Programmable Logic Field Programmable Gate Arrays XC7K325T-L2FFG900E

XC7K325T-L2FFG900E by

Description: Field Programmable Gate Array, 25475 CLBs, 326080-Cell, CMOS, PBGA900,

Overview of XC7K325T-L2FFG900E by AMD

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Part #	Manufacturer	Description	Stock	Price	Buy
XC7K325T-L2FFG900E DISTI # 47AC6522	Newark	Fpga, Kintex-7 , 350 I/O, Fcbga-900, No. Of Logic Blocks:50950, No. Of Macrocells:326080, Fpga Family:Kintex-7, Logic Case Style:Fcbga, No. Of Pins:900Pins, No. Of Speed Grades:-, Total Ram Bits:16020Kbit, No. Of I/O S:350I/O S, Rohs Compliant: Yes \|Amd XC7K325T-L2FFG900E RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk	0	1 $3,067.2700	$3,067.2700	Buy Now
XC7K325T-L2FFG900E DISTI # XC7K325T-L2FFG900E-ND	DigiKey	IC FPGA 500 I/O 900FCBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray	Temporarily Out of Stock	1 $3,117.5000	$3,117.5000	Buy Now
XC7K325T-L2FFG900E DISTI # 217-C7K325TL2FFG900E	Mouser Electronics	FPGA - Field Programmable Gate Array XC7K325T-L2FFG900E RoHS: Compliant	0	1 $3,067.2700	$3,067.2700	Order Now
XC7K325T-L2FFG900E DISTI # XC7K325T-L2FFG900E	Avnet Asia	FPGA Kintex-7 Family 326080 Cells 28nm Technology 1V 900-Pin FC-BGA (Alt: XC7K325T-L2FFG900E) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days	0	1 $3,281.5789 2 $3,238.9610 3 $3,197.4358 5 $3,156.9620 10 $3,079.0125 25 $3,004.8193 50 $2,934.1177	$2,934.1177 / $3,281.5789	Buy Now

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Show differences only	XC7K325T-L2FFG900E AMD Buy Now	part-to-be-compared AMD Buy Now
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Rohs Code	Yes
Part Life Cycle Code	Contact Manufacturer
Ihs Manufacturer	ADVANCED MICRO DEVICES INC
Reach Compliance Code	compliant
Factory Lead Time	16 Weeks
Samacsys Manufacturer	AMD
Additional Feature	ALSO OPERATES AT 1 V SUPPLY
Clock Frequency-Max	1286 MHz
Combinatorial Delay of a CLB-Max	0.37 ns
JESD-30 Code	S-PBGA-B900
JESD-609 Code	e1
Length	31 mm
Moisture Sensitivity Level	4
Number of CLBs	25475
Number of Inputs	500
Number of Logic Cells	326080
Number of Outputs	500
Number of Terminals	900
Operating Temperature-Max	100 °C
Operating Temperature-Min
Organization	25475 CLBS
Package Body Material	PLASTIC/EPOXY
Package Code	BGA
Package Equivalence Code	BGA900,30X30,40
Package Shape	SQUARE
Package Style	GRID ARRAY
Peak Reflow Temperature (Cel)	245
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified
Seated Height-Max	3.35 mm
Supply Voltage-Max	0.93 V
Supply Voltage-Min	0.87 V
Supply Voltage-Nom	0.9 V
Surface Mount	YES
Technology	CMOS
Terminal Finish	TIN SILVER COPPER
Terminal Form	BALL
Terminal Pitch	1 mm
Terminal Position	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30
Width	31 mm

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