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Part Details for XA7S100-1FGGA676Q by AMD
Overview of XA7S100-1FGGA676Q by AMD
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for XA7S100-1FGGA676Q
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
122-XA7S100-1FGGA676Q-ND
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DigiKey | IC FPGA 400 I/O 676FBGA Min Qty: 2 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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$188.5000 | Buy Now |
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DISTI #
XA7S100-1FGGA676Q
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Avnet Americas | FPGA Spartan-7 102400 Logic Cells 676-Ball BGA - Trays (Alt: XA7S100-1FGGA676Q) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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$183.4250 | Buy Now |
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DISTI #
217-A7S100-1FGGA676Q
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Mouser Electronics | FPGA - Field Programmable Gate Array XA7S100-1FGGA676Q RoHS: Compliant | 0 |
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$188.4800 | Order Now |
Part Details for XA7S100-1FGGA676Q
XA7S100-1FGGA676Q CAD Models
XA7S100-1FGGA676Q Part Data Attributes
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XA7S100-1FGGA676Q
AMD
Buy Now
Datasheet
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Compare Parts:
XA7S100-1FGGA676Q
AMD
Field Programmable Gate Array, 102400-Cell, PBGA676, FPBGA-676
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | FPBGA-676 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 16 Weeks | |
| Samacsys Manufacturer | AMD | |
| Combinatorial Delay of a CLB-Max | 1.27 ns | |
| JESD-30 Code | S-PBGA-B676 | |
| Length | 27 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 8000 | |
| Number of Inputs | 400 | |
| Number of Logic Cells | 102400 | |
| Number of Outputs | 400 | |
| Number of Terminals | 676 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 8000 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 250 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Screening Level | AEC-Q100; TS 16949 | |
| Seated Height-Max | 2.44 mm | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | HKMG | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 27 mm |