Part Details for XC3S1200E-4FGG320I by AMD Xilinx
Overview of XC3S1200E-4FGG320I by AMD Xilinx
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Price & Stock for XC3S1200E-4FGG320I
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
|
Chip 1 Exchange | INSTOCK | 585 |
|
RFQ | |
|
|
Sense Electronic Company Limited | BGA@ | 579 |
|
RFQ |
Part Details for XC3S1200E-4FGG320I
XC3S1200E-4FGG320I CAD Models
XC3S1200E-4FGG320I Part Data Attributes
|
|
XC3S1200E-4FGG320I
AMD Xilinx
Buy Now
Datasheet
|
Compare Parts:
XC3S1200E-4FGG320I
AMD Xilinx
Field Programmable Gate Array, 2168 CLBs, 1200000 Gates, 572MHz, 19512-Cell, CMOS, PBGA320, 19 X 19 MM, 2 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-320
|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-320 | |
| Pin Count | 320 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 52 Weeks | |
| Clock Frequency-Max | 572 MHz | |
| Combinatorial Delay of a CLB-Max | 0.76 ns | |
| JESD-30 Code | S-PBGA-B320 | |
| JESD-609 Code | e1 | |
| Length | 19 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 2168 | |
| Number of Equivalent Gates | 1200000 | |
| Number of Inputs | 250 | |
| Number of Logic Cells | 19512 | |
| Number of Outputs | 194 | |
| Number of Terminals | 320 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 2168 CLBS, 1200000 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA320,18X18,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 19 mm |
Alternate Parts for XC3S1200E-4FGG320I
This table gives cross-reference parts and alternative options found for XC3S1200E-4FGG320I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC3S1200E-4FGG320I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| XC3S1200E-4FG320I | Field Programmable Gate Array, 2168 CLBs, 1200000 Gates, 572MHz, 19512-Cell, CMOS, PBGA320, 19 X 19 MM, 2 MM HEIGHT, 1 MM PITCH, FBGA-320 | AMD Xilinx | XC3S1200E-4FGG320I vs XC3S1200E-4FG320I |