code
S-CPGA-P66
Length
27.686 mm
Memory Density
1048576 bit
Memory IC Type
EEPROM MODULE
Memory Width
32
Number of Functions
1
Number of Terminals
66
Number of Words
32768 words
Number of Words Code
32000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
32KX32
Output Characteristics
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
Package Shape
SQUARE
Package Style
GRID ARRAY
Parallel/Serial
PARALLEL
Programming Voltage
5 V
Qualification Status
Not Qualified
Seated Height-Max
8.128 mm
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
PIN/PEG
Terminal Pitch
2.54 mm
Terminal Position
PERPENDICULAR
Width
27.686 mm
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  1. XM28C010PI-70
    Xicor Inc
    EEPROM Module, 32KX32, 70ns, Parallel, CMOS, CPGA66, CERAMIC, PGA-66
    VS

Alternate Parts for XM28C010PI-70

This table gives cross-reference parts and alternative options found for XM28C010PI-70. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XM28C010PI-70, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
AS7E32K32P-7XT EEPROM Module, 32KX32, 70ns, Parallel, CMOS, CPGA66, 1.090 X 1.090 INCH, CERAMIC, PGA-66 Micross Components XM28C010PI-70 vs AS7E32K32P-7XT
XM28C010PMHR-70 EEPROM Module, 32KX32, 70ns, Parallel, CMOS, CPGA66, CERAMIC, PGA-66 Xicor Inc XM28C010PI-70 vs XM28C010PMHR-70
Part Number Description Manufacturer Compare
DPV3232V-120I UVPROM Module, 128KX8, 120ns, CMOS, CPGA66, PGA-66 Twilight Technology Inc XM28C010PI-70 vs DPV3232V-120I
DPE3232V-20C EEPROM Module, 128KX8, 200ns, Parallel, CMOS, CPGA66, PGA-66 Twilight Technology Inc XM28C010PI-70 vs DPE3232V-20C
DPZ32X32VA-12M Flash Module, 128KX8, 120ns, CPGA66, CERAMIC, PGA-66 Twilight Technology Inc XM28C010PI-70 vs DPZ32X32VA-12M
PUMA2E1000MB-12 EEPROM Module, 32KX32, 120ns, Parallel, CMOS, CPGA66, CERAMIC, PGA-66 Mosaic Semiconductor Inc XM28C010PI-70 vs PUMA2E1000MB-12
WE32K32N-65H1CA EEPROM Module, 32KX32, 65ns, Parallel, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation XM28C010PI-70 vs WE32K32N-65H1CA
PUMA2E1000I-90 EEPROM Module, 32KX32, 90ns, Parallel, CMOS, CPGA66, CERAMIC, PGA-66 Mosaic Semiconductor Inc XM28C010PI-70 vs PUMA2E1000I-90
WE32K32N-150HI EEPROM Module, 128KX8, 150ns, Parallel, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 White Electronic Designs Corp XM28C010PI-70 vs WE32K32N-150HI
DPZ32X32VA-20C Flash Module, 128KX8, 200ns, CPGA66, CERAMIC, PGA-66 Twilight Technology Inc XM28C010PI-70 vs DPZ32X32VA-20C
DPV3232V-70I UVPROM Module, 128KX8, 70ns, CMOS, CPGA66, PGA-66 Twilight Technology Inc XM28C010PI-70 vs DPV3232V-70I
WE32K32N-90G2Q EEPROM Module, 128KX8, 90ns, Parallel, CMOS, White Microelectronics XM28C010PI-70 vs WE32K32N-90G2Q

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