Datasheets
XC3S200-4FTG256C by:

Field Programmable Gate Array, 480 CLBs, 200000 Gates, 630MHz, 4320-Cell, CMOS, PBGA256, 17 X 17 MM, LEAD FREE, FTBGA-256

Part Details for XC3S200-4FTG256C by AMD

Overview of XC3S200-4FTG256C by AMD

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Price & Stock for XC3S200-4FTG256C

Part # Distributor Description Stock Price Buy
DISTI # 122-1338-ND
DigiKey IC FPGA 173 I/O 256FTBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray 2876
In Stock
  • 1 $60.4400
$60.4400 Buy Now
Bristol Electronics   4
RFQ

Part Details for XC3S200-4FTG256C

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XC3S200-4FTG256C Part Data Attributes

XC3S200-4FTG256C AMD
Buy Now Datasheet
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XC3S200-4FTG256C AMD Field Programmable Gate Array, 480 CLBs, 200000 Gates, 630MHz, 4320-Cell, CMOS, PBGA256, 17 X 17 MM, LEAD FREE, FTBGA-256
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Package Description 17 X 17 MM, LEAD FREE, FTBGA-256
Reach Compliance Code compliant
Samacsys Manufacturer AMD
Clock Frequency-Max 630 MHz
Combinatorial Delay of a CLB-Max 0.61 ns
JESD-30 Code S-PBGA-B256
JESD-609 Code e1
Length 17 mm
Moisture Sensitivity Level 3
Number of CLBs 480
Number of Equivalent Gates 200000
Number of Inputs 173
Number of Logic Cells 4320
Number of Outputs 173
Number of Terminals 256
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 480 CLBS, 200000 GATES
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 1.55 mm
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 17 mm

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