Datasheets
WS57C010F-70DMB by: Teledyne e2v

UVPROM, 128KX8, 70ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32

Part Details for WS57C010F-70DMB by Teledyne e2v

Overview of WS57C010F-70DMB by Teledyne e2v

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Applications Industrial Automation Computing and Data Storage Financial Technology (Fintech) Telecommunications Renewable Energy Robotics and Drones

Price & Stock for WS57C010F-70DMB

Part # Distributor Description Stock Price Buy
DISTI # WS57C010F-70DMB
Avnet Americas PROM, UV ERASABLE, 128K X 8, 70 NS ACCES - Rail/Tube (Alt: WS57C010F-70DMB) Min Qty: 250 Package Multiple: 1 Container: Tube 0
RFQ

Part Details for WS57C010F-70DMB

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WS57C010F-70DMB Part Data Attributes

WS57C010F-70DMB Teledyne e2v
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WS57C010F-70DMB Teledyne e2v UVPROM, 128KX8, 70ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32
Part Life Cycle Code Active
Ihs Manufacturer TELEDYNE E2V (UK) LTD
Part Package Code DIP
Package Description 0.600 INCH, CERAMIC, DIP-32
Pin Count 32
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 70 ns
JESD-30 Code R-CDIP-T32
Memory Density 1048576 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Organization 128KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level MIL-STD-883 Class C
Supply Current-Max 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for WS57C010F-70DMB

This table gives cross-reference parts and alternative options found for WS57C010F-70DMB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WS57C010F-70DMB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
CY27C010-70WMB UVPROM, 128KX8, 70ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-32 Rochester Electronics LLC WS57C010F-70DMB vs CY27C010-70WMB
5962-8961413QXX UVPROM, 128KX8, 70ns, CMOS, CDIP32, CERAMIC, DIP-32 Cypress Semiconductor WS57C010F-70DMB vs 5962-8961413QXX
FT27C010-70DI UVPROM, 128KX8, 70ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIL-32 Force Technologies Ltd WS57C010F-70DMB vs FT27C010-70DI
5962-8961413MXA UVPROM, 128KX8, 70ns, CMOS, CDIP32, CERAMIC, DIP-32 QP Semiconductor WS57C010F-70DMB vs 5962-8961413MXA
5962-8961408MXA UVPROM, 128KX8, 70ns, CMOS, CDIP32, CERAMIC, DIP-32 Teledyne e2v WS57C010F-70DMB vs 5962-8961408MXA
CY27C010-70WMB UVPROM, 128KX8, 70ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-32 Cypress Semiconductor WS57C010F-70DMB vs CY27C010-70WMB
FT27C010-70DC UVPROM, 128KX8, 70ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIL-32 Force Technologies Ltd WS57C010F-70DMB vs FT27C010-70DC
27CX010W-70 UVPROM, 128KX8, 70ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 Integrated Circuit Technology Corp WS57C010F-70DMB vs 27CX010W-70
WS57C010F-70D UVPROM, 128KX8, 70ns, CMOS, CDIP32, Waferscale Integration Inc WS57C010F-70DMB vs WS57C010F-70D
59628961413QXX 128KX8 UVPROM, 70ns, CDIP32, CERAMIC, DIP-32 Cypress Semiconductor WS57C010F-70DMB vs 59628961413QXX
Part Number Description Manufacturer Compare
5962-8961413MXX UVPROM, 128KX8, 70ns, CMOS, CDIP32, CERAMIC, DIP-32 Teledyne e2v WS57C010F-70DMB vs 5962-8961413MXX
FM27C010Q70 UVPROM, 128KX8, 70ns, CMOS, CDIP32, WINDOWED, CERDIP-32 Fairchild Semiconductor Corporation WS57C010F-70DMB vs FM27C010Q70
AM27C010-70DI UVPROM, 128KX8, 70ns, CMOS, CDIP32, CERAMIC, DIP-32 Spansion WS57C010F-70DMB vs AM27C010-70DI
AM27C010-70DCB UVPROM, 128KX8, 70ns, CMOS, CDIP32, CERAMIC, DIP-32 Spansion WS57C010F-70DMB vs AM27C010-70DCB
AM27H010-70DCB UVPROM, 128KX8, 70ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 AMD WS57C010F-70DMB vs AM27H010-70DCB
IS27HC010-70CWI UVPROM, 128KX8, 70ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 Integrated Silicon Solution Inc WS57C010F-70DMB vs IS27HC010-70CWI
CY27C010-70WMB UVPROM, 128KX8, 70ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-32 Rochester Electronics LLC WS57C010F-70DMB vs CY27C010-70WMB
AM27H010-70DE UVPROM, 128KX8, 70ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 AMD WS57C010F-70DMB vs AM27H010-70DE
AM27H010-70DC UVPROM, 128KX8, 70ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 AMD WS57C010F-70DMB vs AM27H010-70DC
59628961413QXX 128KX8 UVPROM, 70ns, CDIP32, CERAMIC, DIP-32 Cypress Semiconductor WS57C010F-70DMB vs 59628961413QXX

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