Part Details for XCR3064XL-6CP56I by AMD Xilinx
Overview of XCR3064XL-6CP56I by AMD Xilinx
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Applications
Computing and Data Storage
Part Details for XCR3064XL-6CP56I
XCR3064XL-6CP56I CAD Models
XCR3064XL-6CP56I Part Data Attributes:
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XCR3064XL-6CP56I
AMD Xilinx
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Datasheet
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XCR3064XL-6CP56I
AMD Xilinx
EE PLD, 6ns, CMOS, PBGA56, CHIP SCALE, BGA-56
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | CHIP SCALE, BGA-56 | |
Pin Count | 56 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Clock Frequency-Max | 167 MHz | |
JESD-30 Code | S-PBGA-B56 | |
JESD-609 Code | e0 | |
Length | 6 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 44 | |
Number of Terminals | 56 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 44 I/O | |
Output Function | MACROCELL | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Programmable Logic Type | EE PLD | |
Propagation Delay | 6 ns | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.35 mm | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 2.7 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Width | 6 mm |