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XC3S1200E-4FGG320I vs XC3S1200E-5FG320C feature comparison

XC3S1200E-4FGG320I AMD Xilinx

Buy Now Datasheet

XC3S1200E-5FG320C AMD Xilinx

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FBGA-320 FBGA-320
Pin Count 320 320
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 52 Weeks 52 Weeks
Clock Frequency-Max 572 MHz 657 MHz
Combinatorial Delay of a CLB-Max 0.76 ns 0.66 ns
JESD-30 Code S-PBGA-B320 S-PBGA-B320
JESD-609 Code e1 e0
Length 19 mm 19 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2168 2168
Number of Equivalent Gates 1200000 1200000
Number of Inputs 250 250
Number of Logic Cells 19512 19512
Number of Outputs 194 194
Number of Terminals 320 320
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 2168 CLBS, 1200000 GATES 2168 CLBS, 1200000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA320,18X18,40 BGA320,18X18,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 2 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 19 mm 19 mm
Base Number Matches 2 2
Programmable Logic » Field Programmable Gate Arrays
Programmable Logic » Field Programmable Gate Arrays

Compare XC3S1200E-4FGG320I with alternatives

Compare XC3S1200E-5FG320C with alternatives