Part Details for XCV50-4HQ240C by AMD Xilinx
Overview of XCV50-4HQ240C by AMD Xilinx
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- Part Data Attributes: (Available)
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Applications
Industrial Automation
Computing and Data Storage
Part Details for XCV50-4HQ240C
XCV50-4HQ240C CAD Models
XCV50-4HQ240C Part Data Attributes
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XCV50-4HQ240C
AMD Xilinx
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Datasheet
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XCV50-4HQ240C
AMD Xilinx
Field Programmable Gate Array, 384 CLBs, 57906 Gates, 250MHz, PQFP240, HQ240
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | HFQFP, | |
| Pin Count | 240 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Clock Frequency-Max | 250 MHz | |
| Combinatorial Delay of a CLB-Max | 0.8 ns | |
| JESD-30 Code | S-PQFP-G240 | |
| JESD-609 Code | e0 | |
| Length | 32 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 384 | |
| Number of Equivalent Gates | 57906 | |
| Number of Terminals | 240 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 384 CLBS, 57906 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 225 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 4.1 mm | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| Supply Voltage-Nom | 2.5 V | |
| Surface Mount | YES | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 32 mm |