Part Details for XCKU100-2FLVD1924E by AMD
Overview of XCKU100-2FLVD1924E by AMD
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Part Details for XCKU100-2FLVD1924E
XCKU100-2FLVD1924E CAD Models
XCKU100-2FLVD1924E Part Data Attributes
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XCKU100-2FLVD1924E
AMD
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Datasheet
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XCKU100-2FLVD1924E
AMD
Field Programmable Gate Array, 4200 CLBs, 958440-Cell, PBGA1924, 45 X 45 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1924
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | 45 X 45 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1924 | |
| Reach Compliance Code | compliant | |
| JESD-30 Code | S-PBGA-B1924 | |
| JESD-609 Code | e1 | |
| Length | 45 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of CLBs | 4200 | |
| Number of Inputs | 832 | |
| Number of Logic Cells | 958440 | |
| Number of Outputs | 832 | |
| Number of Terminals | 1924 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | ||
| Organization | 4200 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1924,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 245 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Seated Height-Max | 4.13 mm | |
| Supply Voltage-Max | 0.979 V | |
| Supply Voltage-Min | 0.922 V | |
| Supply Voltage-Nom | 0.95 V | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 45 mm |